5477 pdf Datasheet P9 Part Num --- IC-ON-LINE


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5477 Datasheet PDF File

For 5477 Found Datasheets File :: 141+ Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | <9> | 10 | 11 | 12 | 13 | 14 | 15 |

					Molex Electronics Ltd.
Part No.	015-47-7518 0015477518 A-70568-0007
Description	2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 18 Circuits, Tin (Sn) Plating 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 18 Circuits, Tin (Sn) Plating 2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 18 Circuits, Tin (Sn) Plating
File Size	377.43K / 4 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	54776-105-26LF
Description	BergStik®, Board to Board connector, Unshrouded Vertical Stacking Header, Through Hole, Double row , Double body, Triplex, 26 Positions, 2.54mm (0.100in) Pitch
Tech specs				Official Product Page

HUA FENG CIRCUIT

					Molex Electronics Ltd.
Part No.	15-47-7508 0015477508 A-70568-0002
Description	2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 8 Circuits, Tin (Sn) Plating 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 8 Circuits, Tin (Sn) Plating Molex Electronics Ltd.
File Size	377.49K / 4 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	54775-602-36LF
Description	BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Header,Through Hole, Double Row, 36 Positions, 2.54mm (0.100in) Pitch.
Tech specs				Official Product Page

					Molex Electronics Ltd.
Part No.	15-47-7512 0015477512 A-70568-0004
Description	2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 12 Circuits 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 12 Circuits 2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 12 Circuits
File Size	377.43K / 4 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	54776-102-36LF
Description	BergStik®, Board to Board connector, Unshrouded Vertical Stacking Header, Through Hole, Double row , Double body, Triplex, 36 Positions, 2.54mm (0.100in) Pitch
Tech specs				Official Product Page

					Molex Electronics Ltd.
Part No.	15-47-7514 0015477514 A-70568-0005
Description	2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 14 Circuits, Tin (Sn) Plating 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 14 Circuits, Tin (Sn) Plating 2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 14 Circuits, Tin (Sn) Plating
File Size	377.43K / 4 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	54776-604-20LF
Description	BergStik®, Board to Board connector, Unshrouded Vertical Stacking Header, Through Hole, Double row , Double body, Triplex, 20 Positions, 2.54mm (0.100in) Pitch
Tech specs				Official Product Page

					Molex Electronics Ltd.
Part No.	15-47-7516 0015477516 A-70568-0006
Description	2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 16 Circuits, Tin (Sn) Plating 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 16 Circuits, Tin (Sn) Plating 2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 16 Circuits, Tin (Sn) Plating
File Size	377.48K / 4 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	54776-706-50LF
Description	BERGSTIK DB DR
Tech specs				Official Product Page

					Molex Electronics Ltd.
Part No.	15-47-7520 0015477520 A-70568-0008
Description	2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 20 Circuits, Tin (Sn) Plating 2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 20 Circuits, Tin (Sn) Plating
File Size	377.43K / 4 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	54775-102-30LF
Description	BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Header,Through Hole, Double Row, 30 Positions, 2.54mm (0.100in) Pitch.
Tech specs				Official Product Page

					Molex Electronics Ltd.
Part No.	15-47-7522 0015477522 A-70568-0009
Description	2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 22 Circuits, Tin (Sn) Plating 2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 22 Circuits, Tin (Sn) Plating
File Size	377.43K / 4 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	54776-117-20LF
Description	BergStik<sup>®<sup>, Board to Board connector, 2.54mm (0.100in), Unshrouded vertical stacking Header, Through Hole, Double Body, Triplex, Double Row, 20 Positions
Tech specs				Official Product Page

					TE Connectivity Ltd
Part No.	1055477-1 1055474-1 1055441-1 1055476-1 1055440-1 1055439-1
Description	Solder Assembly Kit
File Size	113.48K / 3 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	54776-106-40LF
Description	BergStik®, Board to Board connector, Unshrouded Vertical Stacking Header, Through Hole, Double row , Double body, Triplex, 40 Positions, 2.54mm (0.100in) Pitch
Tech specs				Official Product Page

					Maxim Integrated Products Maxim Integrated Produc...
Part No.	MAX547706 MAX5477EUD
Description	Dual, 256-Tap, Nonvolatile, I2C-Interface, Digital Potentiometers Dual, 256-Tap, Nonvolatile, I2C-Interface, Digital Potentiometers
File Size	711.15K / 17 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	54776-108-16LF
Description	BergStik®, Board to Board connector, Unshrouded Vertical Stacking Header, Through Hole, Double row , Double body, Triplex, 16 Positions, 2.54mm (0.100in) Pitch
Tech specs				Official Product Page

					QT[QT Optoelectronics]
Part No.	MV5377C MV5777C MV5077C MV5477C
Description	LOW PROFILE T-1 SOLID STATE LAMPS
File Size	255.29K / 3 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	54776-113-06LF
Description	BergStik®, Board to Board connector, Unshrouded Vertical Stacking Header, Through Hole, Double row , Double body, Triplex, 6 Positions, 2.54mm (0.100in) Pitch
Tech specs				Official Product Page

For 5477 Found Datasheets File :: 141+ Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | <9> | 10 | 11 | 12 | 13 | 14 | 15 |

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