5477 pdf Datasheet P7 Part Num --- IC-ON-LINE


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5477 Datasheet PDF File

For 5477 Found Datasheets File :: 141+ Page :: | 1 | 2 | 3 | 4 | 5 | 6 | <7> | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |

					Molex Electronics Ltd.
Part No.	0015477646
Description	2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 46 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
File Size	377.39K / 4 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	54776-105-26LF
Description	BergStik®, Board to Board connector, Unshrouded Vertical Stacking Header, Through Hole, Double row , Double body, Triplex, 26 Positions, 2.54mm (0.100in) Pitch
Tech specs				Official Product Page

HUA FENG CIRCUIT

					Molex Electronics Ltd.
Part No.	0015477642
Description	2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 42 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
File Size	377.32K / 4 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	54775-602-36LF
Description	BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Header,Through Hole, Double Row, 36 Positions, 2.54mm (0.100in) Pitch.
Tech specs				Official Product Page

					Molex Electronics Ltd.
Part No.	0015477644
Description	2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 44 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
File Size	377.32K / 4 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	54776-102-36LF
Description	BergStik®, Board to Board connector, Unshrouded Vertical Stacking Header, Through Hole, Double row , Double body, Triplex, 36 Positions, 2.54mm (0.100in) Pitch
Tech specs				Official Product Page

					Molex Electronics Ltd.
Part No.	0015477640
Description	2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 40 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
File Size	377.39K / 4 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	54776-604-20LF
Description	BergStik®, Board to Board connector, Unshrouded Vertical Stacking Header, Through Hole, Double row , Double body, Triplex, 20 Positions, 2.54mm (0.100in) Pitch
Tech specs				Official Product Page

					Molex Electronics Ltd.
Part No.	0015477550
Description	MOLEX Connector
File Size	377.42K / 4 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	54776-706-50LF
Description	BERGSTIK DB DR
Tech specs				Official Product Page

					http:// Molex Electronics Ltd.
Part No.	0354779002 35477-9002
Description	Wedge Terminal 14.50mm (0.57) Pitch Wedge Terminal 14.50mm (0.57") Pitch
File Size	101.20K / 3 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	54775-102-30LF
Description	BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Header,Through Hole, Double Row, 30 Positions, 2.54mm (0.100in) Pitch.
Tech specs				Official Product Page

					Molex Electronics Ltd.
Part No.	0015477558
Description	MOLEX Connector
File Size	377.50K / 4 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	54776-117-20LF
Description	BergStik<sup>®<sup>, Board to Board connector, 2.54mm (0.100in), Unshrouded vertical stacking Header, Through Hole, Double Body, Triplex, Double Row, 20 Positions
Tech specs				Official Product Page

					Molex Electronics Ltd.
Part No.	0015477556
Description	MOLEX Connector
File Size	377.42K / 4 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	54776-106-40LF
Description	BergStik®, Board to Board connector, Unshrouded Vertical Stacking Header, Through Hole, Double row , Double body, Triplex, 40 Positions, 2.54mm (0.100in) Pitch
Tech specs				Official Product Page

					Molex Electronics Ltd.
Part No.	0015477554
Description	2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 54 Circuits, Tin (Sn) Plating
File Size	377.43K / 4 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	54776-108-16LF
Description	BergStik®, Board to Board connector, Unshrouded Vertical Stacking Header, Through Hole, Double row , Double body, Triplex, 16 Positions, 2.54mm (0.100in) Pitch
Tech specs				Official Product Page

					Molex Electronics Ltd.
Part No.	0015477552
Description	MOLEX Connector
File Size	377.50K / 4 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	54776-113-06LF
Description	BergStik®, Board to Board connector, Unshrouded Vertical Stacking Header, Through Hole, Double row , Double body, Triplex, 6 Positions, 2.54mm (0.100in) Pitch
Tech specs				Official Product Page

For 5477 Found Datasheets File :: 141+ Page :: | 1 | 2 | 3 | 4 | 5 | 6 | <7> | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |

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