Part Number Hot Search : 
BYG10K US6K21 17529EV AD600J E003172 00101 2SA1647 1N744DO7
Product Description
Full Text Search
  5477 Datasheet PDF File

For 5477 Found Datasheets File :: 141+       Page :: | 1 | 2 | 3 | <4> | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    15-47-7736 0015477736

Molex Electronics Ltd.
Part No. 15-47-7736 0015477736
Description 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 36 Circuits, 0.76渭m (30渭) Gold (Au) Selective Platin
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 36 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 377.32K  /  4 Page

View it Online

Download Datasheet

   

Amphenol Communications Solutions

Part No. 54776-105-26LF
Description BergStik®, Board to Board connector, Unshrouded Vertical Stacking Header, Through Hole, Double row , Double body, Triplex, 26 Positions, 2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    15-47-7734 0015477734

Molex Electronics Ltd.
Part No. 15-47-7734 0015477734
Description 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 34 Circuits, 0.76渭m (30渭) Gold (Au) Selective Platin
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 34 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 377.39K  /  4 Page

View it Online

Download Datasheet

   

Amphenol Communications Solutions

Part No. 54775-602-36LF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Header,Through Hole, Double Row, 36 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    15-47-7732 0015477732

Molex Electronics Ltd.
Part No. 15-47-7732 0015477732
Description 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 32 Circuits, 0.76渭m (30渭) Gold (Au) Selective Platin
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 32 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 377.32K  /  4 Page

View it Online

Download Datasheet

   

Amphenol Communications Solutions

Part No. 54776-102-36LF
Description BergStik®, Board to Board connector, Unshrouded Vertical Stacking Header, Through Hole, Double row , Double body, Triplex, 36 Positions, 2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

    15-47-7730 0015477730

Molex Electronics Ltd.
Part No. 15-47-7730 0015477730
Description 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 30 Circuits

File Size 377.38K  /  4 Page

View it Online

Download Datasheet

   

Amphenol Communications Solutions

Part No. 54776-604-20LF
Description BergStik®, Board to Board connector, Unshrouded Vertical Stacking Header, Through Hole, Double row , Double body, Triplex, 20 Positions, 2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

    15-47-7532 0015477532

http://
Molex Electronics Ltd.
Part No. 15-47-7532 0015477532
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 32 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 32 Circuits, Tin (Sn) Plating

File Size 377.43K  /  4 Page

View it Online

Download Datasheet

   

Amphenol Communications Solutions

Part No. 54776-706-50LF
Description BERGSTIK DB DR
Tech specs    

Official Product Page

    15-47-7738 0015477738

Molex Electronics Ltd.
Part No. 15-47-7738 0015477738
Description 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 38 Circuits

File Size 377.32K  /  4 Page

View it Online

Download Datasheet

   

Amphenol Communications Solutions

Part No. 54775-102-30LF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Header,Through Hole, Double Row, 30 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0015477616

Molex Electronics Ltd.
Part No. 0015477616
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 16 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

File Size 377.32K  /  4 Page

View it Online

Download Datasheet

   

Amphenol Communications Solutions

Part No. 54776-117-20LF
Description BergStik<sup>®<sup>, Board to Board connector, 2.54mm (0.100in), Unshrouded vertical stacking Header, Through Hole, Double Body, Triplex, Double Row, 20 Positions
Tech specs    

Official Product Page

    0015477530-17

Molex Electronics Ltd.
Part No. 0015477530-17
Description    2.54mm Pitch C-Grid Header, Through Hole, Dual Row, Vertical, High Temperature

File Size 20.38K  /  2 Page

View it Online

Download Datasheet

   

Amphenol Communications Solutions

Part No. 54776-106-40LF
Description BergStik®, Board to Board connector, Unshrouded Vertical Stacking Header, Through Hole, Double row , Double body, Triplex, 40 Positions, 2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

    0015477566

Molex Electronics Ltd.
Part No. 0015477566
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 66 Circuits, Tin (Sn) Plating

File Size 377.28K  /  4 Page

View it Online

Download Datasheet

   

Amphenol Communications Solutions

Part No. 54776-108-16LF
Description BergStik®, Board to Board connector, Unshrouded Vertical Stacking Header, Through Hole, Double row , Double body, Triplex, 16 Positions, 2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

    0015477568

Molex Electronics Ltd.
Part No. 0015477568
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 68 Circuits, Tin (Sn) Plating

File Size 377.28K  /  4 Page

View it Online

Download Datasheet

   

Amphenol Communications Solutions

Part No. 54776-113-06LF
Description BergStik®, Board to Board connector, Unshrouded Vertical Stacking Header, Through Hole, Double row , Double body, Triplex, 6 Positions, 2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

For 5477 Found Datasheets File :: 141+       Page :: | 1 | 2 | 3 | <4> | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

▲Up To Search▲

 



Bom2Buy.com




Price and Availability



JITONG TECHNOLOGY
(CHINA HK & SZ)
Datasheet.hk's Sponsor

Part: 547EI-A1
Maker: N/A
Pack: N/A
Stock: 381
Unit price for :
    50: $31.02
  100: $29.46
1000: $27.91

Email: oulindz@gmail.com

Contact us

 
Price & Availability of 5477

All Rights Reserved © IC-ON-LINE 2003 - 2022  

[Add Bookmark] [Contact Us] [Link exchange] [Privacy policy]
Mirror Sites :  [www.datasheet.hk]   [www.maxim4u.com]  [www.ic-on-line.cn] [www.ic-on-line.com] [www.ic-on-line.net] [www.alldatasheet.com.cn] [www.gdcy.com]  [www.gdcy.net]


 . . . . .
  We use cookies to deliver the best possible web experience and assist with our advertising efforts. By continuing to use this site, you consent to the use of cookies. For more information on cookies, please take a look at our Privacy Policy. X
0.12227296829224