5477 pdf Datasheet P6 Part Num --- IC-ON-LINE


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5477 Datasheet PDF File

For 5477 Found Datasheets File :: 141+ Page :: | 1 | 2 | 3 | 4 | 5 | <6> | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |

					Molex Electronics Ltd.
Part No.	0015477628
Description	2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 28 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
File Size	377.32K / 4 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	54776-105-26LF
Description	BergStik®, Board to Board connector, Unshrouded Vertical Stacking Header, Through Hole, Double row , Double body, Triplex, 26 Positions, 2.54mm (0.100in) Pitch
Tech specs				Official Product Page

HUA FENG CIRCUIT

					Molex Electronics Ltd.
Part No.	0015477614
Description	2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 14 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
File Size	377.32K / 4 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	54775-602-36LF
Description	BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Header,Through Hole, Double Row, 36 Positions, 2.54mm (0.100in) Pitch.
Tech specs				Official Product Page

					Molex Electronics Ltd.
Part No.	0015477612
Description	2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 12 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
File Size	377.39K / 4 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	54776-102-36LF
Description	BergStik®, Board to Board connector, Unshrouded Vertical Stacking Header, Through Hole, Double row , Double body, Triplex, 36 Positions, 2.54mm (0.100in) Pitch
Tech specs				Official Product Page

					Molex Electronics Ltd.
Part No.	0015477606
Description	2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 6 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
File Size	377.32K / 4 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	54776-604-20LF
Description	BergStik®, Board to Board connector, Unshrouded Vertical Stacking Header, Through Hole, Double row , Double body, Triplex, 20 Positions, 2.54mm (0.100in) Pitch
Tech specs				Official Product Page

					Molex Electronics Ltd.
Part No.	0015477658
Description	2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 58 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
File Size	377.32K / 4 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	54776-706-50LF
Description	BERGSTIK DB DR
Tech specs				Official Product Page

					Molex Electronics Ltd.
Part No.	0015477656
Description	2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 56 Circuits
File Size	377.32K / 4 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	54775-102-30LF
Description	BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Header,Through Hole, Double Row, 30 Positions, 2.54mm (0.100in) Pitch.
Tech specs				Official Product Page

					Molex Electronics Ltd.
Part No.	0015477654
Description	2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 54 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
File Size	377.39K / 4 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	54776-117-20LF
Description	BergStik<sup>®<sup>, Board to Board connector, 2.54mm (0.100in), Unshrouded vertical stacking Header, Through Hole, Double Body, Triplex, Double Row, 20 Positions
Tech specs				Official Product Page

					Molex Electronics Ltd.
Part No.	0015477648
Description	2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 48 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
File Size	377.32K / 4 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	54776-106-40LF
Description	BergStik®, Board to Board connector, Unshrouded Vertical Stacking Header, Through Hole, Double row , Double body, Triplex, 40 Positions, 2.54mm (0.100in) Pitch
Tech specs				Official Product Page

					Molex Electronics Ltd.
Part No.	0015477652
Description	2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 52 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
File Size	377.32K / 4 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	54776-108-16LF
Description	BergStik®, Board to Board connector, Unshrouded Vertical Stacking Header, Through Hole, Double row , Double body, Triplex, 16 Positions, 2.54mm (0.100in) Pitch
Tech specs				Official Product Page

					Molex Electronics Ltd.
Part No.	0015477650
Description	2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 50 Circuits, 0.38μm (15μ) Gold (Au) Selective
File Size	377.32K / 4 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	54776-113-06LF
Description	BergStik®, Board to Board connector, Unshrouded Vertical Stacking Header, Through Hole, Double row , Double body, Triplex, 6 Positions, 2.54mm (0.100in) Pitch
Tech specs				Official Product Page

For 5477 Found Datasheets File :: 141+ Page :: | 1 | 2 | 3 | 4 | 5 | <6> | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |

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