5477 pdf Datasheet P5 Part Num --- IC-ON-LINE


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5477 Datasheet PDF File

For 5477 Found Datasheets File :: 141+ Page :: | 1 | 2 | 3 | 4 | <5> | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |

					Molex Electronics Ltd.
Part No.	0015477664
Description	2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 64 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
File Size	377.32K / 4 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	54776-105-26LF
Description	BergStik®, Board to Board connector, Unshrouded Vertical Stacking Header, Through Hole, Double row , Double body, Triplex, 26 Positions, 2.54mm (0.100in) Pitch
Tech specs				Official Product Page

HUA FENG CIRCUIT

					Molex Electronics Ltd.
Part No.	0015477666
Description	2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 66 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
File Size	377.32K / 4 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	54775-602-36LF
Description	BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Header,Through Hole, Double Row, 36 Positions, 2.54mm (0.100in) Pitch.
Tech specs				Official Product Page

					Molex Electronics Ltd.
Part No.	0015477662 15-47-7662
Description	2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 62 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
File Size	377.39K / 4 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	54776-102-36LF
Description	BergStik®, Board to Board connector, Unshrouded Vertical Stacking Header, Through Hole, Double row , Double body, Triplex, 36 Positions, 2.54mm (0.100in) Pitch
Tech specs				Official Product Page

					Molex Electronics Ltd.
Part No.	0015477762
Description	2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 62 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
File Size	377.32K / 4 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	54776-604-20LF
Description	BergStik®, Board to Board connector, Unshrouded Vertical Stacking Header, Through Hole, Double row , Double body, Triplex, 20 Positions, 2.54mm (0.100in) Pitch
Tech specs				Official Product Page

					Molex Electronics Ltd.
Part No.	0015477672 15-47-7672
Description	2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 72 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
File Size	377.32K / 4 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	54776-706-50LF
Description	BERGSTIK DB DR
Tech specs				Official Product Page

					Molex Electronics Ltd.
Part No.	0015477764
Description	2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 64 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
File Size	377.32K / 4 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	54775-102-30LF
Description	BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Header,Through Hole, Double Row, 30 Positions, 2.54mm (0.100in) Pitch.
Tech specs				Official Product Page

					Molex Electronics Ltd.
Part No.	0015477570
Description	2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 70 Circuits, Tin (Sn) Plating
File Size	377.35K / 4 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	54776-117-20LF
Description	BergStik<sup>®<sup>, Board to Board connector, 2.54mm (0.100in), Unshrouded vertical stacking Header, Through Hole, Double Body, Triplex, Double Row, 20 Positions
Tech specs				Official Product Page

					Molex Electronics Ltd.
Part No.	0015477572
Description	2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 72 Circuits, Tin (Sn) Plating
File Size	377.35K / 4 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	54776-106-40LF
Description	BergStik®, Board to Board connector, Unshrouded Vertical Stacking Header, Through Hole, Double row , Double body, Triplex, 40 Positions, 2.54mm (0.100in) Pitch
Tech specs				Official Product Page

					Molex Electronics Ltd.
Part No.	0015477660
Description	2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 60 Circuits, 0.38μm (15μ) Gold (Au) Selective
File Size	377.32K / 4 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	54776-108-16LF
Description	BergStik®, Board to Board connector, Unshrouded Vertical Stacking Header, Through Hole, Double row , Double body, Triplex, 16 Positions, 2.54mm (0.100in) Pitch
Tech specs				Official Product Page

					Molex Electronics Ltd.
Part No.	0015477618
Description	2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 18 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
File Size	377.39K / 4 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	54776-113-06LF
Description	BergStik®, Board to Board connector, Unshrouded Vertical Stacking Header, Through Hole, Double row , Double body, Triplex, 6 Positions, 2.54mm (0.100in) Pitch
Tech specs				Official Product Page

For 5477 Found Datasheets File :: 141+ Page :: | 1 | 2 | 3 | 4 | <5> | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |

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