5477 pdf Datasheet P8 Part Num --- IC-ON-LINE


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5477 Datasheet PDF File

For 5477 Found Datasheets File :: 141+ Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | <8> | 9 | 10 | 11 | 12 | 13 | 14 | 15 |

					Molex Electronics Ltd.
Part No.	0015477636 15-47-7636
Description	2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 36 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 36 Circuits, 0.38渭m (15渭) Gold (Au) Selective Platin
File Size	377.46K / 4 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	54776-105-26LF
Description	BergStik®, Board to Board connector, Unshrouded Vertical Stacking Header, Through Hole, Double row , Double body, Triplex, 26 Positions, 2.54mm (0.100in) Pitch
Tech specs				Official Product Page

HUA FENG CIRCUIT

					http:// Molex Electronics Ltd.
Part No.	15-47-7530 0015477530
Description	2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 30 Circuits, Tin (Sn) Plating 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 30 Circuits, Tin (Sn) Plating 2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 30 Circuits, Tin (Sn) Plating
File Size	377.42K / 4 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	54775-602-36LF
Description	BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Header,Through Hole, Double Row, 36 Positions, 2.54mm (0.100in) Pitch.
Tech specs				Official Product Page

					Molex Electronics Ltd.
Part No.	0015477630 15-47-7630
Description	2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 30 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 30 Circuits, 0.38渭m (15渭) Gold (Au) Selective Platin
File Size	377.46K / 4 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	54776-102-36LF
Description	BergStik®, Board to Board connector, Unshrouded Vertical Stacking Header, Through Hole, Double row , Double body, Triplex, 36 Positions, 2.54mm (0.100in) Pitch
Tech specs				Official Product Page

					Molex Electronics Ltd.
Part No.	0015477632 15-47-7632
Description	2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 32 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 32 Circuits, 0.38渭m (15渭) Gold (Au) Selective Platin
File Size	377.46K / 4 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	54776-604-20LF
Description	BergStik®, Board to Board connector, Unshrouded Vertical Stacking Header, Through Hole, Double row , Double body, Triplex, 20 Positions, 2.54mm (0.100in) Pitch
Tech specs				Official Product Page

					Molex Electronics Ltd.
Part No.	0015477634 15-47-7634
Description	2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 34 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 34 Circuits, 0.38渭m (15渭) Gold (Au) Selective Platin
File Size	377.52K / 4 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	54776-706-50LF
Description	BERGSTIK DB DR
Tech specs				Official Product Page

					TE Connectivity Ltd
Part No.	4-354779-0 4-354779-4 3-21000-4 21009-2 455888-1 22733-8 354777-1
Description	THIS DRAWING IS A CONTROLLED DOCUMENT. THIS DRAWING IS A CONTROLLED DOCUMENT.
File Size	1,112.32K / 1 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	54775-102-30LF
Description	BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Header,Through Hole, Double Row, 30 Positions, 2.54mm (0.100in) Pitch.
Tech specs				Official Product Page

					TE Connectivity Ltd
Part No.	1-455889-4 22733-8 354777-1 1633091-1
Description	SHOULD BE CONTACTED FOR THE LATEST REVISION.
File Size	471.02K / 1 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	54776-117-20LF
Description	BergStik<sup>®<sup>, Board to Board connector, 2.54mm (0.100in), Unshrouded vertical stacking Header, Through Hole, Double Body, Triplex, Double Row, 20 Positions
Tech specs				Official Product Page

					Molex Electronics Ltd.
Part No.	15-47-7524 0015477524 A-70568-0010
Description	2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 24 Circuits, Tin (Sn) Plating 2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 24 Circuits, Tin (Sn) Plating
File Size	377.43K / 4 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	54776-106-40LF
Description	BergStik®, Board to Board connector, Unshrouded Vertical Stacking Header, Through Hole, Double row , Double body, Triplex, 40 Positions, 2.54mm (0.100in) Pitch
Tech specs				Official Product Page

					Molex Electronics Ltd.
Part No.	15-47-7528 0015477528 A-70568-0012
Description	2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 28 Circuits, Tin (Sn) Plating 2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 28 Circuits, Tin (Sn) Plating
File Size	377.50K / 4 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	54776-108-16LF
Description	BergStik®, Board to Board connector, Unshrouded Vertical Stacking Header, Through Hole, Double row , Double body, Triplex, 16 Positions, 2.54mm (0.100in) Pitch
Tech specs				Official Product Page

					Molex Electronics Ltd.
Part No.	15-47-7510 0015477510 A-70568-0003
Description	2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 10 Circuits, Tin (Sn) Plating 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 10 Circuits, Tin (Sn) Plating 2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 10 Circuits, Tin (Sn) Plating
File Size	377.42K / 4 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	54776-113-06LF
Description	BergStik®, Board to Board connector, Unshrouded Vertical Stacking Header, Through Hole, Double row , Double body, Triplex, 6 Positions, 2.54mm (0.100in) Pitch
Tech specs				Official Product Page

For 5477 Found Datasheets File :: 141+ Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | <8> | 9 | 10 | 11 | 12 | 13 | 14 | 15 |

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