1G16 pdf Datasheet P5 Part Num --- IC-ON-LINE


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1G16 Datasheet PDF File

For 1G16 Found Datasheets File :: 85+ Page :: | 1 | 2 | 3 | 4 | <5> | 6 | 7 | 8 | 9 |

					SAMSUNG[Samsung semiconductor]
Part No.	KFN2G16Q2M-DED6 KFM1G16Q2M KFM1G16Q2M-DEB5 KFM1G16Q2M-DEB6 KFM1G16Q2M-DED5 KFM1G16Q2M-DED6 KFM2G16Q2M-DEB5 KFM2G16Q2M-DEB6 KFM2G16Q2M-DED5 KFM2G16Q2M-DED6 KFN1G16Q2M-DEB5 KFN1G16Q2M-DEB6 KFN1G16Q2M-DED5 KFN1G16Q2M-DED6 KFN2G16Q2M-DEB5 KFN2G16Q2M-DEB6 KFN2G16Q2M-DED5
Description	MuxOneNAND FLASH MEMORY
File Size	1,502.23K / 124 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	64991-G16-4R
Description	BergStik® 2.54mm, Board To Board, Vertical 2 Row Guide Pin Header 32 Positions 2.54mm Pitch 0.76um (30u\\.) Gold Mating plating.
Tech specs				Official Product Page

HUA FENG CIRCUIT

					Samsung Electronic SAMSUNG[Samsung semiconductor]
Part No.	K9K1G08U0A K9K1G08U0A1 K9K1G16U0A K9K1G08Q0A K9K1G16Q0A
Description	128M x 8 Bit / 64M x 16 Bit NAND Flash Memory
File Size	902.07K / 43 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	53611-G16-6LF
Description	Quickie Header, Wire to Board Connector, Double Row, 16 Positions, 2.54 mm (0.1 in.), Vertical Header 0.76 um (30 u\\.) Gold Mating Plating.
Tech specs				Official Product Page

					SAMSUNG SEMICONDUCTOR CO. LTD. Samsung Semiconductor Co., Ltd.
Part No.	K9F1G08U0M-FIB0 K9F1G08U0M-YCB0 K9F1G16Q0M-YCB0 K9F1G16U0M-YIB0 K9F1G08U0M-YIB0 K9F1G08Q0M-YCB0 K9F1G16U0M-YCB0 K9F1G16Q0M-YIB0 K9F1G08Q0M-YIB0 K9F1G08U0M-VCB0 K9F1G08U0M-FCB0 K9F1G08Q0M-PCB0 K9F1G08U0M-PCB0 K9F1G16Q0M-PCB0 K9F1G16U0M-PCB0 K9F1G16Q0M-PIB0 K9F1G08Q0M-PIB0 K9F1G08U0M-PIB0 K9F1G16U0M-PIB0 K9F1G08U0M-VIB0
Description	DSUB DBM25PK 1Gb Gb 1.8V NAND Flash Errata 1Gb的NAND闪存千兆1.8V的勘误表 Industrial Mid-Range Soldering Iron; Power Rating:60W; Tip Temperature:850 F; Features:Incls.: One 67D 1/4" Dia., 3-3/8" L Long-Tapered Diamond-Style Paragon Soldering Tip RoHS Compliant: Yes
File Size	724.12K / 38 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	52601-G16-4LF
Description	Quickie Header, Wire to Board Connector, Double Row, 16 Positions, 2.54 mm (0.1 in.), Vertical Header 0.76 um (30 u\\.) Gold Mating Plating.
Tech specs				Official Product Page

					Qimonda AG http://
Part No.	HYB18TC1G160BF-3.7 HYB18TC1G800BF-3.7 HYB18TC1G160BF-3S HYB18TC1G800BF-2.5 HYB18TC1G800BF-3S HYB18TC1G800BF-5 HYB18TC1G160BF-5
Description	1-Gbit Double-Data-Rate-Two SDRAM
File Size	1,671.88K / 65 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	64991-G16-4
Description	BergStik® 2.54mm, Board To Board, Vertical 2 Row Guide Pin Header 32 Positions 2.54mm Pitch 0.76um (30u\\.) Gold Mating plating.
Tech specs				Official Product Page

					Samsung Electronic SAMSUNG[Samsung semiconductor]
Part No.	K9F1G08Q0M-PCB0 K9F1G08Q0M-PIB0 K9F1G08Q0M-YCB0 K9F1G08Q0M-YIB0 K9F1G08U0M K9F1G08U0M-FCB0 K9F1G08U0M-FIB0 K9F1G08U0M-PCB0 K9F1G08U0M-PIB0 K9F1G08U0M-VCB0 K9F1G08U0M-VIB0 K9F1G08U0M-YCB0 K9F1G08U0M-YIB0 K9F1G16Q0M K9F1G16Q0M-PCB0 K9F1G16Q0M-PIB0 K9F1G16Q0M-YCB0 K9F1G16Q0M-YIB0 K9F1G16U0M-PCB0 K9F1G16U0M-PIB0 K9F1G16U0M-YCB0 K9F1G16U0M-YIB0 K9F1G08U0A
Description	128M x 8 Bit / 64M x 16 Bit NAND Flash Memory 1Gb Gb 1.8V NAND Flash Errata
File Size	712.11K / 38 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	52601-G16-8TLF
Description	Quickie Header, Wire to Board Connector, Double Row, 16 Positions, 2.54 mm (0.1 in.), SMT Header 0.76 um (30 u\\.) Gold Mating Plating.
Tech specs				Official Product Page

					Altech corporation
Part No.	1G20UM 1G25UM 1G3.5UM 1G30UM 1G32UM 1G3UM 1G40UM 1G4UM 1G1.6UM 1G10UM 1G12UM 1G13UM 1G15UM 1G16UM 1G1UM 1G03UM 1G60UM 1G6UM 1G50UM
Description	V-EA-Series - UL508 Manual Motor Controller -
File Size	652.30K / 2 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	52601-G16-8LF
Description	Quickie Header, Wire to Board Connector, Double Row, 16 Positions, 2.54 mm (0.1 in.), SMT Header 0.76 um (30 u\\.) Gold Mating Plating.
Tech specs				Official Product Page

					Qimonda AG
Part No.	HYE18M1G16 HYE18M1G160BF-6 HYE18M1G160BF-7.5 HYE18M1G161BF-6 HYE18M1G161BF-7.5 HYB18M1G161BF-6 HYB18M1G161BF-7.5 HYB18M1G160BF-6 HYB18M1G160BF-7.5
Description	1-Gbit x16 DDR Mobile-RAM
File Size	2,415.35K / 65 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	52601-G16-6LF
Description	Quickie Header, Wire to Board Connector, Double Row, 16 Positions, 2.54 mm (0.1 in.), Vertical Header 0.76 um (30 u\\.) Gold Mating Plating.
Tech specs				Official Product Page

					Qimonda AG http://
Part No.	HYB18M1G16 HYB18M1G160BF-7.5 HYE18M1G161BF-7.5 HYE18M1G160BF-7.5 HYB18M1G161BF-7.5 HYE18M1G160BF-6 HYE18M1G161BF-6
Description	1-Gbit x16 DDR Mobile-RAM 64M X 16 DDR DRAM, 5.5 ns, PBGA60
File Size	2,428.42K / 65 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	53611-G16-4LF
Description	Quickie Header, Wire to Board Connector, Double Row, 16 Positions, 2.54 mm (0.1 in.), Vertical Header 0.76 um (30 u\\.) Gold Mating Plating.
Tech specs				Official Product Page

					Micron Technology
Part No.	MT29F1G16ABCHC MT29F1G08ABCH4
Description	NAND Flash Memory
File Size	1,345.91K / 102 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	64991-G16-4RLF
Description	BergStik® 2.54mm, Board To Board, Vertical 2 Row Guide Pin Header 32 Positions 2.54mm Pitch 0.76um (30u\\.) Gold Mating plating.
Tech specs				Official Product Page

					Infineon
Part No.	HYB18T1G160AC-3.7 HYB18T1G160AC-5 HYB18T1G400AC-3.7 HYB18T1G400AC-5 HYB18T1G800AC-3.7 HYB18T1G800AC-5
Description	DDR2 SDRAM Components - 1Gb (64Mx16) DDR2 533 (4-4-4); Available 3Q04 DDR2 SDRAM Components - 1Gb (64Mx16) DDR2 400 (3-3-3); Available 3Q04 DDR2 SDRAM Components - 1Gb (256Mx4) DDR2 533 (4-4-4); Available 3Q04 DDR2 SDRAM Components - 1Gb (256Mx4) DDR2 400 (3-3-3); Available 3Q04 DDR2 SDRAM Components - 1Gb (128Mx8) DDR2 533 (4-4-4); Available 3Q04 DDR2 SDRAM Components - 1Gb (128Mx8) DDR2 400 (3-3-3); Available 3Q04
File Size	1,238.68K / 95 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	64991-G16-4LF
Description	BergStik® 2.54mm, Board To Board, Vertical 2 Row Guide Pin Header 32 Positions 2.54mm Pitch 0.76um (30u\\.) Gold Mating plating.
Tech specs				Official Product Page

For 1G16 Found Datasheets File :: 85+ Page :: | 1 | 2 | 3 | 4 | <5> | 6 | 7 | 8 | 9 |

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