1G16 pdf Datasheet P4 Part Num --- IC-ON-LINE


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1G16 Datasheet PDF File

For 1G16 Found Datasheets File :: 85+ Page :: | 1 | 2 | 3 | <4> | 5 | 6 | 7 | 8 | 9 |

					Samsung Electronic SAMSUNG[Samsung semiconductor]
Part No.	K4T1G164QM-ZCD5 K4T1G044QM K4T1G044QM-ZCCC K4T1G044QM-ZCD5 K4T1G084QM-ZCCC K4T1G084QM-ZCD5 K4T1G164QM-ZCCC
Description	1Gb M-die DDR2 SDRAM Specification
File Size	454.35K / 29 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	64991-G16-4R
Description	BergStik® 2.54mm, Board To Board, Vertical 2 Row Guide Pin Header 32 Positions 2.54mm Pitch 0.76um (30u\\.) Gold Mating plating.
Tech specs				Official Product Page

HUA FENG CIRCUIT

					SAMSUNG[Samsung semiconductor]
Part No.	K4T1G044QA K4T1G164QA-ZCD5 K4T1G164QA-ZCE6 K4T1G044QA-ZCD5 K4T1G044QA-ZCE6 K4T1G084QA-ZCD5 K4T1G084QA-ZCE6
Description	1Gb A-die DDR2 SDRAM Specification
File Size	608.51K / 28 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	53611-G16-6LF
Description	Quickie Header, Wire to Board Connector, Double Row, 16 Positions, 2.54 mm (0.1 in.), Vertical Header 0.76 um (30 u\\.) Gold Mating Plating.
Tech specs				Official Product Page

					Samsung semiconductor
Part No.	K4B1G1646C-ZCF7 K4B1G0846C-ZCF7 K4B1G0446C-ZCF7 K4B1G0846C-CF8 K4B1G0846C-ZCG9 K4B1G1646C-CF8 K4B1G1646C-ZCG9
Description	1Gb C-die DDR3 SDRAM Specification
File Size	1,235.04K / 63 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	52601-G16-4LF
Description	Quickie Header, Wire to Board Connector, Double Row, 16 Positions, 2.54 mm (0.1 in.), Vertical Header 0.76 um (30 u\\.) Gold Mating Plating.
Tech specs				Official Product Page

					Samsung semiconductor http://
Part No.	K4B1G1646D K4B1G1646D-HCF7 K4B1G1646D-HCF8 K4B1G1646D-HCH9 K4B1G0446D-HCF7 K4B1G0846D K4B1G0846D-HCF7 K4B1G0846D-HCF8 K4B1G0846D-HCH9 K4B1G0446D-HCH9 K4B1G0446D-HCF8
Description	1Gb D-die DDR3 SDRAM Specification
File Size	1,182.43K / 60 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	64991-G16-4
Description	BergStik® 2.54mm, Board To Board, Vertical 2 Row Guide Pin Header 32 Positions 2.54mm Pitch 0.76um (30u\\.) Gold Mating plating.
Tech specs				Official Product Page

					Samsung semiconductor
Part No.	K4T1G044QE-HCLE6 K4T1G044QE-HCLE7 K4T1G044QE-HCLF7 K4T1G084QE-HCLE6 K4T1G084QE-HCLE7 K4T1G084QE-HCLF7 K4T1G164QE-HCLE6 K4T1G164QE-HCLE7 K4T1G164QE-HCLF7
Description	1Gb E-die DDR2 SDRAM
File Size	677.25K / 46 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	52601-G16-8TLF
Description	Quickie Header, Wire to Board Connector, Double Row, 16 Positions, 2.54 mm (0.1 in.), SMT Header 0.76 um (30 u\\.) Gold Mating Plating.
Tech specs				Official Product Page

					SAMSUNG SEMICONDUCTOR CO. LTD. Samsung Semiconductor Co., Ltd.
Part No.	K4T1G084QQ K4T1G084QQ-HCLE6 K4T1G084QQ-HCLE7 K4T1G084QQ-HCLF7 K4T1G164QQ-HCLE6 K4T1G044QQ-HCLF7 K4T1G164QQ-HCLF7 K4T1G044QQ-HCLE7
Description	1Gb Q-die DDR2 SDRAM Specification 1Gb的调Q DDR2内存芯片规格
File Size	888.69K / 44 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	52601-G16-8LF
Description	Quickie Header, Wire to Board Connector, Double Row, 16 Positions, 2.54 mm (0.1 in.), SMT Header 0.76 um (30 u\\.) Gold Mating Plating.
Tech specs				Official Product Page

					Samsung semiconductor
Part No.	K4T1G164QQ K4T1G164QQ-HCLE6 K4T1G164QQ-HCLE7 K4T1G164QQ-HCLF7 K4T1G084QQ K4T1G084QQ-HCLE6 K4T1G084QQ-HCLE7 K4T1G084QQ-HCLF7 K4T1G044QQ K4T1G044QQ-HCLE6 K4T1G044QQ-HCLE7 K4T1G044QQ-HCLF7
Description	1Gb Q-die DDR2 SDRAM Specification
File Size	872.94K / 44 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	52601-G16-6LF
Description	Quickie Header, Wire to Board Connector, Double Row, 16 Positions, 2.54 mm (0.1 in.), Vertical Header 0.76 um (30 u\\.) Gold Mating Plating.
Tech specs				Official Product Page

					Samsung semiconductor
Part No.	K4T1G044QF-BCE6 K4T1G044QF-BCE7 K4T1G044QF-BCF7 K4T1G044QF K4T1G084QF K4T1G084QF-BCE6 K4T1G164QF K4T1G164QF-BCE6 K4T1G164QF-BCE7 K4T1G164QF-BCF7 K4T1G084QF-BCE7 K4T1G084QF-BCF7 K4T1G164QF-BCE6000 K4T1G084QF-BCE6000
Description	1Gb F-die DDR2 SDRAM 60FBGA/84FBGA with Lead-Free & Halogen-Free (RoHS compliant)
File Size	867.03K / 46 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	53611-G16-4LF
Description	Quickie Header, Wire to Board Connector, Double Row, 16 Positions, 2.54 mm (0.1 in.), Vertical Header 0.76 um (30 u\\.) Gold Mating Plating.
Tech specs				Official Product Page

					http:// Qimonda AG
Part No.	HYB18T1G160BF-2.5F HYB18T1G160BF-3S HYB18T1G400BF-3S
Description	1-Gbit Double-Data-Rate-Two SDRAM 1-Gbit Double-Data-Rate-Two SDRAM
File Size	1,746.70K / 70 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	64991-G16-4RLF
Description	BergStik® 2.54mm, Board To Board, Vertical 2 Row Guide Pin Header 32 Positions 2.54mm Pitch 0.76um (30u\\.) Gold Mating plating.
Tech specs				Official Product Page

					Samsung Electronic
Part No.	KFM1G16Q2M KFM1G16Q2M-DEB5 KFM1G16Q2M-DEB6 KFM1G16Q2M-DED5 KFM1G16Q2M-DED6 KFM2G16Q2M-DEB5 KFM2G16Q2M-DEB6 KFM2G16Q2M-DED5 KFM2G16Q2M-DED6 KFN1G16Q2M-DEB5 KFN1G16Q2M-DEB6 KFN1G16Q2M-DED5 KFN1G16Q2M-DED6 KFN2G16Q2M-DEB5 KFN2G16Q2M-DEB6 KFN2G16Q2M-DED5 KFN2G16Q2M-DED6
Description	MuxOneNAND FLASH MEMORY
File Size	1,513.37K / 124 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	64991-G16-4LF
Description	BergStik® 2.54mm, Board To Board, Vertical 2 Row Guide Pin Header 32 Positions 2.54mm Pitch 0.76um (30u\\.) Gold Mating plating.
Tech specs				Official Product Page

For 1G16 Found Datasheets File :: 85+ Page :: | 1 | 2 | 3 | <4> | 5 | 6 | 7 | 8 | 9 |

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