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  1G16 Datasheet PDF File

For 1G16 Found Datasheets File :: 85+       Page :: | 1 | 2 | <3> | 4 | 5 | 6 | 7 | 8 | 9 |   

    KFG1216D2M KFG1216Q2M KFH1G16Q2M

Samsung semiconductor
Part No. KFG1216D2M KFG1216Q2M KFH1G16Q2M
Description FLASH MEMORY

File Size 1,340.62K  /  93 Page

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Amphenol Communications Solutions

Part No. 64991-G16-4R
Description BergStik® 2.54mm, Board To Board, Vertical 2 Row Guide Pin Header 32 Positions 2.54mm Pitch 0.76um (30u\\.) Gold Mating plating.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    MT40A1G16HBA-083E MT40A1G16WBU-075E MT40A1G16WBU-083E

Micron Technology
Part No. MT40A1G16HBA-083E MT40A1G16WBU-075E MT40A1G16WBU-083E
Description TwinDie 1.2V DDR4 SDRAM

File Size 444.52K  /  19 Page

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Amphenol Communications Solutions

Part No. 53611-G16-6LF
Description Quickie Header, Wire to Board Connector, Double Row, 16 Positions, 2.54 mm (0.1 in.), Vertical Header 0.76 um (30 u\\.) Gold Mating Plating.
Tech specs    

Official Product Page

    Samsung Electronics
Part No. K4T1G164QE K4T1G044QE K4T1G084QE
Description 1Gb E-die DDR2 SDRAM

File Size 1,070.34K  /  45 Page

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Amphenol Communications Solutions

Part No. 52601-G16-4LF
Description Quickie Header, Wire to Board Connector, Double Row, 16 Positions, 2.54 mm (0.1 in.), Vertical Header 0.76 um (30 u\\.) Gold Mating Plating.
Tech specs    

Official Product Page

    HY5PS1G1631CLFP

Hynix Semiconductor
Part No. HY5PS1G1631CLFP
Description (HY5PS1Gxx31CxFP) 1Gb DDR2 SDRAM

File Size 618.07K  /  36 Page

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Amphenol Communications Solutions

Part No. 64991-G16-4
Description BergStik® 2.54mm, Board To Board, Vertical 2 Row Guide Pin Header 32 Positions 2.54mm Pitch 0.76um (30u\\.) Gold Mating plating.
Tech specs    

Official Product Page

    Samsung Electronic
Part No. KFG1G16Q2M-DED6 KFG2G16Q2M-DEB6 KFG2G16Q2M-DED6 KFG4G16Q2M-DEB6 KFG4G16Q2M-DED6
Description FLASH MEMORY(66MHz)

File Size 1,595.42K  /  125 Page

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Amphenol Communications Solutions

Part No. 52601-G16-8TLF
Description Quickie Header, Wire to Board Connector, Double Row, 16 Positions, 2.54 mm (0.1 in.), SMT Header 0.76 um (30 u\\.) Gold Mating Plating.
Tech specs    

Official Product Page

    SAMSUNG SEMICONDUCTOR CO. LTD.
Part No. K9F1G08D0M K9F1G16D0M K9F1G08U0M-YCB00
Description Circular Connector; MIL SPEC:MIL-DTL-38999 Series III; Body Material:Metal; Series:TV07; Number of Contacts:37; Connector Shell Size:25; Connecting Termination:Crimp; Circular Shell Style:Jam Nut Receptacle; Body Style:Straight
128M x 8 Bit / 64M x 16 Bit NAND Flash Memory
128M X 8 FLASH 2.7V PROM, 30 ns, PDSO48

File Size 737.72K  /  40 Page

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Amphenol Communications Solutions

Part No. 52601-G16-8LF
Description Quickie Header, Wire to Board Connector, Double Row, 16 Positions, 2.54 mm (0.1 in.), SMT Header 0.76 um (30 u\\.) Gold Mating Plating.
Tech specs    

Official Product Page

    SAMSUNG SEMICONDUCTOR CO. LTD.
Part No. K4B1G1646C-ZCG9 K4B1G0846C-ZCG9 K4B1G0446C-ZCG9
Description 1Gb C-die DDR3 SDRAM Specification

File Size 1,257.15K  /  63 Page

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Amphenol Communications Solutions

Part No. 52601-G16-6LF
Description Quickie Header, Wire to Board Connector, Double Row, 16 Positions, 2.54 mm (0.1 in.), Vertical Header 0.76 um (30 u\\.) Gold Mating Plating.
Tech specs    

Official Product Page

    MT29F1G08ABB MT29F1G16ABB

Micron Technology
Part No. MT29F1G08ABB MT29F1G16ABB
Description (MT29F1GxxABB) 1Gb NAND Flash Memory

File Size 1,944.34K  /  74 Page

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Amphenol Communications Solutions

Part No. 53611-G16-4LF
Description Quickie Header, Wire to Board Connector, Double Row, 16 Positions, 2.54 mm (0.1 in.), Vertical Header 0.76 um (30 u\\.) Gold Mating Plating.
Tech specs    

Official Product Page

    SAMSUNG SEMICONDUCTOR CO. LTD.
Part No. K4T1G044QA-ZCD5 K4T1G084QA-ZCD5 K4T1G164QA-ZCE6 K4T1G084QA-ZCE6 K4T1G044QA-ZCE6
Description 1Gb A-die DDR2 SDRAM Specification

File Size 614.03K  /  28 Page

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Amphenol Communications Solutions

Part No. 64991-G16-4RLF
Description BergStik® 2.54mm, Board To Board, Vertical 2 Row Guide Pin Header 32 Positions 2.54mm Pitch 0.76um (30u\\.) Gold Mating plating.
Tech specs    

Official Product Page

    SAMSUNG SEMICONDUCTOR CO. LTD.
Part No. K4T1G084QM-ZCCC K4T1G084QM-ZCD5 K4T1G044QM-ZCCC K4T1G164QM-ZCCC
Description 1Gb M-die DDR2 SDRAM Specification

File Size 460.05K  /  29 Page

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Amphenol Communications Solutions

Part No. 64991-G16-4LF
Description BergStik® 2.54mm, Board To Board, Vertical 2 Row Guide Pin Header 32 Positions 2.54mm Pitch 0.76um (30u\\.) Gold Mating plating.
Tech specs    

Official Product Page

For 1G16 Found Datasheets File :: 85+       Page :: | 1 | 2 | <3> | 4 | 5 | 6 | 7 | 8 | 9 |   

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