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TCD1709D 25P10 BLF888 RT1N130C K2018 MOC3033 MAX4201 1003F
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For placement Found Datasheets File :: 16258    Search Time::1.61ms    
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    PIC18F1330-E_ML PIC18F1330-E_MLQTP PIC18F1330-E_MLSQTP PIC18F1330-E_P PIC18F1330-E_PQTP PIC18F1330-E_PSQTP PIC18F1330-E_

MICROCHIP[Microchip Technology]
Part No. PIC18F1330-E_ML PIC18F1330-E_MLQTP PIC18F1330-E_MLSQTP PIC18F1330-E_P PIC18F1330-E_PQTP PIC18F1330-E_PSQTP PIC18F1330-E_SO PIC18F1330-E_SOQTP PIC18F1330-E_SOSQTP PIC18F1330-E_SS PIC18F1330-E_SSQTP PIC18F1330-E_SSSQTP PIC18F1330-I_ML PIC18F1330-I_MLQTP PIC18F1330-I_MLSQTP PIC18F1330-I_P PIC18F1330-I_PQTP PIC18F1330-I_PSQTP PIC18F1330-I_SO PIC18F1330-I_SOQTP PIC18F1330-I_SOSQTP PIC18F1330-I_SS PIC18F1330-I_SSQTP PIC18F1330-I_SSSQTP PIC18F1230-I_SSSQTP PIC18F1230 PIC18F1230-E_ML PIC18F1230-E_MLQTP PIC18F1230-E_MLSQTP PIC18F1230-E_P PIC18F1230-E_PQTP PIC18F1230-E_PSQTP PIC18F1230-E_SO PIC18F1230-E_SOQTP PIC18F1230-E_SOSQTP PIC18F1230-E_SS PIC18F1230-E_SSQTP PIC18F1230-E_SSSQTP PIC18F1230-I_ML PIC18F1230-I_MLQTP PIC18F1230-I_MLSQTP PIC18F1230-I_P PIC18F1230-I_PQTP PIC18F1230-I_PSQTP PIC18F1230-I_SO PIC18F1230-I_SOQTP PIC18F1230-I_SOSQTP PIC18F1230-I_SS PIC18F1230-I_SSQTP
OCR Text ...15 14 13 12 11 Note 1: 2: placement of T1OSI and T1OSO/T1CKI depends on the value of Configuration bit, T1OSCMX, of CONFIG3H. placement of FLTA depends on the value of Configuration bit, FLTAMX, of CONFIG3H. DS39758B-page 2 Adva...
Description 18/20/28-Pin, Enhanced Flash Microcontrollers with nanoWatt Technology, High-Performance PWM and A/D

File Size 2,780.96K  /  312 Page

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    PIC18F86J50 PIC18F86J55 PIC18F65J50 PIC18F87J50 PIC18F85J50 PIC18F66J50 PIC18F66J55 PIC18F67J50

MICROCHIP[Microchip Technology]
Part No. PIC18F86J50 PIC18F86J55 PIC18F65J50 PIC18F87J50 PIC18F85J50 PIC18F66J50 PIC18F66J55 PIC18F67J50
OCR Text ...Note 1: The ECCP2/P2A pin placement depends on the setting of the CCP2MX Configuration bit. VUSB ENVREG AVDD AVSS RA3/AN3/VREF+ RA2/AN2/VREFRA1/AN1 RA0/AN0 VSS VDD RA5/AN4/C2INA RA4/T0CKI RC1/T1OSI/ECCP2(1)/P2A(1) RC0/T1OSO/T13CKI ...
Description 64/80-Pin High-Performance, 1-Mbit Flash USB Microcontrollers with nanoWatt Technology

File Size 4,160.08K  /  480 Page

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    X1226S8 X1226V8ZT1 X1226 X1226S8I X1226S8IT1 X1226S8IZ X1226S8IZT1 X1226S8T1 X1226S8Z X1226S8ZT1 X1226V8 X1226V8I X1226V

INTERSIL[Intersil Corporation]
Part No. X1226S8 X1226V8ZT1 X1226 X1226S8I X1226S8IT1 X1226S8IZ X1226S8IZT1 X1226S8T1 X1226S8Z X1226S8ZT1 X1226V8 X1226V8I X1226V8IT1 X1226V8IZ X1226V8IZT1 X1226V8T1 X1226V8Z
OCR Text ...it. Care should be taken in the placement of the crystal and the layout of the circuit. Plenty of ground plane around the device and short traces to X1 are highly recommended. See Application section for more recommendations. X2. The X2 pin...
Description Real Time Clock/Calendar with EEPROM

File Size 379.94K  /  25 Page

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    PIC18F87J11 PIC18F86J11 PIC18F66J11 PIC18F66J16 PIC18F67J11

MICROCHIP[Microchip Technology]
Part No. PIC18F87J11 PIC18F86J11 PIC18F66J11 PIC18F66J16 PIC18F67J11
OCR Text ... Note 1: The ECCP2/P2A pin placement depends on the CCP2MX Configuration bit setting. DS39778B-page 2 Preliminary (c) 2007 Microchip Technology Inc. PIC18F87J11 FAMILY Pin Diagrams (Continued 80-Pin TQFP RE2/AD10/PMBE(...
Description 64/80-Pin High-Performance,1-Mbit Flash Microcontrollers with nanoWatt Technology

File Size 3,701.60K  /  448 Page

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    TGA2502

TriQuint Semiconductor
Part No. TGA2502
OCR Text ...gen atmosphere. 0 Component placement and adhesive attachment assembly notes: * * * * * * * Vacuum pencils and/or vacuum collets are the preferred method of pick up. Air bridges must be avoided during placement. The force impact is crit...
Description 13 - 15 GHz 4W Power Amplifier

File Size 174.91K  /  9 Page

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    TGA2503-EPU

TriQuint Semiconductor
Part No. TGA2503-EPU
OCR Text ...trogen atmosphere. Component placement and adhesive attachment assembly notes: * * * * * * * Vacuum pencils and/or vacuum collets are the preferred method of pick up. Air bridges must be avoided during placement. The force impact is crit...
Description Ku Band HPA
13 - 17 GHz 2 Watt, 32dB Power Amplifier

File Size 233.22K  /  11 Page

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    Recom International Pow...
Part No. RPM-3.0-EVM-1
OCR Text ...n con1 con3 con2 con4 component placement c on 1 l 2 l 1 l 6 r6 c7 r1 c3 c2 r5 r7 ic1 l 3 c1 c4 c on 2 c6 c on 4 c5 c 9 r2 l 8 r8 r4 r3 c on 3 l 7 l 5 c8 l 4 p g vout seq recom 12.2x12.2mm evaluation board version 03 vsel off o n sense ...
Description Easy evaluation of trimming, sequencing, soft start, enable and sensing functions

File Size 1,058.03K  /  6 Page

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    Recom International Pow...
Part No. RPM-2.0-EVM-1 RPM3.3-2.0-EVM-1 RPM5.0-2.0-EVM-1
OCR Text ...n con1 con3 con2 con4 component placement c on 1 l 2 l 1 l 6 r6 c7 r1 c3 c2 r5 r7 ic1 l 3 c1 c4 c on 2 c6 c on 4 c5 c 9 r2 l 8 r8 r4 r3 c on 3 l 7 l 5 c8 l 4 p g vout seq recom 12.2x12.2mm evaluation board version 03 vsel off o n sense ...
Description Easy evaluation of trimming, sequencing, soft start, enable and sensing functions

File Size 1,057.94K  /  6 Page

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    Recom International Pow...
Part No. RPM-1.0-EVM-1 RPM3.3-1.0-EVM-1 RPM5.0-1.0-EVM-1
OCR Text ...n con1 con3 con2 con4 component placement c on 1 l 2 l 1 l 6 r6 c7 r1 c3 c2 r5 r7 ic1 l 3 c1 c4 c on 2 c6 c on 4 c5 c 9 r2 l 8 r8 r4 r3 c on 3 l 7 l 5 c8 l 4 p g vout seq recom 12.2x12.2mm evaluation board version 03 vsel off o n sense ...
Description Easy evaluation of trimming, sequencing, soft start, enable and sensing functions

File Size 1,058.01K  /  6 Page

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    TGA2508-EPU

TriQuint Semiconductor
Part No. TGA2508-EPU
OCR Text ...trogen atmosphere. Component placement and adhesive attachment assembly notes: * * * * * * * Vacuum pencils and/or vacuum collets are the preferred method of pick up. Air bridges must be avoided during placement. The force impact is crit...
Description 12-19 GHz VSAT Amplifier

File Size 157.34K  /  10 Page

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