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TL102 RBV1506 68100 1A66B TL102 MAX14 5Q0565RT A312T
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For placement Found Datasheets File :: 14212    Search Time::1.281ms    
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    TGA4530

TriQuint Semiconductor
Part No. TGA4530
OCR Text ...gen atmosphere. 0 Component placement and adhesive attachment assembly notes: * * * * * * * Vacuum pencils and/or vacuum collets are the preferred method of pick up. Air bridges must be avoided during placement. The force impact is crit...
Description K Band High Linearity Power Amplifier

File Size 251.02K  /  12 Page

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    TGA4040

TriQuint Semiconductor
Part No. TGA4040
OCR Text ...gen atmosphere. 0 Component placement and adhesive attachment assembly notes: * * * * * * * Vacuum pencils and/or vacuum collets are the preferred method of pick up. Air bridges must be avoided during placement. The force impact is crit...
Description 17 - 43GHz MPA/Multiplier

File Size 158.05K  /  10 Page

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    XC4000FM XC4000H XC4003H XC4005H XC4025 XC4000 XC4000A XC4002A XC4003 XC4003A XC4004A XC4005 XC4005A XC4006 XC4008 XC401

XILINX[Xilinx, Inc]
Part No. XC4000FM XC4000H XC4003H XC4005H XC4025 XC4000 XC4000A XC4002A XC4003 XC4003A XC4004A XC4005 XC4005A XC4006 XC4008 XC4010 XC4010D XC4013 XC4013D XC4020
OCR Text ... simulation, to automatic block placement and routing of interconnects, and finally the creation of the configuration bit stream. Since Xilinx FPGAs can be reprogrammed an unlimited number of times, they can be used in innovative designs wh...
Description Logic Cell Array Families

File Size 342.55K  /  40 Page

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    TGA4042-EPU

TriQuint Semiconductor
Part No. TGA4042-EPU
OCR Text ...gen atmosphere. 0 Component placement and adhesive attachment assembly notes: * * * * * * * Vacuum pencils and/or vacuum collets are the preferred method of pick up. Air bridges must be avoided during placement. The force impact is crit...
Description Q Band Driver Amplifier
Q-Band Driver Amplifier

File Size 317.99K  /  10 Page

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    TGA4043

TriQuint Semiconductor
Part No. TGA4043
OCR Text ...trogen atmosphere. Component placement and adhesive attachment assembly notes: * * * * * * * Vacuum pencils and/or vacuum collets are the preferred method of pick up. Air bridges must be avoided during placement. The force impact is crit...
Description Q-band Power Amplifier

File Size 146.76K  /  7 Page

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    TGA4046

TriQuint Semiconductor
Part No. TGA4046
OCR Text ...gen atmosphere. 0 Component placement and adhesive attachment assembly notes: * * * * * * * Vacuum pencils and/or vacuum collets are the preferred method of pick up. Air bridges must be avoided during placement. The force impact is crit...
Description 2W Q-Band High Power Amplifier

File Size 117.37K  /  9 Page

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    AD[Analog Devices]
Part No. ADL5320ARKZ-WP ADL5230-EVALZ ADL5320 ADL5320ARKZ-R7
OCR Text ... Board Layout showing component placement 800 MHz to 960 MHz operation Rev. PrB | Page 7 of 10 ADL5320 Table 5. Evaluation Board Configuration Options 800 MHz - 960 MHz Component C1, C2 C4, C5, C6 Function AC - coupling capacitors P...
Description 400 MHz to 2700 MHz Pre-driver RF Amplifier

File Size 290.12K  /  10 Page

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    ALD[Advanced Linear Devices]
Part No. ALD523DSH ALD523D ALD523DPH
OCR Text ...eature Adjustable decimal point placement with trailing digit blanking External 1K EEPROM memory for easy change of factory settings Sleep mode with Auto Power-On-Reset. Easy setup of calibration and system setup parameters No software prog...
Description MULTIFUNCTION 7-DIGIT SERIAL INPUT DISPLAY MODULE CONTROLLER
MULTIFUNCTION 7 - DIGIT SERIAL INPUT DISPLAY MODULE CONTROLLER

File Size 255.42K  /  20 Page

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    http://
FAIRCHILD[Fairchild Semiconductor]
Fairchild Semiconductor Corporation
Part No. AN-5026
OCR Text ...A package. See Figure 8 for via placement. Pros: Better noise performance due to lower power inductance (shorter VCC/GND trace length). Cons: Via size under the package is restricted to 0.56mm (22.0 mil) vias. 2. Supplying power and ground ...
Description Using BGA Packages
Contact Gender:Pin; Circular Shell Style:Wall Mount Receptacle; Insert Arrangement:15-19 RoHS Compliant: No

File Size 720.16K  /  8 Page

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    AN-0001

ANADIGICS, Inc
Part No. AN-0001
OCR Text ...3.2 soldering options & package placement 1. hand soldering of these devices is not recommended even for prototypes. 2. infrared or convection mass reflow soldering is the preferred method of lpcc attachment. 3 05/2003 an...
Description Surface Mount Assembly and Handling of ANADIGICS LPCC Packages

File Size 56.02K  /  6 Page

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