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				Holtek Semiconductor Inc
Part No.	HT66F03 HT66F04 HT68F03 HT68F04
OCR Text	...C power supply. The AVDD pin is bonded together internally with VDD. **: VSS is the device ground pin while AVSS is the ADC ground pin. The AVSS pin is bonded together internally with VSS. PRM PRM PRM PRM 3/4 CO CO CO 3/4 3/4 3/4 3/4 CPC Fu...
Description	Small Package Enhanced Flash Type 8-Bit MCU with EEPROM
File Size	1,390.33K / 139 Page	View it Online	Download Datasheet

				Merrimac Industries, Inc.
Part No.	CSD-20H-0.9G
OCR Text	...directional couplers are fusion bonded multilayer stripline assemblies. The fusion bonding process yields a homogeneous monolithic dielectric structure with reliability, ruggedness, and electrical performance that is superior to conventiona...
Description	DIRECTIONAL COUPLER
File Size	145.49K / 5 Page	View it Online	Download Datasheet

				TT Electronics.
Part No.	4700
OCR Text	...stom confguraton available bonded leads not susceptble to solder refow problems absolute tolerance to 0.1% - rato accuracy to 0.01% absolute tcr to 15ppm/c - tc tracking to 5ppm/c general note irc reser v es the r...
Description	Custom configuration available
File Size	339.98K / 4 Page	View it Online	Download Datasheet

				Merrimac Industries, Inc.
Part No.	CSD-20H-1.9G
OCR Text	...directional couplers are fusion bonded multilayer stripline assemblies. The fusion bonding process yields a homogeneous monolithic dielectric structure with reliability, ruggedness, and electrical performance that is superior to conventiona...
Description	DIRECTIONAL COUPLERS
File Size	180.25K / 5 Page	View it Online	Download Datasheet

				PHILIPS[Philips Semiconductors]
Part No.	P83C770 P83C770AAR P83C570 P83C570AAR P87C770 P87C770AAR P83C270AAR P83C370AAR P83C270
OCR Text	...gram Store Enable (active LOW); bonded out for testing purpose only. External Access (active LOW); bonded out for testing purpose only. This pin is also used for the 12.75 V programming voltage supply in OTP programming modes. Address Latch...
Description	Microcontrollers for NTSC TVs with On-Screen Display OSD and Closed Caption CC
File Size	265.64K / 80 Page	View it Online	Download Datasheet

				Micross Components
Part No.	HMC260
OCR Text	...made with the chip mounted and bonded into in a 50 ohm test fi xture. data includes the parasitic effects of wire bond assembly. connections were made with a 3 mil rib- bon bond with minimal length (<12 mil). parameter lo = +13 dbm, if...
Description	Point-to-Multi-Point Radios
File Size	877.76K / 9 Page	View it Online	Download Datasheet

				Merrimac Industries, Inc.
Part No.	CSD-20H-2.2G
OCR Text	...directional couplers are fusion bonded multilayer stripline assemblies. The fusion bonding process yields a homogeneous monolithic dielectric structure with reliability, ruggedness, and electrical performance that is superior to conventiona...
Description	DIRECTIONAL COUPLER
File Size	134.01K / 5 Page	View it Online	Download Datasheet

				MERRIMAC INDUSTRIES INC Merrimac Industries, Inc.
Part No.	CSD-20H-2.3G
OCR Text	...directional couplers are fusion bonded multilayer stripline assemblies. The fusion bonding process yields a homogeneous monolithic dielectric structure with reliability, ruggedness, and electrical performance that is superior to conventiona...
Description	2000 MHz - 2500 MHz RF/MICROWAVE DIRECTIONAL COUPLER, 0.25 dB INSERTION LOSS-MAX
File Size	137.50K / 5 Page	View it Online	Download Datasheet

				Samsung Electronic SAMSUNG[Samsung semiconductor]
Part No.	K4R441869B-NMCK7 K4R441869B-NMCK8 K4R271669B-NMCG6 K4R271669B-NMCK7 K4R271669B-NBMCCK8 K4R271669B-NCG6 K4R271669B-NCK7 K4R271669B-NCK8 K4R441869B-NCK8 K4R271669B K4R271669B-MCG6 K4R271669B-MCK7 K4R271669B-MCK8 K4R441869B-MCG6 K4R441869B-MCK7 K4R441869B-MCK8 K4R441869B-NCG6 K4R441869B-NCK7 K4R441869B-NMCG6 K4R271869B-MCK8 K4R271869B-NCG6
OCR Text	...Pinouts and Definitions Center-bonded Devices These tables shows the pin assignments of the center-bonded RDRAM package. The top table is for the normal package, Direct RDRAMTM and bottom table is for the mirrored package. The mecha...
Description	256K x 18 x 32s banks direct RDRAM. Access time: 53.3 ns, I/O freq.: 600 MHz. 256K x 18 x 32s banks direct RDRAM. Access time: 45 ns, I/O freq.: 800 MHz. 256K x 16 x 32s banks direct RDRAM. Access time: 45 ns, I/O freq.: 711 MHz. K4R271669B:Direct RDRAMData Sheet 256K x 16/18 bit x 32s banks Direct RDRAMTM 256K x 16 x 32s banks direct RDRAM. Access time: 53.3 ns, I/O freq.: 600 MHz. 256K x 16 x 32s banks direct RDRAM. Access time: 45 ns, I/O freq.: 800 MHz.
File Size	304.91K / 20 Page	View it Online	Download Datasheet

				Semikron International
Part No.	SK50DGDL066ETE2
OCR Text	...sulation through direct copper bonded aluminium oxide ceramic (dbc) ? trench3 600v igbt technology ? cal technology fwd ? ul recognized file no. e 63 532 ? integrated ntc temperature sensor typical applications* ? inverter up to 18kva ? t...
Description	Low inductive design
File Size	290.30K / 6 Page	View it Online	Download Datasheet

For bonded Found Datasheets File :: 5353 Search Time::7.765ms
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