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For bonded Found Datasheets File :: 5353 Search Time::1.954ms
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				SiGe Semiconductor, Inc... SiGe Semiconductor Inc. SIGE[SiGe Semiconductor, Inc.]
Part No.	SE1020W SE1020
OCR Text	... chip. Only one pad needs to be bonded. Input pad (connect to photodetector anode). Negative supply (0V) - Note this is separate ground for the input stage, which is AC coupled on chip. There is no DC current through this pad. Negative supp...
Description	1.25 Gb/s Transimpedance Amplifier Product Preview Amplifier, 1.25Gb/s Transimpedance Amplifier
File Size	141.78K / 7 Page	View it Online	Download Datasheet

				SiGe Semiconductor Inc. SIGE[SiGe Semiconductor, Inc.]
Part No.	SE1030W SE103
OCR Text	... chip. Only one pad needs to be bonded. Do not connect. Input pad (connect to photodetector anode). Negative supply (0V) - Note this is separate ground for the input stage, which is AC coupled on chip. There is no DC current through this pa...
Description	LightCharger?/a> 2.5 Gb/s Transimpedance Amplifier Final LightCharger2.5 Gb/s Transimpedance Amplifier Final LightCharger 2.5 Gb/s Transimpedance Amplifier LP Final LightCharger 2.5 Gb/s Transimpedance Amplifier Final LightCharger⑩ 2.5 Gb/s Transimpedance Amplifier Final
File Size	101.35K / 9 Page	View it Online	Download Datasheet

				IXYS Corporation
Part No.	DWEP69-12 DWGS04-018A DWGS04-01A DWGS04-025A DWGS04-025C DWEP35-06 DWEP30-10 DWEP6-12 CWP22-CG DWEP50-10 DWEP55-06 DWEP77-02 DWFP17-16_18 DWEP75-06
OCR Text	...28-31 32-33 34 Direct Copper bonded (DCB), Direct Alu bonded (DAB) Ceramic Substrates What is DCB/DAB? DCB Specification 35 36 IXYS reserves the right to change limits, test conditions and dimensions 1 Symbols and Definitions ...
Description	Rectifier Diodes & FRED
File Size	757.98K / 22 Page	View it Online	Download Datasheet

				Holtek Semiconductor Inc
Part No.	HT82K95AE HT82K95EE
OCR Text	... purpose. The two dice are wire-bonded to form HT82K95EE/HT82K95AE. Rev. 1.20 1 August 28, 2006 HT82K95EE/HT82K95AE Block Diagram U S B D + /C L K U S B D -/D A T A V33O TM R1C M U X TM R1 fS YS U S B 1 .1 PS2 BP In te rru...
Description	USB Multimedia Keyboard Encoder 8-Bit MCU
File Size	322.14K / 45 Page	View it Online	Download Datasheet

				Holtek Semiconductor Inc
Part No.	HT82M9BEE HT82M9BAE
OCR Text	... purpose. The two dice are wrie-bonded to from HT82M9BEE/ HT82M9BAE. Rev. 1.20 1 August 13, 2007 HT82M9BEE/HT82M9BAE Block Diagram U S B D + /C L K U S B D -/D A T A V33O TM R1C M U X U S B 1 .1 PS2 BP In te rru p t C ir c u i...
Description	USB Mouse Encoder 8-Bit MCU with EEPROM
File Size	311.51K / 47 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC32907
OCR Text	...ith the chip mounted and ribbon bonded into in a 50-ohm microstrip test fixture that contains 5-mil alumina substrates between the chip and K-connectors. Measured data includes the parasitic effects of the assembly. RF connections to the ch...
Description	GaAs MMIC DOUBLE-BALANCED MIXER, 25 - 40 GHz
File Size	202.44K / 6 Page	View it Online	Download Datasheet

				Cypress Semiconductor
Part No.	CYP15G0201DXB-BBXC CYP15G0201DXB-BBXI CYP15G0201DXB05 CYW15G0201DXB CYW15G0201DXB-BBC CYW15G0201DXB-BBI CYW15G0201DXB-BBXC CYW15G0201DXB-BBXI
OCR Text	...an be operated independently or bonded to form wider buses. Each channel can accept either 8-bit data characters or pre-encoded 10-bit transmission characters. Data characters are passed from the Transmit Input Register to an embedded 8B/10...
Description	Dual-channel HOTLink II⑩ Transceiver
File Size	653.25K / 46 Page	View it Online	Download Datasheet

				Microsemi Corporation
Part No.	1N5932BUR-1 MLL5913B 1N5953BUR-1 1N5947BUR-1 1N5925BUR-1
OCR Text	bonded GLASS SURFACE MOUNT 1.5 WATT ZENERS DESCRIPTION This surface mountable 1.5 W Zener diode series in the JEDEC DO-213AB package is similar in electrical features to the JEDEC registered 1N5913B thru 1N5956B axial-leaded package for ...
Description	METALLURGICALLY bonded GLASS SURFACE MOUNT 1.5 WATT ZENERS
File Size	188.47K / 3 Page	View it Online	Download Datasheet

				SIEMENS[Siemens Semiconductor Group]
Part No.	SLE4440 SLE4440C SLE4440M3 SLE4441C SLE4442M3 SLE4432 SLE4432C SLE4432M3 SLE4441 SLE4441M3 SLE4442 SLE4442C
OCR Text	...uest on request on request Wire-bonded Module M3 Chip Wire-bonded Module M3 Chip 1) Values are temperature dependent, for further information please refer to your Siemens Sales Office. Semiconductor Group 3 Data Sheet Extensi...
Description	ICS FOR CHIP CARDS / INTELLIGENT 256/64/128-BYTE EEPROM
File Size	175.16K / 14 Page	View it Online	Download Datasheet

				Cypress Semiconductor
Part No.	CYW15G0401DXB CYW15G0401DXB-BGC CYW15G0401DXB-BGI CYW15G0401DXB-BGXC CYW15G0401DXB-BGXI CYP15G0401DXB-BGXC CYP15G0401DXB-BGXI CYP15G0401DXB05
OCR Text	...an be operated independently or bonded to form wider buses. Each channel can accept either eight-bit data characters or pre-encoded 10-bit transmission characters. Data characters are passed from the Transmit Input Register to an embedded 8...
Description	Quad HOTLink II⑩ Transceiver
File Size	568.05K / 53 Page	View it Online	Download Datasheet

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