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  87639-1011 Datasheet PDF File

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    SGS Thomson Microelectronics
STMICROELECTRONICS[STMicroelectronics]
Part No. AM1011-300 2890
Description RF & MICROWAVE TRANSISTORS, AVIONICS APPLICATIONS
RF & MICROWAVE TRANSISTORS AVIONICS APPLICATIONS
From old datasheet system

File Size 58.21K  /  5 Page

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Amphenol Communications Solutions

Part No. 10118085-101-12LF
Description Unshrouded Right Angle header,Surface Mount, Double Row, 12 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    TOSHIBA[Toshiba Semiconductor]
Part No. RN1011 RN1010
Description TOSHIBA Transistor Silicon NPN Epitaxial Type (PCT Process)

File Size 143.83K  /  4 Page

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Amphenol Communications Solutions

Part No. 10119333-101-15LF
Description BergStik®, Board to Board connector, Unshrouded horizontal header, Surface mount, Single Row, 15 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    STMicroelectronics N.V.
STMICROELECTRONICS[STMicroelectronics]
SGS Thomson Microelectronics
Part No. AM1011-070 2702
Description RF & Microwave Transistors L-Band Avionics Applications(用于L波段航空电子应答询问机脉冲输出和驱动的RF和微波晶体管) 射频
From old datasheet system
RF & MICROWAVE TRANSISTORS L-BAND AVIONICS APPLICATIONS

File Size 42.50K  /  4 Page

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Amphenol Communications Solutions

Part No. 10114829-10110LF
Description 1.25mm Wire to Board Wafer, Vertical, Through Hole, 10 Positions
Tech specs    

Official Product Page

    Wing Shing Computer Com...
WINGS[Wing Shing Computer Components]
Part No. 2SA1011
Description PNP EPITAXIAL SILICON TRANSISTOR(LOW FREQUENCY POWER AMPLIFIER)

File Size 68.32K  /  1 Page

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Amphenol Communications Solutions

Part No. 10114831-10113LF
Description 1.25mm Wire-to-Board Connector System WAFER THROUGH HOLE RIGHT ANGLE, 13 POSITIONS, TIN PLATING
Tech specs    

Official Product Page

    EIC1011-4

Excelics Semiconductor, Inc.
Part No. EIC1011-4
Description 10.70-11.70GHz 4-Watt Internally-Matched Power FET

File Size 153.16K  /  4 Page

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Amphenol Communications Solutions

Part No. 10114831-10114LF
Description 1.25mm Wire-to-Board Connector System WAFER THROUGH HOLE RIGHT ANGLE, 14 POSITIONS, TIN PLATING
Tech specs    

Official Product Page

    EIC1011-8

Excelics Semiconductor, Inc.
Part No. EIC1011-8
Description 10.70-11.70GHz 8-Watt Internally Matched Power FET

File Size 114.37K  /  2 Page

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Amphenol Communications Solutions

Part No. 10114829-10114LF
Description 1.25mm Wire to Board Wafer, Vertical, Through Hole, 14 Positions
Tech specs    

Official Product Page

    LRN1011-50

LinkCom Manufacturing Co., Ltd.
Part No. LRN1011-50
Description Single Port, Through Hole, Tab Down RJ45 Connectors

File Size 19.89K  /  1 Page

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Amphenol Communications Solutions

Part No. 10114828-10115LF
Description 1.25mm Wire to Board Wafer,Vertical, Surface Mount, 15 Positions
Tech specs    

Official Product Page

    LAN1011-80

LinkCom Manufacturing Co., Ltd.
Part No. LAN1011-80
Description 10/100BASE-Tx Magnetics Module

File Size 44.84K  /  1 Page

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Amphenol Communications Solutions

Part No. 10114830-10111LF
Description 1.25mm Wire to Board Wafer, Right Angle, Surface Mount, 11 Positions
Tech specs    

Official Product Page

    Fuji
Part No. 2SK1011 2SK1011-01
Description N-Channel Mos-fet

File Size 164.34K  /  4 Page

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Amphenol Communications Solutions

Part No. 10114829-10115LF
Description 1.25mm Wire to Board Wafer, Vertical, Through Hole, 15 Positions
Tech specs    

Official Product Page

    3021011-06

Qualtek Electronics Corporation
Part No. 3021011-06
Description USB 4P(A)/M - BLUNT CUT

File Size 374.32K  /  1 Page

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Amphenol Communications Solutions

Part No. 10114831-10115LF
Description 1.25mm Wire-to-Board Connector System WAFER THROUGH HOLE RIGHT ANGLE, 15 POSITIONS, TIN PLATING
Tech specs    

Official Product Page

For 87639-1011 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | <11> | 12 | 13 | 14 | 15 |   

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