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  87639-1011 Datasheet PDF File

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    87639-1011 0876391011

Molex Electronics Ltd.
Part No. 87639-1011 0876391011
Description 1.27mm (.050") Pitch DDR DIMM Socket, Reverse Footprint, 25掳 Angle, Low Profile, Single Key, with Beveled Metal Pins and Plastic Pegs, 3.56mm (.140") Tail Lengt
1.27mm (.050) Pitch DDR DIMM Socket, Reverse Footprint, 25° Angle, Low Profile, Single Key, with Beveled Metal Pins and Plastic Pegs, 3.56mm (.140) Tail Length

File Size 336.72K  /  7 Page

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Amphenol Communications Solutions

Part No. 10118085-101-12LF
Description Unshrouded Right Angle header,Surface Mount, Double Row, 12 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    MOLEX INC
Part No. 87639-1100
Description 1.27mm 25Deg Rev DDR DIMM .76AuLF 184Ckt

File Size 310.46K  /  5 Page

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Amphenol Communications Solutions

Part No. 10119333-101-15LF
Description BergStik®, Board to Board connector, Unshrouded horizontal header, Surface mount, Single Row, 15 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    87639-1001 0876391001

Molex Electronics Ltd.
Part No. 87639-1001 0876391001
Description 1.27mm (.050) Pitch DDR DIMM Socket, Reverse Footprint, 25掳 Angle, Low Profile, Single Key, with Beveled Metal Pins and Plastic Pegs, 2.79mm (.110) Tail Length
1.27mm (.050) Pitch DDR DIMM Socket, Reverse Footprint, 25° Angle, Low Profile, Single Key, with Beveled Metal Pins and Plastic Pegs, 2.79mm (.110) Tail Length

File Size 336.72K  /  7 Page

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Amphenol Communications Solutions

Part No. 10114829-10110LF
Description 1.25mm Wire to Board Wafer, Vertical, Through Hole, 10 Positions
Tech specs    

Official Product Page

    87639-1010 0876391010

Molex Electronics Ltd.
Part No. 87639-1010 0876391010
Description 1.27mm (.050") Pitch DDR DIMM Socket, Reverse Footprint, 25掳 Angle, Low Profile,Single Key, with Beveled Metal Pins and Plastic Pegs, 3.18mm (.125") Tail Length
1.27mm (.050) Pitch DDR DIMM Socket, Reverse Footprint, 25° Angle, Low Profile,Single Key, with Beveled Metal Pins and Plastic Pegs, 3.18mm (.125) Tail Length,

File Size 336.72K  /  7 Page

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Amphenol Communications Solutions

Part No. 10114831-10113LF
Description 1.25mm Wire-to-Board Connector System WAFER THROUGH HOLE RIGHT ANGLE, 13 POSITIONS, TIN PLATING
Tech specs    

Official Product Page

    87639-1110 0876391110

Molex Electronics Ltd.
Part No. 87639-1110 0876391110
Description 1.27mm (.050) Pitch DDR DIMM Socket, Reverse Footprint, 25° Angle, Low Profile, Single Key, with Beveled Metal Pins and Plastic Pegs, 3.18mm (.125) Tail Length

File Size 336.72K  /  7 Page

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Amphenol Communications Solutions

Part No. 10114831-10114LF
Description 1.25mm Wire-to-Board Connector System WAFER THROUGH HOLE RIGHT ANGLE, 14 POSITIONS, TIN PLATING
Tech specs    

Official Product Page

    87639-1100 0876391100

Molex Electronics Ltd.
Part No. 87639-1100 0876391100
Description 1.27mm (.050) Pitch DDR DIMM Socket, Reverse Footprint, 25° Angle, Low Profile, Single Key, with Beveled Metal Pins and Plastic Pegs, 2.79mm (.110) Tail Length

File Size 336.72K  /  7 Page

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Amphenol Communications Solutions

Part No. 10114829-10114LF
Description 1.25mm Wire to Board Wafer, Vertical, Through Hole, 14 Positions
Tech specs    

Official Product Page

    ITT, Corp.
Part No. MZCK03P1011/KS35D
Description MAGNETIC FIELD SENSOR-MAGNETORESISTIVE, 4-4mT, 200mA, PA66

File Size 81.18K  /  1 Page

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Amphenol Communications Solutions

Part No. 10114828-10115LF
Description 1.25mm Wire to Board Wafer,Vertical, Surface Mount, 15 Positions
Tech specs    

Official Product Page

    Integrated Circuit Technology Corp
Part No. MZTK06N1011/KS35D
Description MAGNETIC FIELD SENSOR-MAGNETORESISTIVE, 4-4mT, 200mA, RECTANGULAR

File Size 81.64K  /  1 Page

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Amphenol Communications Solutions

Part No. 10114830-10111LF
Description 1.25mm Wire to Board Wafer, Right Angle, Surface Mount, 11 Positions
Tech specs    

Official Product Page

    03-06-1011

Molex Electronics Ltd.
Part No. 03-06-1011
Description 1.57mm Diameter Standard .062 Pin and Socket Receptacle Housing, 1 Circuits

File Size 30.14K  /  2 Page

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Amphenol Communications Solutions

Part No. 10114829-10115LF
Description 1.25mm Wire to Board Wafer, Vertical, Through Hole, 15 Positions
Tech specs    

Official Product Page

    EM-1011

Asahi Kasei Microsystems
Part No. EM-1011
Description EM-1011 is ultra-small Hall effect ICs of a single silicon chip composed of Hall element and a signal processing IC

File Size 129.12K  /  3 Page

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Amphenol Communications Solutions

Part No. 10114831-10115LF
Description 1.25mm Wire-to-Board Connector System WAFER THROUGH HOLE RIGHT ANGLE, 15 POSITIONS, TIN PLATING
Tech specs    

Official Product Page

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