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SGS Thomson Microelectronics
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| Part No. |
AN483
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| OCR Text |
...connec- tions. figure 1 shows a bonded frame of a 20a windowlift motor driver that uses this method; the two types of bonding wire can be clearly seen. figure 2 shows the same ic after encapsulation with black molding resin and removal of t... |
| Description |
MIXED WIRE BONDING TECHNOLOGY FOR AUTOMOTIVE SMART POWER ICs
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| File Size |
307.34K /
4 Page |
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it Online |
Download Datasheet
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ST Microelectronics
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| Part No. |
STV0042A
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| OCR Text |
...w 1% is required. a 12v double bonded main power pin for the audio/fm section of the chip. the two bond connections are to the esd and to power the circuit and on chip regulators/references. a gnd l this ground pin is double bonded : 1) to... |
| Description |
SATELLITE SOUND AND VIDEO PROCESSORS
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| File Size |
238.00K /
24 Page |
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it Online |
Download Datasheet |
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Arizona Microtek, Inc.
Electronic Theatre Controls, Inc.
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| Part No. |
AZ10/100EP16VSL AZ100EP16VSD
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| OCR Text |
...? 2v. 2. boost is internally bonded to v ee for both the soic 8 and tssop 8 packages. 3. supported in mlp 16 package only. 10k lvpecl dc characteristics (v ee = gnd, v cc = +3.3v) -40 c 0 c 25 c 85 c symbol characteristi... |
| Description |
ECL/PECL Differential Receiver with Variable Output Swing ECL / PECL的差分接收器输出变秋
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| File Size |
121.55K /
10 Page |
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it Online |
Download Datasheet |
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