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For placement Found Datasheets File :: 13775    Search Time::2.656ms    
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    TGA4046

TriQuint Semiconductor
Part No. TGA4046
OCR Text ... nitrogen atmosphere. component placement and adhesive attachment assembly notes: vacuum pencils and/or vacuum collets are the preferred method of pick up. air bridges must be avoided during placement. the force impact is critical ...
Description Q-Band Driver Amplifier

File Size 116.21K  /  9 Page

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    TGA4043

TriQuint Semiconductor
Part No. TGA4043
OCR Text ... nitrogen atmosphere. component placement and adhesive attachment assembly notes: vacuum pencils and/or vacuum collets are the preferred method of pick up. air bridges must be avoided during placement. the force impact is critical ...
Description Q-Band Driver Amplifier

File Size 145.98K  /  7 Page

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    TriQuint Semiconductor,Inc.
TriQuint Semiconductor, Inc.
Part No. TGA1055-EPU
OCR Text ...y nitrogen atmosphere component placement and adhesive attachment assembly notes: vacuum pencils and/or vacuum collets preferred method of pick up avoidance of air bridges during placement force impact critical during auto placement ...
Description Ka Band 2 Watt Power Amplifier Ka波段2瓦功率放大器

File Size 482.71K  /  3 Page

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    ECMF02-2AMX6

ST Microelectronics
STMicroelectronics
Part No. ECMF02-2AMX6
OCR Text ...to orient the component for its placement on a pcb. only pin 1 mark is to be used for this purpose. table 3. qfn-6l dimensions ref. dimensions millimeters inches min. typ. max. min. typ. max. a 0.45 0.50 0.55 0.018 0.020 0.022 a1...
Description Common-mode filter and ESD protection for USB 2.0 and MIPI/MDDI interfaces
Common mode filter with ESD protection for USB 2.0 and MIPI D-PHY/MDDI interface

File Size 365.64K  /  15 Page

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    PIC18F86J50

Microchip Technology
Part No. PIC18F86J50
OCR Text ...62 61 note 1: the eccp2/p2a pin placement depends on the setting of the ccp2mx configuration bit. ? 2007 microchip technology inc. preliminary ds39775b-page 3 pic18f87j50 family pin diagrams (continued) 80-pin tqfp pic18f8xj5x 3 4 5 6 ...
Description (PIC18FxxJ50) 1-Mbit Flash USB Microcontrollers

File Size 4,765.54K  /  480 Page

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    TGA4521-EPU

TriQuint Semiconductor
Part No. TGA4521-EPU
OCR Text ... nitrogen atmosphere. component placement and adhesive attachment assembly notes: vacuum pencils and/or vacuum collets are the preferred method of pick up. air bridges must be avoided during placement. the force impact is critical ...
Description 32 to 47 GHz Wide Band Driver Amplifier

File Size 164.98K  /  10 Page

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    HSP061-8M16

STMicroelectronics
Part No. HSP061-8M16
OCR Text ...wder particle size 20-45 m. 4.2 placement 1. manual positioning is not recommended. 2. it is recommended to use the lead recognition capabilities of the placemen t system, not the outline centering. 3. standard tolerance of 0.05 mm is...
Description 8-line ESD protection for high speed lines

File Size 163.73K  /  10 Page

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    HSP061-4NY8

STMicroelectronics
Part No. HSP061-4NY8
OCR Text ...wder particle size 20-45 m. 4.2 placement 1. manual positioning is not recommended. 2. it is recommended to use the lead recognition capabilities of the placemen t system, not the outline centering. 3. standard tolerance of 0.05 mm is...
Description 4-line ESD protection for high speed lines

File Size 184.13K  /  10 Page

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    UPD16663N-XXX

NEC
Part No. UPD16663N-XXX
OCR Text ...signals pl0 i specifies the lsi placement position (no. 0 to 3) pl1 i specifies the lsi placement position (no. 0 to 3) dir i specifies the direction of the lcd panel placement ms i selects between master/slave ("h" sets master mode) bmode ...
Description 240-output built-in RAM LCD column(segment) driver

File Size 309.64K  /  40 Page

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    TriQuint Semiconductor, Inc.
Part No. TGS4304
OCR Text ... nitrogen atmosphere. component placement and adhesive attachment assembly notes: ? vacuum pencils and/or vacuum collets are the preferred method of pick up. ? air bridges must be avoided during placement. ? the force impact is critic...
Description
File Size 408.95K  /  10 Page

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