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For bonded Found Datasheets File :: 4309 Search Time::1.297ms
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				Intersil Corporation Intersil, Corp.
Part No.	HS0-6254RH-Q HS1-6254RH HS-6254RH 5962F9764101VXC 5962F9764101VEC HS1-6254RH/SAMPLE HS1B-6254RH-Q 5962F9764101VEA HS1-6254RH-Q HS9-6254RH-Q
OCR Text	... a common substrate. One of our bonded wafer, dielectrically isolated fabrication processes provides an immunity to Single Event Latch-up and the capability of highly reliable performance in any radiation environment. The high FT (8GHz) and...
Description	Radiation Hardened Ultra High Frequency NPN Transistor Array(抗辐射甚高频NPN晶体管阵 1500PF 50V 0805 BJT Radiation Hardened Ultra High Frequency NPN Transistor Array 辐射加固超高频NPN晶体管阵
File Size	30.64K / 3 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation Hittite Microwave Corporati...
Part No.	HMC26009
OCR Text	...made with the chip mounted and bonded into in a 50 ohm test fi xture. data includes the parasitic effects of wire bond assembly. connections were made with a 3 mil rib- bon bond with minimal length (<12 mil). parameter lo = +13 dbm, if...
Description	GaAs MMIC FUNDAMENTAL MIXER, 14 - 26 GHz
File Size	224.64K / 6 Page	View it Online	Download Datasheet

				Mindspeed Technologies
Part No.	M02140-XX
OCR Text	... Not connected. (Not internally bonded, can be connected to any DC potential including ground) Enables setting of output voltage swing from 400 mVpp differential to 800 mVpp differential using an external 1% resistor (RAMPSET) to ground Gro...
Description	Low Power 3.3V Limiting Amplifier For Applications to 12.5 Gbps Low Power 3.3 Volt Limiting Amplifier
File Size	400.00K / 20 Page	View it Online	Download Datasheet

				KINGBRIGHT Holtek Semiconductor Inc
Part No.	KB2835 HT82M99AE HT82M99EE
OCR Text	... purpose. The two dice are wire-bonded to form HT82M99EE/HT82M99AE. Rev. 1.00 1 February 8, 2006 HT82M99EE/HT82M99AE Block Diagram U S B D + /C L K U S B D -/D A T A V33O U S B 1 .1 PS2 BP In te rru p t C ir c u it STACK P ...
Description	LED LIGHT BARS USB Mouse Encoder 8-Bit MCU
File Size	361.48K / 47 Page	View it Online	Download Datasheet

				Intersil Corporation
Part No.	HS-1254RH HS9-1254RH HS9-1254RH-Q 5962R9858101VXC
OCR Text	...ments. Dielectric isolation and bonded wafer processing make this device immune to latch-up (SEL). Excellent dynamic characteristics, coupled with the disable function, make this amplifier well-suited for a variety of satellite system appli...
Description	Radiation Hardened/ High Speed/ Low Power Dual Operational Amplifier with Disable Radiation Hardened, High Speed, Low Power Dual Operational Amplifier with Disable
File Size	18.33K / 3 Page	View it Online	Download Datasheet

				Intersil Corporation Intersil, Corp.
Part No.	HS-1410RH 5962F9851801VXC HS9-1410RH-Q
OCR Text	...omplementary bipolar UHF-1 (DI, bonded wafer) process. This technology provides an immunity to Single Event Latch-up and the capability of highly reliable performance in any radiation environment. These devices are QML approved and are manu...
Description	Radiation Hardened/ High Speed/ Low Power/ Current Feedback Op Amp with Output Disable CAP 4-ARRAY 47000PF 16V X7R 1206 Radiation Hardened, High Speed, Low Power, Current Feedback Op Amp with Output Disable(抗辐射高速、低功耗电流反馈放大器（输出禁止）) Radiation Hardened, High Speed, Low Power, Current Feedback Op Amp with Output Disable OP-AMP, PDFP10
File Size	22.21K / 2 Page	View it Online	Download Datasheet

				Holtek Semiconductor Inc
Part No.	HT46R48E
OCR Text	... purpose. The two dice are wire-bonded to form HT46R48E. The advantages of low power consumption, I/O flexibility, programmable frequency divider, timer functions, oscillator options, multi-channel A/D Converter, Pulse Width Modulation func...
Description	Cost-Effective A/D Type 8-Bit OTP MCU
File Size	331.92K / 46 Page	View it Online	Download Datasheet

				HOLTEK[Holtek Semiconductor Inc]
Part No.	HT46R47E HT46C47E
OCR Text	... purpose. The two dice are wire-bonded to form HT46R47E/ HT46C47E. The advantages of low power consumption, I/O flexibility, programmable frequency divider, timer functions, oscillator options, multi-channel A/D Converter, Pulse Width Modul...
Description	Cost-Effective A/D Type 8-Bit MCU
File Size	329.65K / 45 Page	View it Online	Download Datasheet

				Holtek Semiconductor Inc
Part No.	HT46R46E HT46C46E
OCR Text	... purpose. The two dice are wire-bonded to form HT46R46E/ HT46C46E. The advantages of low power consumption, I/O flexibility, programmable frequency divider, timer functions, oscillator options, multi-channel A/D Converter, Pulse Width Modul...
Description	Cost-Effective A/D Type 8-Bit MCU
File Size	310.98K / 45 Page	View it Online	Download Datasheet

				SiGe Semiconductor, Inc.
Part No.	SE1000W
OCR Text	... chip. Only one pad needs to be bonded. Input pad (connect to photodetector cathode). Negative supply (0V) - Note this is separate ground for the input stage, which is AC coupled on chip. There is no DC current through this pad. Bond option...
Description	Amplifier, Light Charger 155 Mb/s Transimpedance Amplifier
File Size	224.51K / 9 Page	View it Online	Download Datasheet

For bonded Found Datasheets File :: 4309 Search Time::1.297ms
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