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意法半导 STMicroelectronics N.V.
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Part No. |
M36W416TG85ZA1T M36W416TG70ZA6T M36W416TG-ZAT M36W416TG70ZA1T M36W416BG70ZA1T
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OCR Text |
... inputs figure 1. packages fbga stacked lfbga66 (za) 12 x 8mm
m36w416tg, m36w416bg 2/62 table of contents summary description . . . . . . ...chip enable (ef). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .... |
Description |
16 Mbit 1Mb x16, Boot Block Flash Memory and 4Mbit 256Kb x16 SRAM, Multiple Memory Product CANMS3470L16-23PL/C 16兆x16插槽,开机区块快闪记忆体Mbit的SRAM56Kb x16,内存产品多
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File Size |
444.48K /
62 Page |
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IBM Microeletronics
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Part No. |
IBM03164B9C IBM0316809C
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OCR Text |
...ttl i/o interface levels. a stacked version of the x 4 component is also offered. these synchronous devices achieve high speed data transfer rates of up to 125 mhz. the chip is fabricated with ibms advanced 16mbit cmos dram process tech... |
Description |
16Mb Synchronous DRAM(16M位同步动态RAM) 16MbMbit x 8 I/O x 2 Bank)Synchronous DRAM(16M位(1Mx 8 I/O x 2 组)同步动态RAM)
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File Size |
1,551.23K /
120 Page |
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it Online |
Download Datasheet
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Price and Availability
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