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ADVANCED INTERCONNECTIONS CORP
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Part No. |
RLS448-237GG RLS448-01GG
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OCR Text |
...lloy (c17200) astm-b-194 solder preform: standard: 63sn/37pblead-free: 95.5sn/4.0ag/0.5cu plating: g - gold over nickelm - matte t in over nickel t - t in/lead over nickel gold per mil-g-45204matte t in per astm545-97 t in/lead per mil-p-81... |
Description |
DIP48, IC SOCKET
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File Size |
188.46K /
2 Page |
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it Online |
Download Datasheet |
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ADVANCED INTERCONNECTIONS CORP
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Part No. |
1RSX004-234MG 1KSX004-234GG 1KSX004-234TT
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OCR Text |
...pper (c17200) astm-b-194 solder preform: standard: 63sn/37pblead-free: 95.5sn/4.0ag/0.5cu plating: g - gold over nickelm - matte t in over nickel t - t in/lead over nickel gold per astm-b-488matte t in per astm545-97 t in/lead per mil-p-817... |
Description |
PGA4, IC SOCKET
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File Size |
210.74K /
2 Page |
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it Online |
Download Datasheet |
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MIMIX BROADBAND INC
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Part No. |
CF003-03-000X
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OCR Text |
...ie attach: conductive epoxy or preform die attach is recom- mended. for preform die attach: preform: ausn (80% au, 20% sn); stage temperature: 290 oc, +/-5 oc; handling tool: tweezers; time: 1 min or less. wire bonding: wire size: 0.7 t... |
Description |
K BAND, GaAs, N-CHANNEL, RF POWER, HEMFET
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File Size |
859.38K /
4 Page |
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it Online |
Download Datasheet |
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Price and Availability
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