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  MOLEXINC-03-09-2161 Datasheet PDF File

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Part No. MOLEXINC-03-09-2161
Description
File Size 91.44K  /  2 Page

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HUA FENG CIRCUIT





    K2161

Sanyo Semicon Device
Part No. K2161
Description Search --To 2SK2161

File Size 126.35K  /  4 Page

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Part No. 22161
Description Pioneering the Ubiquitous Home Network: New AMD Silicon Solutions for Phone Line Networking - (PDF)

File Size 212.65K  /  7 Page

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    AD216 2161

Analog Devices
Part No. AD216 2161
Description High Speed, Logic Isolator
From old datasheet system

File Size 128.81K  /  6 Page

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    http://
Part No. 90571-2161
Description 2.54mm (.100) Pitch QF-50?/a> Header, Vertical, Dual Row, Shrouded, DIN Keying, 16 Circuits, 0.1 μm Gold (Au)

File Size 358.77K  /  5 Page

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    90572-2161

Molex Electronics Ltd.
Part No. 90572-2161
Description 2.54mm (.100) Pitch QF-50 Header, Right Angle, Dual Row, Shrouded, DIN Keying, with Latch/Eject Levers, 16 Circuits, 0.1 μm Gold (Au)

File Size 277.07K  /  5 Page

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    KA2161

Samsung Electronic
Samsung semiconductor
Part No. KA2161
Description PAL/NTSC 1 CHIP FOR C/TV

File Size 309.36K  /  21 Page

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    KA2161

Samsung semiconductor
Part No. KA2161
Description pal/ntsc 1 chip ic for color television

File Size 313.96K  /  21 Page

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    1-102161-2

Tyco Electronics
Part No. 1-102161-2
Description HEADER ASSY, UNIVERSAL, AMP-LATCH

File Size 226.83K  /  2 Page

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    MOLEX INC
Part No. MOLEXINC-C-336-08 C-101-38
Description 5 mm2, COPPER ALLOY, RING TERMINAL

File Size 101.08K  /  1 Page

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