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TE Connectivity Ltd
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| Part No. |
2018280--1 2018280--2 2018280--3 2018280--4
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| OCR Text |
... should have flat surfaces with holes or a channel large enough and deep enough to receive any protruding components of the connector and cage assembly and to prevent the pc board from bowing. 3.2. application tool power for seating tools m... |
| Description |
Small Form- Factor Pluggable (SFP) Seating
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| File Size |
110.91K /
4 Page |
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it Online |
Download Datasheet
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Advanced Semiconductor ...
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| Part No. |
ALN2505AT ALN2505AT-17
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| OCR Text |
...e number and size of ground via holes in a circuit board is criti cal for thermal rf grounding consider a tions. 2. we recommend that the ground via holes be placed on the bottom of all ground pins for better rf and... |
| Description |
Internally Matched LNA Module
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| File Size |
224.71K /
4 Page |
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it Online |
Download Datasheet |
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Advanced Semiconductor ...
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| Part No. |
ALN2504AT-17
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| OCR Text |
...e number and size of ground via holes in a circuit board is critical for thermal rf groundin g consider a tions. 2. we recommend that the ground via holes be placed on the bottom of all ground pins for better rf and... |
| Description |
Internally Matched LNA Module
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| File Size |
360.61K /
4 Page |
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it Online |
Download Datasheet |
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Advanced Semiconductor ...
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| Part No. |
ALN2503AT ALN2503AT-17
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| OCR Text |
...e number and size of ground via holes in a circuit boar d is critical for thermal rf grounding consider a tions. 2. we recommend that the ground via holes be placed on the bottom of all ground pins for better rf and... |
| Description |
Internally Matched LNA Module
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| File Size |
318.11K /
3 Page |
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it Online |
Download Datasheet |
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Advanced Semiconductor ...
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| Part No. |
ALN2502AT ALN2502AT-17
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| OCR Text |
...e number and size of ground via holes in a circuit board is critical for thermal rf grounding consider a tions. 2. we recommend that the ground via holes be placed on the bottom of all ground pins for better rf and... |
| Description |
Internally Matched LNA Module
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| File Size |
316.90K /
3 Page |
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it Online |
Download Datasheet |
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Advanced Semiconductor ...
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| Part No. |
ALN2501AT ALN2501AT-17
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| OCR Text |
...e number and size of ground via holes in a circuit board is critical for thermal rf grounding consider a tions. 2. we recommend that the ground via holes be placed on the bottom of all ground pins for better rf an... |
| Description |
Internally Matched LNA Module
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| File Size |
371.84K /
4 Page |
View
it Online |
Download Datasheet |
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Price and Availability
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