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For heat Found Datasheets File :: 62769 Search Time::1.594ms
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				Panasonic Semiconductor
Part No.	ERG-1SJ221A
OCR Text	...ze 0.5 w to 5 w small size anti-heat conducting type (fe lead wire) 1 w to 5 w style speci?cation j g 5 % 2 % resistance tolerance resistance value e 1 r 2 x 3 4 2 5 sz w 6 j 7 8 1 9 r 10 0e 11 12 p v uv e we h se straight lead wir...
Description	Metal (Oxide) Film Resistors
File Size	153.54K / 7 Page	View it Online	Download Datasheet

				Panasonic
Part No.	2SK1803
OCR Text	...100 120 (1) t c =ta (2) without heat sink (p d =3.0w) (1) (2) ambient temperature ta ( ?c ) allowable power dissipation p d ( w ) 1 10 100 1000 3 30 300 0.01 0.1 1 10 100 0.03 0.3 3 30 non repetitive pulse t c =25?c i dp i d dc ...
Description	Silicon N-Channel Power F-MOS FET
File Size	172.50K / 4 Page	View it Online	Download Datasheet

				Fujitsu
Part No.	ASYA09LGC ASYA07LGC
OCR Text	.../ specifications t ype cool & heat inverter i ndoor unit asya12lgc o utdoor unit aoyr12lgc cooling capacity 3 . 4 0 k w heating capacity 4 . 0 0 k w power source 2 3 0 v f requency 5 0 hz running current m aximum current 4 . 3 a...
Description	ROOM AIR CONDITIONER Service Manual
File Size	4,052.22K / 22 Page	View it Online	Download Datasheet

				Welwyn Components Limited
Part No.	LRCS0805 LRCS0402 LRCS0603-R025FT10 LRCS LRCS0603-R025JT5 LRCS0603
OCR Text	...(6.25 x rated power for 5s) Dry heat (96Hrs, no load, +155C) Temperature rapid change (-55 / +150C, 100 cycles) Damp heat steady state Resistance to solder heat (260C for 10s) Low Temperature Operation Insulation Resistance R% R% R% R% R% R...
Description	SMALL SIZE LOW VALUE CURRENT SENSE SURFACE MOUNT CHIP RESISTORS
File Size	354.97K / 2 Page	View it Online	Download Datasheet

				Amkor Technology
Part No.	MQFPPOWERQUAD2
OCR Text	...hich readily extracts generated heat under demand situations. To enhance the thermal conduction from the IC to the mounting surface, the internal package leads are mechanically connected, yet electrically isolated, by a proprietary process ...
Description	Exceptional thermal and electrical performance by design include the following
File Size	90.38K / 2 Page	View it Online	Download Datasheet

				VISHAY SILICONIX
Part No.	SI2306BDS-T1-E3
OCR Text	...en been modified to provide the heat transfer capabilities required by power devices. leadframe materials and design, molding compounds, and die attach materials have been changed, while the footprint of the packages remains the same. see a...
Description	3160 mA, 30 V, N-CHANNEL, Si, SMALL SIGNAL, MOSFET, TO-236
File Size	205.69K / 8 Page	View it Online	Download Datasheet

For heat Found Datasheets File :: 62769 Search Time::1.594ms
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