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TRIQUINT[TriQuint Semiconductor]
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Part No. |
TQHBT3
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OCR Text |
foundry Service
Features
Metal 2 - 4um
TQHBT3
* * * * *
MIM Metal 0 Isolation Implant
Dielectric Metal 1 - 2um Dielectric
E B C
Emitter
Metal 1 - 2um
B C
NiCr
Base Collector
* * *
Sub Collector Buffer & Subst... |
Description |
InGaP HBT foundry Service
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File Size |
116.93K /
6 Page |
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it Online |
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TRIQUINT[TriQuint Semiconductor]
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Part No. |
TQHIP
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OCR Text |
foundry Service
TQHiP
Air Bridge - 4um
Features
* *
Metal 1
Metal 1 - 2 um
MIM Metal
NiCr
Metal 0 N+ N+ Isolation Implant N-/P- Channel
* * * * *
D MESFET
MIM Capacitor Semi-Insulating GaAs Substrate
NiCr ... |
Description |
Precision, 100UA Gain Selectable Amplifier
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File Size |
116.18K /
4 Page |
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it Online |
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TRIQUINT[TriQuint Semiconductor]
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Part No. |
TQPED
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OCR Text |
foundry Service
Features
Metal 2 Dielectric Metal 2 - 4um
TQPED
* * * * *
Dielectric Metal 1 - 2um
Metal 1
Metal 1 Dielectric
MIM Metal
NiCr
Nitride N+ Pseudomorphic Channel
Metal 0
Isolation Implant Isolation ... |
Description |
Precision, 100UA Gain Selectable Amplifier
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File Size |
96.58K /
3 Page |
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it Online |
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TRIQUINT[TriQuint Semiconductor]
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Part No. |
TQPHT
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OCR Text |
foundry Service
Features
Metal 2 Dielectric Metal 1 Dielectric
MIM Metal
Metal 2 - 4um Dielectric Metal 1 - 2um
* * * * *
Metal 1
NiCr Isolation Implant Isolation Implant
Nitride N+ Pseudomorphic Channel
Metal 0
pHEM... |
Description |
0.5 um pHEMT foundry Service
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File Size |
204.87K /
5 Page |
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it Online |
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DIODES INC
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Part No. |
SBR10U200CTB-13-G
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OCR Text |
...product type marking code a b = foundry and assembly code yyww = date code marking yy = last two digits of year (ex: 06 = 2006) ww = week (01 - 53) sbr10u200ct = product type marking code a b = foundry and assembly code yyww = date c... |
Description |
5 A, 200 V, SILICON, RECTIFIER DIODE
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File Size |
158.83K /
5 Page |
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it Online |
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TRIQUINT[TriQuint Semiconductor]
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Part No. |
TQRLC
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OCR Text |
foundry Service GaAs Passives foundry Service
Features
* *
TQRLC TQTRx
* * * * * *
Thick 4 Layer Metal; > 9 m total thickness High Density Interconnects: * 3 Global * 1 Local High-Q Passives; Inductor Q >50 @ 2 GHz Low Cost: Pass... |
Description |
Advanced Passives foundry Service
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File Size |
391.85K /
3 Page |
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it Online |
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Infineon
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Part No. |
S-GOLD3H
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OCR Text |
... to 100% 100% Surplus volume in foundry Surplus volume in foundry First ramp of technology in foundry, First ramp of technology in foundry, then, transfer to in-house then, transfer to in-house manufacturing as second step manufacturing as ... |
Description |
Presentation of Prof. Dr. Hermann Eul on the occation of a press briefing on February 10 in Munich
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File Size |
6,972.21K /
20 Page |
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it Online |
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TRIQUINT[TriQuint Semiconductor]
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Part No. |
TQTRX
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OCR Text |
foundry Service GaAs MESFET foundry Service
Passivation Via
TQTRp TQTRx
Features
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Metal 3
Metal 3 - 5 um
Metal 2
Dielectric
Metal 2 - 2 um
* *
Metal 1 Dielectric
Metal 1
Metal 1 - 2 um Dielectric
MIM Met... |
Description |
Advanced Passives & MESFET foundry Service
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File Size |
172.25K /
6 Page |
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it Online |
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Price and Availability
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