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20S0301K 1N4759 APE1085P MBSK14S ADC305 5N60C 70028 EM78M61
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  footprints Datasheet PDF File

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    FUSIONQUAD

Amkor Technology
Part No. FUSIONQUAD
Description Increased I/O (116 to 356) in smaller package footprints

File Size 378.71K  /  2 Page

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Part No. AS218-000 AS221-306
Description Land Pattern and Surface Mount Guide (footprints)|DC-6 GHz Plastic Packaged and Chip|SPST

File Size 481.13K  /  5 Page

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    652000

Aries Electronics, Inc.
Part No. 652000
Description    Converts PLCC packaged ICs to DIP footprints

File Size 308.84K  /  1 Page

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