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  dual row thru hole header Datasheet PDF File

For dual row thru hole header Found Datasheets File :: 150+       Page :: | <1> | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    87914-2815 0879142815

Molex Electronics Ltd.
Part No. 87914-2815 0879142815
Description 2.54mm (.100) Pitch C-Grid? header, Through hole, dual row, Vertical, 28 Circuits, 0.75μm (30μ) Gold (Au) Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid庐 header, Through hole, dual row, Vertical, 28 Circuits, 0.75渭m (30渭) Gold (Au) Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid垄莽 header, Through hole, dual row, Vertical, 28 Circuits, 0.75楼矛m (30楼矛) Gold (Au) Plating, Tray Packaging, Lead-free

File Size 3,777.37K  /  48 Page

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    87914-3616 0879143616

Molex Electronics Ltd.
Part No. 87914-3616 0879143616
Description 2.54mm (.100) Pitch C-Grid? header, Through hole, dual row, Vertical, 36 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid庐 header, Through hole, dual row, Vertical, 36 Circuits, 2.50渭m (98.4渭) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid垄莽 header, Through hole, dual row, Vertical, 36 Circuits, 2.50楼矛m (98.4楼矛) Tin (Sn) Overall Plating, Tray Packaging, Lead-free

File Size 3,779.41K  /  48 Page

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    87914-2216 0879142216

Molex Electronics Ltd.
Part No. 87914-2216 0879142216
Description 2.54mm (.100) Pitch C-Grid? header, Through hole, dual row, Vertical, 22 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid庐 header, Through hole, dual row, Vertical, 22 Circuits, 2.50渭m (98.4渭) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid垄莽 header, Through hole, dual row, Vertical, 22 Circuits, 2.50楼矛m (98.4楼矛) Tin (Sn) Overall Plating, Tray Packaging, Lead-free

File Size 3,779.50K  /  48 Page

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    DMLXXA-V-G-TSMT30PPTR

Adam Technologies, Inc.
Part No. DMLXXA-V-G-TSMT30PPTR
Description dual row thru hole header

File Size 77.06K  /  1 Page

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    0877612001 87761-2001

Molex Electronics Ltd.
Part No. 0877612001 87761-2001
Description 2.00mm (.079) Pitch Milli-Grid header, dual row dual Body, Through hole, Vertical, 20 Circuits, 0.75μm (30μ) Gold (Au) Selective Plating

File Size 297.14K  /  5 Page

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    15-47-7512 0015477512 A-70568-0004

Molex Electronics Ltd.
Part No. 15-47-7512 0015477512 A-70568-0004
Description 2.54mm (.100) Pitch C-Grid? header, Through hole, dual row, Vertical, High Temperature, Shrouded, with Peg, 12 Circuits
2.54mm (.100) Pitch C-Grid庐 header, Through hole, dual row, Vertical, High Temperature, Shrouded, with Peg, 12 Circuits
2.54mm (.100) Pitch C-Grid垄莽 header, Through hole, dual row, Vertical, High Temperature, Shrouded, with Peg, 12 Circuits

File Size 377.43K  /  4 Page

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    15-80-0141 A-70567-0005 0015800141 705670005

Molex Electronics Ltd.
Part No. 15-80-0141 A-70567-0005 0015800141 705670005
Description 2.54mm (.100) Pitch C-Grid? header, Through hole without Peg, dual row, Vertical, Shrouded, High Temperature, 14 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid庐 header, Through hole without Peg, dual row, Vertical, Shrouded, High Temperature, 14 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid垄莽 header, Through hole without Peg, dual row, Vertical, Shrouded, High Temperature, 14 Circuits, Tin (Sn) Plating
Molex Electronics Ltd.

File Size 1,218.38K  /  7 Page

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    0015800281 70567-0012 15-80-0281

Molex Electronics Ltd.
Part No. 0015800281 70567-0012 15-80-0281
Description 2.54mm (.100) Pitch C-Grid? header, Through hole without Peg, dual row, Vertical, Shrouded, High Temperature, 28 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid庐 header, Through hole without Peg, dual row, Vertical, Shrouded, High Temperature, 28 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid垄莽 header, Through hole without Peg, dual row, Vertical, Shrouded, High Temperature, 28 Circuits, Tin (Sn) Plating
MOLEX Connector

File Size 1,218.43K  /  7 Page

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    15-80-0121 A-70567-0004 0015800121 705670004

Molex Electronics Ltd.
Part No. 15-80-0121 A-70567-0004 0015800121 705670004
Description 2.54mm (.100) Pitch C-Grid? header, Through hole without Peg, dual row, Vertical, Shrouded, High Temperature, 12 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid庐 header, Through hole without Peg, dual row, Vertical, Shrouded, High Temperature, 12 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid垄莽 header, Through hole without Peg, dual row, Vertical, Shrouded, High Temperature, 12 Circuits, Tin (Sn) Plating
Molex Electronics Ltd.

File Size 1,218.42K  /  7 Page

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    15-80-0101 70567-0003 A-70567-0003 0015800101

Molex Electronics Ltd.
Part No. 15-80-0101 70567-0003 A-70567-0003 0015800101
Description 2.54mm (.100) Pitch C-Grid? header, Through hole without Peg, dual row, Vertical, Shrouded, High Temperature, 10 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid庐 header, Through hole without Peg, dual row, Vertical, Shrouded, High Temperature, 10 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid垄莽 header, Through hole without Peg, dual row, Vertical, Shrouded, High Temperature, 10 Circuits, Tin (Sn) Plating
Molex Electronics Ltd.

File Size 1,218.41K  /  7 Page

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For dual row thru hole header Found Datasheets File :: 150+       Page :: | <1> | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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