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ST Microelectronics STMICROELECTRONICS[STMicroelectronics]
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Part No. |
dip40
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OCR Text |
Thermal Data
DIP 40
40 leads
PACKAGE MATERIAL LIST
item # material thickness thermal conductivity 2.61 W/cmC 0.01 W/cmC
leadframe die attach
copper epoxy glue ( silver filler ) epoxy resin
0.25 mm 10-40 m
molding com... |
Description |
Thermal Data
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File Size |
28.99K /
2 Page |
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NXP
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Part No. |
89V51RD2FA
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OCR Text |
...interrupt wake-up u idle mode n dip40, plcc44 and tqfp44 packages 3. ordering information 3.1 ordering options table 1. ordering information type number package name description version p89v51rb2fa plcc44 plastic leaded chip carrier; 44 lea... |
Description |
Search --To P89V51RD2FA
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File Size |
360.66K /
80 Page |
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NXP Semiconductors N.V.
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Part No. |
P89V52X2FBD157
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OCR Text |
... in-circuit programming (icp) n dip40, plcc44, and lqfp44 packages n six interrupt sources with four priority levels n second dptr register 2.2 additional features n very low power n low emi mode (ale inhibit) n power-down mode with externa... |
Description |
8-bit 80C51 low power 8 kB flash microcontroller with 256 B RAM, 192 B data EEPROM; Package: SOT389-1 (LQFP44); Container: Tray Pack, Bakeable, Multiple 8-BIT, FLASH, 40 MHz, MICROCONTROLLER, PQFP44
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File Size |
246.98K /
57 Page |
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it Online |
Download Datasheet
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Price and Availability
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