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  CM200HG-130H Datasheet PDF File

For CM200HG-130H Found Datasheets File :: 89+       Page :: | <1> | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 |   

    Powerex Power Semiconductor...
Part No. CM200HG-130H
Description Single IGBTMOD HVIGBT Module 200 Amperes/6500 Volts

File Size 216.58K  /  5 Page

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Amphenol Communications Solutions

Part No. 93992-130HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Header, Through Hole, Single Row, 30 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    CM200HG-130H

Mitsubishi Electric Semiconductor
Part No. CM200HG-130H
Description HVIGBT MODULES HIGH POWER SWITCHING USE INSULATED TYPE

File Size 97.85K  /  8 Page

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Amphenol Communications Solutions

Part No. 68405-130HLF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Double Row, 30 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

   
Part No. 130HF
Description STANDARD RECOVERY DIODES Stud Version

File Size 120.29K  /  6 Page

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Amphenol Communications Solutions

Part No. 68653-130HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Header, Through Hole, Single Row, 30 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    SMTT-130H-12 SMTT-130H-14 SMTT-130H-16 SMTT-130H-18 SMTT-130H-08 SMTT-130H SMTT-130H-20 SMTT-130H-22 SMTT-130H-24

SEMPO ELECTRONIC Limited
Part No. SMTT-130H-12 SMTT-130H-14 SMTT-130H-16 SMTT-130H-18 SMTT-130H-08 SMTT-130H SMTT-130H-20 SMTT-130H-22 SMTT-130H-24
Description THYRISTOR-THYRISTOR MODULE

File Size 41.82K  /  1 Page

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Amphenol Communications Solutions

Part No. 68002-130HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 30 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    SMDT-130H-12 SMDT-130H-14 SMDT-130H-16 SMDT-130H-18 SMDT-130H-08 SMDT-130H SMDT-130H-20 SMDT-130H-22 SMDT-130H-24

SEMPO ELECTRONIC Limited
Part No. SMDT-130H-12 SMDT-130H-14 SMDT-130H-16 SMDT-130H-18 SMDT-130H-08 SMDT-130H SMDT-130H-20 SMDT-130H-22 SMDT-130H-24
Description Diode-Thyristor Module

File Size 41.53K  /  1 Page

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Amphenol Communications Solutions

Part No. 92634-130HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 30 Positions, 2.54 mm Pitch, Right Angle, 8.08 mm (0.318in) Mating, 8.08 mm (0.318in) Tail.
Tech specs    

Official Product Page

    SMDD-130H-12 SMDD-130H-14 SMDD-130H-16 SMDD-130H-18 SMDD-130H-08 SMDD-130H SMDD-130H-20 SMDD-130H-22 SMDD-130H-24

SEMPO ELECTRONIC Limited
Part No. SMDD-130H-12 SMDD-130H-14 SMDD-130H-16 SMDD-130H-18 SMDD-130H-08 SMDD-130H SMDD-130H-20 SMDD-130H-22 SMDD-130H-24
Description DIODE-DIODE MODULE

File Size 40.68K  /  1 Page

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Amphenol Communications Solutions

Part No. 78548-130HLF
Description BERGSTIK II DR STRAIGHT-RET
Tech specs    

Official Product Page

    KO130H-A126

E-SWITCH
Part No. KO130H-A126
Description KEYLOCK SWITCHES

File Size 36.23K  /  1 Page

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Amphenol Communications Solutions

Part No. 87052-130HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 30 Positions, 2.54 mm Pitch, Vertical, 19.56 mm (0.77 in.) Mating, 3.05 mm (0.12 in.) Tail.
Tech specs    

Official Product Page

    Powerex Power Semiconductor...
Part No. CM600HG-130H
Description Single IGBTMOD HVIGBT Module 600 Amperes/6500 Volts

File Size 314.08K  /  5 Page

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Amphenol Communications Solutions

Part No. 92417-130HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 30 Positions, 2.54 mm Pitch, Vertical, 8.08 mm (0.318in) Mating, 2.79 mm (0.11in) Tail.
Tech specs    

Official Product Page

    CM600HG-130H

Mitsubishi Electric Semiconductor
Part No. CM600HG-130H
Description HIGH POWER SWITCHING USE INSULATED TYPE

File Size 103.84K  /  8 Page

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Amphenol Communications Solutions

Part No. 68464-130HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 30 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    SICK AG
Part No. WSE4S-3F3130H
Description    Through-beam photoelectric sensor

File Size 922.96K  /  5 Page

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Amphenol Communications Solutions

Part No. 68691-130HLF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 30 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

For CM200HG-130H Found Datasheets File :: 89+       Page :: | <1> | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 |   

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