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  b-die Datasheet PDF File

For b-die Found Datasheets File :: 23108    Search Time::1.609ms    
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    MPX2050DP MPX205008 MPX2050GP MPX2050GSX

Freescale Semiconductor, Inc
Part No. MPX2050DP MPX205008 MPX2050GP MPX2050GSX
OCR Text ... d 4 pl seating plane -t- c m j b -a- dambar trim zone: f this is included within dim. "f" 8 pl 1 23 4 y z style 1: pin 1. ground 2. + output 3. + supply 4. - output style 2: pin 1. v cc 2. - supply 3. + supply ...
Description 50 kPa On-Chip Temperature Compensated and Calibrated Silicon Pressure Sensors

File Size 121.31K  /  9 Page

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    HY5PS56821LF-C4 HY5PS56821LF-C5 HY5PS56821LF-E3 HY5PS56821LF-E4 HY5PS56821LF-Y5 HY5PS56821LF-Y6 HY5PS561621LF-C4 HY5PS56

HYNIX SEMICONDUCTOR INC
Part No. HY5PS56821LF-C4 HY5PS56821LF-C5 HY5PS56821LF-E3 HY5PS56821LF-E4 HY5PS56821LF-Y5 HY5PS56821LF-Y6 HY5PS561621LF-C4 HY5PS561621LF-C5 HY5PS561621LF-E3 HY5PS561621LF-E4 HY5PS561621LF-Y5 HY5PS561621LF-Y6 HY5PS56421LF-C4 HY5PS56421LF-C5 HY5PS56421LF-E3 HY5PS56421LF-E4 HY5PS56421LF-Y5 HY5PS56421LF-Y6 HY5PS56421F-C5 HY5PS56421F-C4 HY5PS561621F-Y6
OCR Text ...DQ DQ3 VSS WE BA1 A1 A5 A9 NC A B C D E F G H J K L 7 VSSQ DQS VDDQ DQ2 VSSDL RAS CAS A2 A6 A11 NC 8 DQS VSSQ DQ0 VSSQ CK CK CS A0 A4 ...Die Termination Control : ODT(registered HIGH) enables on die termination resistance internal to the...
Description 256Mb DDR2 SDRAM
64M X 4 DDR DRAM, PBGA60
16M X 16 DDR DRAM, PBGA84

File Size 606.99K  /  35 Page

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    飞思卡尔半导体(中国)有限公司
Part No. MM908E626AVDWB/R2
OCR Text ... rst_a irq rst port c i/os port b i/os port a i/os hvdd hb4 hb3 hb2 hb1 ep gnd[1:2] vsup[1:3] 908e626 908e626 simplified application diagram...die provides fully protected h-bridge outputs, voltage regulator, autonomous watchdog, and local i...
Description Integrated Stepper Motor Driver with Embedded MCU and LIN Serial Communication

File Size 302.98K  /  32 Page

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    EPCOS[EPCOS]
Part No. B84113-C-L60 B84113-C-A110 B84113-C-A30 B84113-C-A60 B84113-C-B110 B84113-C-B30 B84113-C-B60 B84113-C-K30 B84113-C-L110 B84113-C-L30
OCR Text ... styles Case style A Case style B Case style K Case style L Marking Marking on component: Manufacturer's logo, ordering code, rated voltage,...die Bauelemente spezifiziert, keine Eigenschaften zugesichert. Bestellungen unterliegen den vom ZVEI...
Description SIFI-C for very high insertion loss Rated voltage 250 V~, 50/60 Hz Rated current 3 A to 10 A

File Size 127.86K  /  7 Page

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    EPCOS[EPCOS]
Part No. B84134-B50-G1 B84134-A B84134-A25-G1 B84134-B
OCR Text ...ble fittings B84134-A B84134-B for strain relief on line and load side s I core chokes s One-stage or two-stage Features s Insert...die Bauelemente spezifiziert, keine Eigenschaften zugesichert. Bestellungen unterliegen den vom ZVEI...
Description 4-Line Filters for Installations and Systems

File Size 132.13K  /  7 Page

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    D1800N

Infineon Technologies AG
Part No. D1800N
OCR Text ... f f f f i d ) 1 i ( ln c i b a v ? + + ? + ? + = t vj = t vj max a= b= c= d= -7,537e-01 3,748e-04 3,443e-01 -2,660e-02 sper...die in diesem produktdatenblatt enthaltenen daten sind ausschlie?li ch fr technisch geschultes fa ch...
Description Netz-Gleichrichterdiode Rectifier Diode

File Size 238.38K  /  8 Page

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    BUK7535-100A

NXP Semiconductors
Part No. BUK7535-100A
OCR Text ...o-220ab d d 1 q p l 123 l 2 (1) b 1 e e b 0 5 10 mm scale plastic single-ended package; heatsink mounted; 1 mounting hole; 3-lead to-220ab sot78 dimensions (mm are the original dimensions) a e a 1 c note 1. terminals in this zone are not t...
Description TrenchMOS standard level FET

File Size 183.83K  /  15 Page

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    BPTD-1500D-1A

DIOTEC Electronics Corporation
Part No. BPTD-1500D-1A
OCR Text ...less otherwise specified. dim a b c inches +/- nom 0.142 0.125 0.052 0.0021 0.00250.003 b a c passivation proprietary junction silver plated copper slugs silicon die data sheet no. bptd-1500d-1a power over ethernet (poe) equipment protecti...
Description 1.5 KP BIPOLAR TRANSIENT VOLTAGE SUPPRESSOR DIODE CELLS

File Size 58.67K  /  1 Page

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    NXP Semiconductors N.V.
Part No. 74AHC04BQ-G
OCR Text ...sot762-1 74ahc_ahct04_4 ? nxp b.v. 2008. all rights reserved. product data sheet rev. 04 14 may 2008 2 of 14 nxp semiconductors 74ahc04; ...die substrate is attached to the exposed die pad using conductive die attach material. it can not be...
Description
File Size 78.27K  /  14 Page

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