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  A-42440-1011 Datasheet PDF File

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    A-42440-1011 15-24-6101 0015246101

Molex Electronics Ltd.
Part No. A-42440-1011 15-24-6101 0015246101
Description 4.20mm (.165) Pitch Mini-Fit BMI Header, Dual Row, Vertical, with Snap-in Plastic Peg PCB Lock, 10 Circuits, PA Polyamide Nylon 6/6, UL 94V-2, Tin (Sn) Plating
File Size 653.60K  /  7 Page

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Rochester Electronics LLC
Part No. MC10116FNR2
Description MC10116 - Triple Line Receiver (R2 is )
Tech specs 　 　

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HUA FENG CIRCUIT





    MOLEX INC
Part No. A-42440-0421
Description 4 CONTACT(S), MALE, POWER CONNECTOR, SOLDER
File Size 681.78K  /  6 Page

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Amphenol Communications Solutions
Part No. 10118085-101-12LF
Description Unshrouded Right Angle header,Surface Mount, Double Row, 12 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

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    A-42440-2422

Molex Electronics Ltd.
Part No. A-42440-2422
Description
File Size 653.96K  /  7 Page

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Amphenol Communications Solutions
Part No. 10119333-101-15LF
Description BergStik®, Board to Board connector, Unshrouded horizontal header, Surface mount, Single Row, 15 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

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    A-42440-2421 15-24-6242

Molex Electronics Ltd.
Part No. A-42440-2421 15-24-6242
Description 4.20mm (.165) Pitch Mini-Fit BMI Header, Dual Row, Vertical, with Snap-in Plastic Peg PCB Lock, 24 Circuits, PA Polyamide Nylon 6/6, UL 94V-0, Tin (Sn) Plating
File Size 653.94K  /  7 Page

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Amphenol Communications Solutions
Part No. 10114830-10110LF
Description 1.25mm Wire to Board Wafer, Right Angle, Surface Mount, 10 Positions
Tech specs 　 　

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    LG42440-PF

LIGITEK electronics co., ltd.
Part No. LG42440-PF
Description ROUND TYPE LED LAMPS
File Size 108.89K  /  6 Page

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Amphenol Communications Solutions
Part No. 10114829-10111LF
Description 1.25mm Wire to Board Wafer, Vertical, Through Hole, 11 Positions
Tech specs 　 　

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    ITT, Corp.
Part No. MZCK03P1011/KS35D
Description MAGNETIC FIELD SENSOR-MAGNETORESISTIVE, 4-4mT, 200mA, PA66
File Size 81.18K  /  1 Page

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Amphenol Communications Solutions
Part No. 10114831-10110LF
Description 1.25mm Wire-to-Board Connector System WAFER THROUGH HOLE RIGHT ANGLE, 10 POSITIONS, TIN PLATING
Tech specs 　 　

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    Integrated Circuit Technology Corp
Part No. MZTK06N1011/KS35D
Description MAGNETIC FIELD SENSOR-MAGNETORESISTIVE, 4-4mT, 200mA, RECTANGULAR
File Size 81.64K  /  1 Page

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Amphenol Communications Solutions
Part No. 10114831-10112LF
Description 1.25mm Wire-to-Board Connector System WAFER THROUGH HOLE RIGHT ANGLE, 12 POSITIONS, TIN PLATING
Tech specs 　 　

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    UPD424400-L

NEC
Part No. UPD424400-L
Description 4M-Bit DRAM
File Size 1,003.89K  /  26 Page

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Amphenol Communications Solutions
Part No. 10114829-10113LF
Description 1.25mm Wire to Board Wafer, Vertical, Through Hole, 13 Positions
Tech specs 　 　

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Part No. UPD424400V-60 UPD424400V-80 UPD424400V-70 UPD424400V-10
Description 2.5V or 3.3V, 200-MHz, 1:18 Clock Distribution Buffer
x4 Fast Page Mode DRAM
2.5V or 3.3V, 200-MHz 1:18 Clock Distribution Buffer
File Size 547.83K  /  29 Page

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Amphenol Communications Solutions
Part No. 10114828-10113LF
Description 1.25mm Wire to Board Wafer,Vertical, Surface Mount, 13 Positions
Tech specs 　 　

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Part No. UPD424400V-80L UPD424400V-10L
Description 2.5V or 3.3V, 200-MHz, 1:12 Clock Distribution Buffer
2.5V or 3.3V, 200-MHz, 1:18 Clock Distribution Buffer
File Size 556.83K  /  29 Page

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Amphenol Communications Solutions
Part No. 10114830-10113LF
Description 1.25mm Wire to Board Wafer, Right Angle, Surface Mount, 13 Positions
Tech specs 　 　

Official Product Page

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