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  90059-0013 Datasheet PDF File

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    0900590013 90059-0013

Molex Electronics Ltd.
Part No. 0900590013 90059-0013
Description 2.54mm (.100) Pitch C-Grid? Micro Shunt, Low Profile, 35mm Pretinned Plating
2.54mm (.100) Pitch C-Grid庐 Micro Shunt, Low Profile, 35mm Pretinned Plating
MOLEX Connector

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Amphenol Communications Solutions

Part No. 65820-013
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Right Angle Header, Through Hole, Double row , 26 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    0900590013-17

Molex Electronics Ltd.
Part No. 0900590013-17
Description    2.54mm Pitch C-Grid Micro Shunt, Low Profile, 0.889μm Pre-tinned Plating

File Size 22.61K  /  1 Page

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Amphenol Communications Solutions

Part No. 10108777-10013TLF
Description PCI Express® GEN 3 Card Edge, Storage and Server Connector, Vertical, Through Hole, x16, 164 Positions, 1.00mm (0.039in) Pitch
Tech specs    

Official Product Page

    Molex, Inc.
MOLEX INC
Part No. 90059-0020
Description Microshunt Asy 2.54mm BLK INTERCONNECTION DEVICE

File Size 124.63K  /  1 Page

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Amphenol Communications Solutions

Part No. 88880-013
Description Quickie®, Wire to Board Connector, Double Row, 26 Positions, 2.54 mm (0.1 in.), Vertical, Shrouded Header 0.76 um (15 u\\.) Gold Plating
Tech specs    

Official Product Page

    Molex, Inc.
Part No. 90059-0009
Description Multipole Connector; No. of Contacts:2; Pitch Spacing:2.54mm; No. of Rows:1; Gender:Female; Series:90059; Body Material:Polyester, Glass-filled; Color:White; Connecting Termination:Crimp RoHS Compliant: Yes INTERCONNECTION DEVICE

File Size 67.71K  /  1 Page

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Amphenol Communications Solutions

Part No. 10129206-1000013LF
Description DDR4 DIMM, Ultra Low Profile, Storage and Server Connector, Vertical , Through Hole, 288 Position , 0.85mm (0.033in) Pitch
Tech specs    

Official Product Page

    Elektron Components Ltd.
Part No. MP0013 MP0033/2 MP0013/2
Description Push Button

File Size 76.51K  /  1 Page

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Amphenol Communications Solutions

Part No. 87900-138HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 38 Positions, 2.54 mm Pitch, Vertical, 18.29 mm (0.72in) Mating, 3.05 mm (0.12in) Tail.
Tech specs    

Official Product Page

    0900590009 90059-0009

Molex Electronics Ltd.
Part No. 0900590009 90059-0009
Description 2.54mm (.100) Pitch C-Grid? Micro Shunt, Low Profile, 15mm Select Gold (Au) with Gold (Au) Flash Plating
2.54mm (.100) Pitch C-Grid庐 Micro Shunt, Low Profile, 15mm" Select Gold (Au) with Gold (Au) Flash Plating
MOLEX Connector

File Size 151.99K  /  2 Page

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Amphenol Communications Solutions

Part No. 10120300-130-202LF
Description Receptacle, 4 Pair, 15 Column, 9mm Height, 85Ω, Without Damper, Lead Free
Tech specs    

Official Product Page

    0900590011 90059-0011

Molex Electronics Ltd.
Part No. 0900590011 90059-0011
Description 2.54mm (.100) Pitch C-Grid? Micro Shunt, Low Profile, 15mm Select Gold (Au) with Gold (Au) Flash Plating
2.54mm (.100) Pitch C-Grid庐 Micro Shunt, Low Profile, 15mm Select Gold (Au) with Gold (Au) Flash Plating
MOLEX Connector

File Size 152.69K  /  3 Page

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Amphenol Communications Solutions

Part No. 95000-013LF
Description Minitek® 2.00mm, Board to Board, Shrouded Header- Surface Mount - Single row - 13 Positions - 2mm (0.079in) - Right Angle .
Tech specs    

Official Product Page

    0900590007-17

Molex Electronics Ltd.
Part No. 0900590007-17
Description    2.54mm Pitch C-Grid Micro Shunt, Low Profile, 5.08μm Tin (Sn) Plating

File Size 22.61K  /  1 Page

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Amphenol Communications Solutions

Part No. 88880-013LF
Description Quickie® IDC Cable-to-Board Connector System, Shrouded Slim Line Header, Vertical, Through Hole, Double Row, 26 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0900590014 90059-0014

Molex Electronics Ltd.
Part No. 0900590014 90059-0014
Description 2.54mm (.100) Pitch C-Grid? Micro Shunt, Low Profile, 4mm Gold Plating
2.54mm (.100) Pitch C-Grid庐 Micro Shunt, Low Profile, 4mm Gold Plating
MOLEX Connector

File Size 155.29K  /  3 Page

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Amphenol Communications Solutions

Part No. 87900-134HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 34 Positions, 2.54 mm Pitch, Vertical, 18.29 mm (0.72in) Mating, 3.05 mm (0.12in) Tail.
Tech specs    

Official Product Page

    0900590009-17

Molex Electronics Ltd.
Part No. 0900590009-17
Description    2.54mm Pitch C-Grid Micro Shunt, Low Profile, 0.381μm Select Gold (Au) with Gold (Au) Flash Plating

File Size 22.64K  /  1 Page

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Amphenol Communications Solutions

Part No. 10120300-131-202LF
Description Receptacle, 4 Pair, 15 Column, 9mm Height, 85Ω, With Damper, Lead Free
Tech specs    

Official Product Page

For 90059-0013 Found Datasheets File :: 150+       Page :: | <1> | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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