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  87933-5031 Datasheet PDF File

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    87933-5031 0879335031

Molex Electronics Ltd.
Part No. 87933-5031 0879335031
Description 1.27mm (.050) Pitch Wire-to-Board Header, Dual Row, SMT, Vertical, 50 Circuits, 0.38μm (15μ) Gold (Au) Plating, Mating Pin Length 3.05mm (0.120)

File Size 163.03K  /  4 Page

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Amphenol Communications Solutions

Part No. 10137785-031222LF
Description Minitek® Pwr 4.2 HCC, Single Row, Vertical Through Hole Header, Nylon 66, Tin plating, Black Color, 3 Positions, Non GW Compatible, without Post, Tray packing.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    87933-1217

Molex Electronics Ltd.
Part No. 87933-1217
Description 1.27mm (.050) Pitch Wire-to-Board Header, Dual Row, SMT, Vertical, 100 Circuits, 0.76μm (30μ) Gold (Au) Plating, Mating Pin Length 3.05mm (0.120), with Cap

File Size 343.99K  /  7 Page

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Amphenol Communications Solutions

Part No. 10137785-031242LF
Description Minitek® Pwr 4.2 HCC, Single Row, Vertical Through Hole Header, LCP, Tin plating, Black Color, 3 Positions, Non GW Compatible, without Post, Tray packing.
Tech specs    

Official Product Page

    87933-1215

Molex Electronics Ltd.
Part No. 87933-1215
Description 1.27mm (.050) Pitch Wire-to-Board Header, Dual Row, SMT, Vertical, 100 Circuits, 0.05μm (2μ) Gold (Au) Plating, Mating Pin Length 3.05mm (0.120), with Cap

File Size 344.18K  /  7 Page

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Amphenol Communications Solutions

Part No. 10137785-031141LF
Description Minitek® Pwr 4.2 HCC, Single Row, Vertical Through Hole Header, LCP, Tin plating, Natural Color, 3 Positions, Non GW Compatible, with Post, Tray packing.
Tech specs    

Official Product Page

    87933-1211

Molex Electronics Ltd.
Part No. 87933-1211
Description 1.27mm (.050) Pitch Wire-to-Board Header, Dual Row, SMT, Vertical, 100 Circuits, 0.38μm (15μ) Gold (Au) Plating, Mating Pin Length 1.65mm (0.065), with Cap

File Size 344.17K  /  7 Page

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Amphenol Communications Solutions

Part No. 86503-128HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 28 Positions, 2.54 mm Pitch, Vertical, 6.35 mm (0.25 in.) Mating, 3.05 mm (0.12 in.) Tail.
Tech specs    

Official Product Page

    0879331007 87933-1007

http://
Molex Electronics Ltd.
Part No. 0879331007 87933-1007
Description 1.27mm (.050) Pitch Wire-to-Board Header, Dual Row, SMT, Vertical, 10 Circuits, 0.05μm (2μ) Gold (Au) Plating, Mating Pin Length 1.65mm (0.065), with Cap
1.27mm (.050) Pitch Wire-to-Board Header, Dual Row, SMT, Vertical, 10 Circuits, 0.05渭m (2渭) Gold (Au) Plating, Mating Pin Length 1.65mm (0.065), with Cap

File Size 344.32K  /  7 Page

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Amphenol Communications Solutions

Part No. 86503-148HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 48 Positions, 2.54 mm Pitch, Vertical, 6.35 mm (0.25 in.) Mating, 3.05 mm (0.12 in.) Tail.
Tech specs    

Official Product Page

    87933-3015 0879333015

Molex Electronics Ltd.
Part No. 87933-3015 0879333015
Description 1.27mm (.050) Pitch Wire-to-Board Header, Dual Row, SMT, Vertical, 30 Circuits, 0.05μm (2μ) Gold (Au) Plating, Mating Pin Length 3.05mm (0.120), with Cap

File Size 344.17K  /  7 Page

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Amphenol Communications Solutions

Part No. 10135175-03110LF
Description Minitek® 1.5mm Wire to Board Plug HSG, 3 positions
Tech specs    

Official Product Page

    AN-5031

Fairchild Semiconductor
Part No. AN-5031
Description GTLP Power Configuration

File Size 1,176.88K  /  5 Page

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Amphenol Communications Solutions

Part No. 10137785-031232LF
Description Minitek® Pwr 4.2 HCC, Single Row, Vertical Through Hole Header, LCP, Tin plating, Black Color, 3 Positions, GW Compatible, without Post, Tray packing.
Tech specs    

Official Product Page

   
Part No. 795-5031-12-25
Description INTERCONNECTION DEVICE

File Size 56.41K  /  1 Page

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Amphenol Communications Solutions

Part No. 10137785-031211LF
Description Minitek® Pwr 4.2 HCC, Single Row, Vertical Through Hole Header, Nylon 66, Tin plating, Black Color, 3 Positions, GW Compatible, with Post, Tray packing.
Tech specs    

Official Product Page

    INA-50311 INA-50311-BLK INA-50311-TR1

Agilent (Hewlett-Packard)
HP[Agilent(Hewlett-Packard)]
http://
Part No. INA-50311 INA-50311-BLK INA-50311-TR1
Description 1 GHz的硅单片低噪声放大器
1 GHz Low Noise Silicon MMIC Amplifier

File Size 55.32K  /  5 Page

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Amphenol Communications Solutions

Part No. 86503-104HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 4 Positions, 2.54 mm Pitch, Vertical, 6.35 mm (0.25 in.) Mating, 3.05 mm (0.12 in.) Tail.
Tech specs    

Official Product Page

    HIH-5030 HIH-5030-001 HIH-5030-001S HIH-5031 HIH-5031-001 HIH-5031-001S

Honeywell Solid State Electronics Center
Part No. HIH-5030 HIH-5030-001 HIH-5030-001S HIH-5031 HIH-5031-001 HIH-5031-001S
Description LOW VOLTAGE HUMIDITY SENSORS

File Size 157.82K  /  8 Page

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Amphenol Communications Solutions

Part No. 86503-132HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 32 Positions, 2.54 mm Pitch, Vertical, 6.35 mm (0.25 in.) Mating, 3.05 mm (0.12 in.) Tail.
Tech specs    

Official Product Page

For 87933-5031 Found Datasheets File :: 150+       Page :: | <1> | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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