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  87759-0875 Datasheet PDF File

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    87759-0875

Molex Electronics Ltd.
Part No. 87759-0875
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 8 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs

File Size 280.47K  /  6 Page

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Texas Instruments

Part No. 5962-8775901MSA
Description Octal Buffers/Drivers With 3-State Outputs 20-CFP -55 to 125
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    R11-0875

A-Data Technology
Part No. R11-0875
Description ADD3V1600W8G11 DDR3L-1600(CL11) 240-Pin VLP R-DIMM 8GB(1024Mx72-bits)

File Size 560.17K  /  16 Page

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Texas Instruments

Part No. 5962-8775901M2A
Description Octal Buffers/Drivers With 3-State Outputs 20-LCCC -55 to 125
Tech specs    

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    0875-1G2T-E3

Bel Fuse Inc.
Part No. 0875-1G2T-E3
Description INTEGRATED CONNECTOR MODULES Gigabit Ethernet MagJack 1 x 2 with LEDs

File Size 217.70K  /  4 Page

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Texas Instruments

Part No. 5962-8775901MRA
Description Octal Buffers/Drivers With 3-State Outputs 20-CDIP -55 to 125
Tech specs    

Official Product Page

    15020-0875

Molex Electronics Ltd.
Part No. 15020-0875
Description 0.50mm Pitch Premo-Flex FFC Jumper, Same Side Contacts (Type A), 17 Circuits

File Size 34.64K  /  1 Page

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Amphenol Communications Solutions

Part No. 86093968108755E1LF
Description DIN Headers & Receptacles, Backplane Connector, Standard Receptacle, Vertical, Solder-Eyelet, Style C, 96 ways, Class II
Tech specs    

Official Product Page

    92315-0875

Molex Electronics Ltd.
Part No. 92315-0875
Description Picoflex? PF-50 IDT-to-IDT, 8 Circuits
Picoflex庐 PF-50 IDT-to-IDT, 8 Circuits

File Size 89.15K  /  2 Page

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Amphenol Communications Solutions

Part No. 67996-408-030875LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 8 Positions, 2.54 mm (0.100in) Pitch
Tech specs    

Official Product Page

    87759-4874

Molex Electronics Ltd.
Part No. 87759-4874
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 48 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, with Pick-and-Place Cap, Tape and Reel Packaging

File Size 421.12K  /  8 Page

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Amphenol Communications Solutions

Part No. 10150875-102LF
Description AirMAX VS2®, Backplane Connectors, 5-Pair, 10 Column, 150-Position, 2.0mm, , Right Angle Header, Press-Fit
Tech specs    

Official Product Page

    87759-0674

Molex Electronics Ltd.
Part No. 87759-0674
Description 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, 6 Circuits, 0.38um (15u) Gold (Au) Selective Plating

File Size 421.17K  /  8 Page

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SiTime

Part No. SiT9121AC-2B1-33E125.000875
Description 1 to 220 MHz, ±10 to ±50 ppm Differential XO
Tech specs    

Official Product Page

    87759-0814

Molex Electronics Ltd.
Part No. 87759-0814
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 8 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs, Lead-free

File Size 420.16K  /  8 Page

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    87759-0815

Molex Electronics Ltd.
Part No. 87759-0815
Description 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, 8 Circuits

File Size 279.45K  /  6 Page

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    87759-4464

Molex Electronics Ltd.
Part No. 87759-4464
Description 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, 44 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs, Pick-and-Place Cap

File Size 421.15K  /  8 Page

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