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Molex Electronics Ltd.
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Part No. |
0761348502 76134-8502
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Description |
VHDM? H-Series Board-to-Board Backplane Header, 2.00mm (.079) Pitch, Vertical, 8-Row, Open Signal Module, 200 Circuits, Advance Mate Shield VHDM庐 H-Series Board-to-Board Backplane Header, 2.00mm (.079) Pitch, Vertical, 8-Row, Open Signal Module, 200 Circuits, Advance Mate Shield MOLEX Connector
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File Size |
310.08K /
4 Page |
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it Online |
Download Datasheet
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Amphenol Communications Solutions |
Part No. |
91276-134HLF
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Description |
BergStik® 2.54mm, Board To Board Connector, Unshrouded Header, Through Hole, Single Row, 34 Positions, 2.54mm Pitch, Vertical, 22.86mm (0.9in) Mating, 5.72mm (0.225in) Tail.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
74978-502011LF
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Description |
Metral® High Speed 2000 Series, Backplane Connectors, Header, Vertical Signal, 8 Row, Press-Fit, 96 Position, Select Load, Extended
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
95278-502-04LF
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Description |
BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 4 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
95278-502-42LF
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Description |
BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 42 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
95278-502B04LF
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Description |
BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 4 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
95278-502B24LF
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Description |
BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 24 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
95278-502B44LF
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Description |
BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 44 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
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Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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Part No. |
0761348501 76134-8501
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Description |
2.00mm (.079) Pitch VHDM? H Board-to-Board Backplane Header, Vertical, 8-Row, Signal Module, Open End Version, 200 Circuits, Pin Length 4.75mm (.187), Lead Free 2.00mm (.079) Pitch VHDM庐 H Board-to-Board Backplane Header, Vertical, 8-Row, Signal Module, Open End Version, 200 Circuits, Pin Length 4.75mm (.187), Lead Free MOLEX Connector
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File Size |
309.34K /
4 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
Part No. |
94898-502HLF
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Description |
Header, Bottom Mount, S/D(68Pins), SMT I.L., 3.3V, 0mm s/o
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Official Product Page
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LSI Corporation
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Part No. |
8502
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Description |
Ethernet MII(Media Independent Interface) to AUI(Attachment Unit Interface) Interface Adapter(以太网独立于媒体接口与附属单元接口适配
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File Size |
470.66K /
55 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
Part No. |
10110818-5025LF
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Description |
SFP+ Cable Assembly, 24 AWG, 2.5 meters, passive -standard raw cable, non-halogen free.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
95278-502-28LF
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Description |
BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 28 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
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Tech specs |
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Official Product Page
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