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  73644-2108 Datasheet PDF File

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    73644-2108 0736442108

Molex Electronics Ltd.
Part No. 73644-2108 0736442108
Description 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, Press-Fit, Guide Post Location B, Polarizing Key Position D, 72 Circuits

File Size 174.00K  /  4 Page

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Texas Instruments

Part No. CDCLVD2108RGZR
Description Low Jitter, Dual 1:8 Universal-to-LVDS Buffer 48-VQFN -40 to 85
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    73644-2016

Molex Electronics Ltd.
Part No. 73644-2016
Description 2.00mm (.079) Pitch HDM Board-to-Board Backplane Header, Vertical, SMC, Press- Fit, Guide Post Location B

File Size 164.19K  /  4 Page

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Texas Instruments

Part No. CDCLVP2108RGZT
Description Low Jitter, Dual 1:8 Universal-to-LVPECL Buffer 48-VQFN -40 to 85
Tech specs    

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Official Product Page

    73644-1202

Molex Electronics Ltd.
Part No. 73644-1202
Description 2.00mm (.079) Pitch HDM Board-to-Board Backplane Header, Vertical, SMC, Press- Fit, Guide Post Location B

File Size 167.27K  /  4 Page

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Texas Instruments

Part No. CDCLVP2108RGZR
Description Low Jitter, Dual 1:8 Universal-to-LVPECL Buffer 48-VQFN -40 to 85
Tech specs    

Official Product Page

    73644-1207

Molex Electronics Ltd.
Part No. 73644-1207
Description 2.00mm (.079) Pitch HDM Board-to-Board Backplane Header, Vertical, SMC, Press- Fit, Guide Post Location A

File Size 167.28K  /  4 Page

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Texas Instruments

Part No. CDCLVD2108RGZT
Description Low Jitter, Dual 1:8 Universal-to-LVDS Buffer 48-VQFN -40 to 85
Tech specs    

Get Free Sample

Official Product Page

    73644-1206

Molex Electronics Ltd.
Part No. 73644-1206
Description 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location B, Polarizing Key Position D, 144 Circuits

File Size 159.58K  /  4 Page

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Texas Instruments

Part No. LMK1D2108RGZT
Description Dual bank 8-channel output 1.8-V, 2.5-V, and 3.3-V LVDS buffer 48-VQFN -40 to 105
Tech specs    

Official Product Page

    73644-1204

Molex Electronics Ltd.
Part No. 73644-1204
Description 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location B, Polarizing Key Position C, 144 Circuits

File Size 167.28K  /  4 Page

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Texas Instruments

Part No. LMK1D2108RGZR
Description Dual bank 8-channel output 1.8-V, 2.5-V, and 3.3-V LVDS buffer 48-VQFN -40 to 105
Tech specs    

Official Product Page

    73644-1205

Molex Electronics Ltd.
Part No. 73644-1205
Description 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, Press-Fit, Guide Post Location A, Polarizing Key Position C, 144 Circuits

File Size 167.28K  /  4 Page

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Texas Instruments

Part No. BQ21080YBGR
Description 800-mA Li-ion and LiFePO4 I<sup>2</sup>C programmable linear charger with regulated power path in WCSP package 8-DSBGA -40 to 85
Tech specs    

Official Product Page

    73644-1203

Molex Electronics Ltd.
Part No. 73644-1203
Description 2.00mm (.079) Pitch HDM Board-to-Board Backplane Header, Vertical, SMC, Press- Fit, Guide Post Location A

File Size 159.58K  /  4 Page

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    73644-2117

Molex Electronics Ltd.
Part No. 73644-2117
Description 2.00mm (.079) Pitch HDM Board-to-Board Backplane Header, Vertical, SMC, Press- Fit, Guide Post Location A

File Size 163.63K  /  4 Page

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    73644-2116

Molex Electronics Ltd.
Part No. 73644-2116
Description 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, Press-Fit, Guide Post Location B, Polarizing Key Position N/A, 72 Circuits

File Size 163.64K  /  4 Page

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