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  73644-1206 Datasheet PDF File

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    73644-1206

Molex Electronics Ltd.
Part No. 73644-1206
Description 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location B, Polarizing Key Position D, 144 Circuits
File Size 159.58K  /  4 Page

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Murata Manufacturing Co Ltd
Part No. MGN1D120603MC-R7
Description DC-DC 1W SM 12-6/-3V GAN
Tech specs 　 　

Official Product Page

HUA FENG CIRCUIT





    73644-2009

Molex Electronics Ltd.
Part No. 73644-2009
Description 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, Press-Fit, Guide Post Location A, Polarizing Key Position E, 72 Circuits
File Size 174.00K  /  4 Page

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Amphenol Communications Solutions
Part No. 10114828-11206LF
Description 1.25mm Wire to Board Wafer,Vertical, Surface Mount, 6 Positions
Tech specs 　 　

Official Product Page

    73644-1201

Molex Electronics Ltd.
Part No. 73644-1201
Description 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location A, Polarizing Key Position A, 144 Circuits
File Size 160.13K  /  4 Page

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Amphenol Communications Solutions
Part No. G832MB011206222HR
Description 0.80mm Board-to-Board 85Ω Connector, Pitch 0.8mm, Height 11.7 mm, 120 Positions, Dual Row, BTB Vertical Receptacle SMT, 30u\\ Gold Black.
Tech specs 　 　

Official Product Page

    73644-1200

Molex Electronics Ltd.
Part No. 73644-1200
Description 2.00mm (.079) Pitch HDM Board-to-Board Backplane Header, Vertical, SMC, Press- Fit, Guide Post Location B
File Size 167.83K  /  4 Page

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Amphenol Communications Solutions
Part No. 78511-206HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 6 Positions, 2.54 mm Pitch.
Tech specs 　 　

Official Product Page

    73644-2101

Molex Electronics Ltd.
Part No. 73644-2101
Description 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location A, Polarizing Key Position A, 72 Circuits
File Size 163.64K  /  4 Page

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Amphenol Communications Solutions
Part No. 68031-206HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 6 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23in) Mating, 4.65 mm (0.183in) Tail.
Tech specs 　 　

Official Product Page

    73644-2105

Molex Electronics Ltd.
Part No. 73644-2105
Description 2.00mm (.079) Pitch HDM Board-to-Board Backplane Header, Vertical, SMC, Press- Fit, Guide Post Location A
File Size 163.64K  /  4 Page

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Amphenol Communications Solutions
Part No. 68691-206HLF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 6 Positions, 2.54 mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    73644-2110

Molex Electronics Ltd.
Part No. 73644-2110
Description 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location B, Polarizing Key Position F, 72 Circuits
File Size 174.00K  /  4 Page

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Amphenol Communications Solutions
Part No. 10120667-101LF
Description Mini-SAS HD Cable Assemblies, High Speed Input Output Connectors, 1 x 2 External Board Connector Assembly.
Tech specs 　 　

Official Product Page

    73644-2109

Molex Electronics Ltd.
Part No. 73644-2109
Description 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location A, Polarizing Key Position E, 72 Circuits
File Size 163.64K  /  4 Page

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Amphenol Communications Solutions
Part No. 54122-412062500LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 6 position, 2.54mm (0.100in) pitch
Tech specs 　 　

Official Product Page

    73644-2116

Molex Electronics Ltd.
Part No. 73644-2116
Description 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, Press-Fit, Guide Post Location B, Polarizing Key Position N/A, 72 Circuits
File Size 163.64K  /  4 Page

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Amphenol Communications Solutions
Part No. 98426-G12-06-210LF
Description Minitek® 2.00mm, Board to Board, Shrouded Vertical Stacking Header, Through Hole, Double Row, 12 Positions, 2.00mm (0.079in) Pitch.
Tech specs 　 　

Official Product Page

    73644-2117

Molex Electronics Ltd.
Part No. 73644-2117
Description 2.00mm (.079) Pitch HDM Board-to-Board Backplane Header, Vertical, SMC, Press- Fit, Guide Post Location A
File Size 163.63K  /  4 Page

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Amphenol Communications Solutions
Part No. 471-2065-600
Description Plug mod,20Positions, 6.5mm,LEAD FREE, NEXLEV
Tech specs 　 　

Official Product Page

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