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Amphenol Communications Solutions |
| Part No. |
131-6418-11H
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| Description |
Paladin® 112Gb/s Backplane Connector, 6-Pair, 8 Column, Right End Wall, Backplane Module, 1.5mm Wipe, APP.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
68016-418HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Right Angle Header, Through Hole, Single Row, 18 Positions, 2.54 mm (0.100) Pitch.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
87606-418LF
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| Description |
Dubox®, Board To Board Connector, Receptacle, Vertical, Through Hole, Double Row, Top Entry, 36 Positions, 2.54mm (0.100in) Pitch
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
68466-418HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 18 Positions, 2.54 mm Pitch, Vertical, 17.7 mm (0.697 in.) Mating, 3.25 mm (0.128 in.) Tail
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
131-6418-11D
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| Description |
Paladin® 112Gb/s Backplane Connector, 6-Pair, 8 Column, Right End Wall, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
91276-418HLF
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| Description |
BergStik® 2.54mm, Board To Board Connector, Unshrouded Header, Through Hole, Single Row, 18 Positions, 2.54mm Pitch, Vertical, 22.86mm (0.9in) Mating, 5.72mm (0.225in) Tail.
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
71308-5480
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| Description |
2.54mm (.100") Pitch C-Grid庐 Header, Surface Mount, Dual Row, Vertical, 80 Circuits1.50渭m (59渭") Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB L
2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 80 Circuits1.50μm (59μ) Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB Locator
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| File Size |
1,475.55K /
8 Page |
 View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
67996-418HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 18 Positions, 2.54 mm (0.100in) Pitch
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
52601-S26-418RLF
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| Description |
Quickie® IDC Cable-to-Board Connector System, Shrouded Vertical Header, Through Hole, Low Profile, Double Row, 25 Positions, 2.54mm (0.100in) Pitch.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
146-4182-12D
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| Description |
Paladin HD, RAF, 4 Pair, 8 Column, NiS
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
87916-418HLF
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| Description |
BergStik® 2.54mm, Board To Board Connector, Unshrouded Header, Through Hole, Single Row, 18 Positions, 2.54mm Pitch, Vertical, 21.08mm (0.83in) Mating, 3.25mm (0.128in) Tail.
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Official Product Page
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Bom2Buy.com
Price and Availability
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