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  24-81250-310BV0 Datasheet PDF File

For 24-81250-310BV0 Found Datasheets File :: 24+       Page :: | <1> | 2 | 3 |   

    ARIES ELECTRONICS INC
Part No. 24-81.250-310BV0 28-81.250-310BV0
Description DIP24, IC SOCKET
DIP28, IC SOCKET

File Size 166.39K  /  1 Page

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Texas Instruments

Part No. TPS781250200DDCT
Description 150mA, LDO Reg, Ultralow-Power, Iq 1uA w/ Pin-Selectable, Dual-Level Output Volt 5-SOT-23-THIN -40 to 125
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    Keysight Technologies
Part No. 81250
Description    Agilent ParBERT 81250 Parallel Bit Error Ratio Tester

File Size 2,702.92K  /  64 Page

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Texas Instruments

Part No. TPS781250200DDCR
Description 150mA, LDO Reg, Ultralow-Power, Iq 1uA w/ Pin-Selectable, Dual-Level Output Volt 5-SOT-23-THIN -40 to 125
Tech specs    

Get Free Sample

Official Product Page

    ARIES ELECTRONICS INC
Part No. 12-81250-610C
Description DIP12, IC SOCKET

File Size 670.92K  /  1 Page

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Renesas Electronics Corporation

Part No. 738125-000
Description COMP LOGIC
Tech specs    

Official Product Page

    MSC81250M 2746

STMICROELECTRONICS[STMicroelectronics]
Part No. MSC81250M 2746
Description From old datasheet system
RF & MICROWAVE TRANSISTORS AVIONICS APPLICATIONS

File Size 76.07K  /  5 Page

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Amphenol Communications Solutions

Part No. 467-8125-062
Description VHDM-HSD™, Backplane connectors, Vertical Orientation, Press Fit Termination, 5 Row HSD, 25 positions, left, adv mate, 6.25mm (0.246in), Header.
Tech specs    

Official Product Page

    0877581250 87758-1250

Molex Electronics Ltd.
Part No. 0877581250 87758-1250
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Through Hole, Vertical, 12 Circuits, 0.38μm(15μ) Gold (Au) Selective Plating, Tray Packaging, Lead-free
2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 12 Circuits, 0.38μm(15μ) Gold (Au) Selective Plating, Tray Packaging, Lead-free

File Size 135.77K  /  4 Page

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Amphenol Communications Solutions

Part No. 54242-807081250LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 8 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0749812501 74981-2501

Molex Electronics Ltd.
Part No. 0749812501 74981-2501
Description 2.00mm (.079") Pitch 6-Row VHDM-HSD Backplane Header, Guide Pin Signal Module
2.00mm (.079) Pitch 6-Row VHDM-HSD Backplane Header, Guide Pin Signal Module

File Size 405.39K  /  4 Page

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Amphenol Communications Solutions

Part No. 495-8125-062
Description VHDM®, Backplane connectors, Vertical Orientation, Press Fit Termination, 8 Row VHDM, 25 positions, left, adv mate, 6.25mm (0.246in), Header.
Tech specs    

Official Product Page

    0749812502 74981-2502

Molex Electronics Ltd.
Part No. 0749812502 74981-2502
Description 2.00mm (.079") Pitch 6-Row VHDM-HSD Backplane Header, Guide Pin Signal Module
2.00mm (.079) Pitch 6-Row VHDM-HSD Backplane Header, Guide Pin Signal Module

File Size 400.87K  /  4 Page

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Amphenol Communications Solutions

Part No. 499-8125-062
Description VHDM-HSD™, Backplane connectors, Vertical Orientation, Press Fit Termination, 8 Row HSD, 25 positions, left, adv mate, 6.25mm (0.246in), Header.
Tech specs    

Official Product Page

    0749812503 74981-2503

Molex Electronics Ltd.
Part No. 0749812503 74981-2503
Description 2.00mm (.079) Pitch 6-Row VHDM-HSD Backplane Header, Guide Pin Signal Module, Shield End Version, 100 Circuits, Pin Length 4.25mm (.167)

File Size 402.63K  /  4 Page

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Amphenol Communications Solutions

Part No. 54111-406081250LF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded vertical stacked header, Through Hole, Single Row, 8 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0923181250

Molex Electronics Ltd.
Part No. 0923181250
Description Picoflex PF-50 IDT-Board In Z-Style, 12 Circuits, 0.50m (1.64 ) Length

File Size 98.69K  /  2 Page

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Amphenol Communications Solutions

Part No. 495-8125-063
Description VHDM®, Backplane connectors, Vertical Orientation, Press Fit Termination, 8 Row VHDM, 25 positions, left, adv mate, 4.25mm (0.167in), Header.
Tech specs    

Official Product Page

    0781250008

Molex Electronics Ltd.
Part No. 0781250008
Description 1.00mm (.039) Pitch DDR2 DIMM Socket, Very Low Profile, Vertical, Surface Mount, 1.8 V, Center Keys
1.00mm (.039") Pitch DDR2 DIMM Socket, Very Low Profile, Vertical, Surface Mount, 1.8 V, Center Keys

File Size 581.08K  /  9 Page

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Amphenol Communications Solutions

Part No. 499-8125-063
Description VHDM-HSD™, Backplane connectors, Vertical Orientation, Press Fit Termination, 8 Row HSD, 25 positions, left, adv mate, 4.25mm (0.167in), Header.
Tech specs    

Official Product Page

For 24-81250-310BV0 Found Datasheets File :: 24+       Page :: | <1> | 2 | 3 |   

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