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  0713 Datasheet PDF File

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    0713086442 71308-6442

Molex Electronics Ltd.
Part No. 0713086442 71308-6442
Description 2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 42 Circuits1.50μm (59μ) Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, with 3.30mm (.130)

File Size 1,475.57K  /  8 Page

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Texas Instruments

Part No. TLV707135DQNT
Description 200mA Low-Iq Low-Noise Low-Dropout (LDO) Regulator for Portable Devices 4-X2SON -40 to 85
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    0713085424

Molex Electronics Ltd.
Part No. 0713085424
Description 2.54mm (.100") Pitch C-Grid庐 Header, Surface Mount, Dual Row, Vertical, 24 Circuits1.50渭m (59渭") Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB L

File Size 1,475.56K  /  8 Page

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Texas Instruments

Part No. LP590713QDQNRQ1
Description Automotive, 250-mA, low-noise, high-PSRR, ultra-low-dropout voltage regulator with low IQ and enable 4-X2SON -40 to 125
Tech specs    

Official Product Page

    0713085422

Molex Electronics Ltd.
Part No. 0713085422
Description 2.54mm (.100") Pitch C-Grid庐 Header, Surface Mount, Dual Row, Vertical, 22 Circuits1.50渭m (59渭") Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB L

File Size 1,475.56K  /  8 Page

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Texas Instruments

Part No. TLV707135DQNR
Description 200mA Low-Iq Low-Noise Low-Dropout (LDO) Regulator for Portable Devices 4-X2SON -40 to 85
Tech specs    

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Official Product Page

    0713085420 71308-5420

Molex Electronics Ltd.
Part No. 0713085420 71308-5420
Description 2.54mm (.100") Pitch C-Grid庐 Header, Surface Mount, Dual Row, Vertical, 20 Circuits1.50渭m (59渭") Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB L
2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 20 Circuits1.50μm (59μ) Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB Locator

File Size 1,475.56K  /  8 Page

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Amphenol Communications Solutions

Part No. 77315-407-13LF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 13 Positions 2.54mm (0.100in) Pitch, Right Angle
Tech specs    

Official Product Page

    0713085418 71308-5418

Molex Electronics Ltd.
Part No. 0713085418 71308-5418
Description 2.54mm (.100") Pitch C-Grid Header, Surface Mount, Dual Row, Vertical, 18 Circuits
2.54mm (.100) Pitch C-Grid Header, Surface Mount, Dual Row, Vertical, 18 Circuits

File Size 1,475.56K  /  8 Page

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Amphenol Communications Solutions

Part No. 98426-S04-07-133LF
Description Minitek® 2.00mm, Board to Board, Shrouded Vertical Stacking Header, Through Hole, Double Row, 14 Positions, 2.00mm (0.079in) Pitch.
Tech specs    

Official Product Page

    0713085416 71308-5416

Molex Electronics Ltd.
Part No. 0713085416 71308-5416
Description 2.54mm (.100") Pitch C-Grid庐 Header, Surface Mount, Dual Row, Vertical, 16 Circuits,1.50渭m (59渭") Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB
2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 16 Circuits,1.50μm (59μ) Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB Locator

File Size 1,475.55K  /  8 Page

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Amphenol Communications Solutions

Part No. 98426-G04-07-133LF
Description Minitek® 2.00mm, Board to Board, Shrouded Vertical Stacking Header, Through Hole, Double Row, 14 Positions, 2.00mm (0.079in) Pitch.
Tech specs    

Official Product Page

    0713085414 71308-5414

Molex Electronics Ltd.
Part No. 0713085414 71308-5414
Description 2.54mm (.100") Pitch C-Grid庐 Header, Surface Mount, Dual Row, Vertical, 14 Circuits1.50渭m (59渭") Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB L
2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 14 Circuits1.50μm (59μ) Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB Locator

File Size 1,475.56K  /  8 Page

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Amphenol Communications Solutions

Part No. U95Z2054071301
Description QSFP 2X2 COMBO SP FG NO LP
Tech specs    

Official Product Page

    0713085412 71308-5412

Molex Electronics Ltd.
Part No. 0713085412 71308-5412
Description 2.54mm (.100") Pitch C-Grid庐 Header, Surface Mount, Dual Row, Vertical, 12 Circuits1.50渭m (59渭") Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB L
2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 12 Circuits1.50μm (59μ) Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB Locator

File Size 1,475.56K  /  8 Page

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Amphenol Communications Solutions

Part No. 89007-136LF
Description Metral® Board Connectors, Backplane Connectors, 5 Row Signal Header, Straight, Press-Fit, Wide body.
Tech specs    

Official Product Page

    0713085410 71308-5410

Molex Electronics Ltd.
Part No. 0713085410 71308-5410
Description 2.54mm (.100") Pitch C-Grid庐 Header, Surface Mount, Dual Row, Vertical, 10 Circuits1.50渭m (59渭") Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB L
2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 10 Circuits1.50μm (59μ) Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB Locator

File Size 1,475.56K  /  8 Page

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Amphenol Communications Solutions

Part No. 77315-107-13LF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 13 Positions 2.54mm (0.100in) Pitch, Right Angle
Tech specs    

Official Product Page

    0713085408 71308-5408

Molex Electronics Ltd.
Part No. 0713085408 71308-5408
Description 2.54mm (.100") Pitch C-Grid Header, Surface Mount, Dual Row, Vertical, 8 Circuits, 1.50um (59u") Minimum
2.54mm (.100) Pitch C-Grid Header, Surface Mount, Dual Row, Vertical, 8 Circuits, 1.50um (59u) Minimum

File Size 1,475.56K  /  8 Page

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Amphenol Communications Solutions

Part No. U95Z1054071321
Description QSFP STACKED COMBO NO LP
Tech specs    

Official Product Page

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