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  03-09-1011 Datasheet PDF File

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    Integrated Circuit Technology Corp
Part No. MZTK06N1011/KS35D
Description MAGNETIC FIELD SENSOR-MAGNETORESISTIVE, 4-4mT, 200mA, RECTANGULAR

File Size 81.64K  /  1 Page

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Rochester Electronics LLC

Part No. BLA1011-300
Description BLA1011-300 - 300W LDMOS Avionics Power Transistor
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    ITT, Corp.
Part No. MZCK03P1011/KS35D
Description MAGNETIC FIELD SENSOR-MAGNETORESISTIVE, 4-4mT, 200mA, PA66

File Size 81.18K  /  1 Page

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Amphenol Communications Solutions

Part No. 10114831-10115LF
Description 1.25mm Wire-to-Board Connector System WAFER THROUGH HOLE RIGHT ANGLE, 15 POSITIONS, TIN PLATING
Tech specs    

Official Product Page

    EM-1011

Asahi Kasei Microsystems
Part No. EM-1011
Description EM-1011 is ultra-small Hall effect ICs of a single silicon chip composed of Hall element and a signal processing IC

File Size 129.12K  /  3 Page

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Amphenol Communications Solutions

Part No. 10118085-101-10LF
Description Unshrouded Right Angle Header, Surface Mount With Peg, Double row , 10 Positions, 2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

    MULTI CONTACT AG
Part No. 23.1011-23
Description INTERCONNECTION DEVICE

File Size 163.40K  /  2 Page

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Amphenol Communications Solutions

Part No. 10118085-101-12LF
Description Unshrouded Right Angle header,Surface Mount, Double Row, 12 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    03-06-1011

Molex Electronics Ltd.
Part No. 03-06-1011
Description 1.57mm Diameter Standard .062 Pin and Socket Receptacle Housing, 1 Circuits

File Size 30.14K  /  2 Page

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Amphenol Communications Solutions

Part No. 10119333-101-15LF
Description BergStik®, Board to Board connector, Unshrouded horizontal header, Surface mount, Single Row, 15 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

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Part No. 1011
Description PULSE TRANSFORMER FOR GENERAL PURPOSE APPLICATION(S)

File Size 1,055.75K  /  8 Page

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Amphenol Communications Solutions

Part No. 10114831-10112LF
Description 1.25mm Wire-to-Board Connector System WAFER THROUGH HOLE RIGHT ANGLE, 12 POSITIONS, TIN PLATING
Tech specs    

Official Product Page

    03-09-1011

Molex Electronics Ltd.
Part No. 03-09-1011
Description 2.36mm Diameter Standard

File Size 30.58K  /  1 Page

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Amphenol Communications Solutions

Part No. 10114829-10113LF
Description 1.25mm Wire to Board Wafer, Vertical, Through Hole, 13 Positions
Tech specs    

Official Product Page

   
Part No. 60-1011
Description MAINS DIST BOARD SEQUEN.STA

File Size 33.44K  /  1 Page

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Amphenol Communications Solutions

Part No. 10114828-10113LF
Description 1.25mm Wire to Board Wafer,Vertical, Surface Mount, 13 Positions
Tech specs    

Official Product Page

    03-06-1011-P

Molex Electronics Ltd.
Part No. 03-06-1011-P
Description PLUG & RECEPTACLE HOUSINGS I CIRCUIT

File Size 113.41K  /  3 Page

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Amphenol Communications Solutions

Part No. 10114830-10113LF
Description 1.25mm Wire to Board Wafer, Right Angle, Surface Mount, 13 Positions
Tech specs    

Official Product Page

    silex technology, Inc.
Part No. SX-350-1011
Description
File Size 146.46K  /  2 Page

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Amphenol Communications Solutions

Part No. 10114831-10111LF
Description 1.25mm Wire-to-Board Connector System WAFER THROUGH HOLE RIGHT ANGLE, 11 POSITIONS, TIN PLATING
Tech specs    

Official Product Page

For 03-09-1011 Found Datasheets File :: 150+       Page :: | <1> | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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