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				Microsemi
Part No.	LX3046 LX3044/45/46
OCR Text	...of custom assembly using either bond wire or flip chip configurations. this device is ideal for manufacturers of optical receivers, transponders, optical transmission modules and combination pin photo diode ? transimpedance amplifier....
Description	GaAs PIN Photo Detectors
File Size	258.60K / 5 Page	View it Online	Download Datasheet

				MSI
Part No.	EMSBC
OCR Text	...ize that requires only one wire bond. the chip backside provides the other contact with eutectic or conductive requires only one wire bond. the chip backside provides the other contact with eutectic or conductive requires only one wire bond...
Description	THIN FILM EMSBC SERIES
File Size	42.02K / 1 Page	View it Online	Download Datasheet

				Motorola Mobility Holdings, Inc. Motorola, Inc. MOTOROLA[Motorola Inc] MOTOROLA[Motorola, Inc]
Part No.	MPX2200 MPX2200A MPX2200AP MPX2200AS MPX2200D MPX2200DP MPX2200GP MPX2200GS MPX2200GVP MPX2200GVS MPX2201DP MPX2201GP MPX2201
OCR Text	...l SILICONE GEL DIE COAT WIRE bond WIRE bond LEAD FRAME DIFFERENTIAL/GAUGE ELEMENT P2 DIE bond LEAD FRAME Figure 4. Cross-Sectional Diagrams (Not to Scale) Figure 4 illustrates an absolute sensing die (right) and the ...
Description	0 to 200 kPa (0 to 29 psi) 40 mV FULL SCALE SPAN (TYPICAL) 000千帕29 PSI）的全尺寸为40 mV跨度（典型） 0 to 200 kPa (0 to 29 psi) 40 mV FULL SCALE SPAN (TYPICAL) 000千帕9 PSI）的全尺寸为40 mV跨度（典型） (MPX2200 / MPX2201) 0 to 200 kPa (0 to 29 psi) 40 mV FULL SCALE SPAN (TYPICAL)
File Size	169.29K / 8 Page	View it Online	Download Datasheet

				Cree, Inc. CREE[Cree, Inc]
Part No.	CXXXXT420-SXX00-A C450XT420-SXX00-A
OCR Text	... and require only a single wire bond connection. These vertically structured LED chips are approximately 175 microns in height and require a low forward voltage. Cree's XTTM chips are tested for conformity to optical and electrical specific...
Description	XThinLEDs XThin? LEDs XThin㈢ LEDs
File Size	198.58K / 4 Page	View it Online	Download Datasheet

				CREE[Cree, Inc]
Part No.	CXXXXT290-SXX00-X C460XT290-SXX00-X C470XT290-SXX00-X
OCR Text	... and require only a single wire bond connection. These vertically structured LED chips are approximately 115 microns in height and require a low forward voltage. Cree's XTTM chips are tested for conformity to optical and electrical specific...
Description	XThin㈢ LEDs
File Size	223.36K / 6 Page	View it Online	Download Datasheet

				CREE[Cree, Inc]
Part No.	CXXXXT290-SXX00-A C460XT290-SXX00-A C470XT290-SXX00-A C505XT290-S0100-A
OCR Text	... and require only a single wire bond connection. These vertically structured LED chips are approximately 115 microns in height and require a low forward voltage. Cree's XTTM chips are tested for conformity to optical and electrical specific...
Description	XThin㈢ LEDs
File Size	221.29K / 6 Page	View it Online	Download Datasheet

				CREE[Cree, Inc]
Part No.	CXXXXR230-SXX00-X C460XR260-SXX00-X C470XR260-SXX00-X
OCR Text	... and require only a single wire bond connection. These vertically structured LED chips are approximately 150 microns in height and require a low forward voltage. Cree's XT Rectangular chips are tested for conformity to optical and electrica...
Description	XT Rectangular LEDs XT⑩ Rectangular LEDs
File Size	210.12K / 4 Page	View it Online	Download Datasheet

				CREE[Cree, Inc]
Part No.	CXXXXR230-SXX00-A C460XR260-SXX00-A C470XR260-SXX00-A
OCR Text	... and require only a single wire bond connection. These vertically structured LED chips are approximately 150 microns in height and require a low forward voltage. Cree's XT Rectangular chips are tested for conformity to optical and electrica...
Description	XT Rectangular LEDs XT⑩ Rectangular LEDs
File Size	218.34K / 4 Page	View it Online	Download Datasheet

				CREE[Cree, Inc]
Part No.	CXXXXB900-SX000-A C460XB900-S9000-A C470XB900-S9000-A C505XB900-S6000-A C527XB900-S4000-A
OCR Text	... and require only a single wire bond connection. These LEDs are useful in a broad range of applications such as outdoor full-motion LED video signs, automotive lighting and white LEDs. Cree's XB power chips are compatible with optical power...
Description	XBright㈢ Power Chip LED
File Size	221.72K / 4 Page	View it Online	Download Datasheet

				MOTOROLA[Motorola, Inc]
Part No.	MPX5100 MPX5100A MPX5100AP MPX5100D MPX5100DP MPX5100GP MPX5100GSX MPXV5100GC7U MPXV5100 MPXV5100GC6U
OCR Text	...UORO SILICONE GEL DIE COAT WIRE bond STAINLESS STEEL METAL COVER FLUORO SILICONE GEL DIE COAT STAINLESS STEEL METAL COVER EPOXY PLASTIC CASE DIE DIE EPOXY PLASTIC WIRE bond CASE LEAD FRAME DIFFERENTIAL/GAUGE ELEMENT DIE bond ...
Description	MPX5100 Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated
File Size	394.62K / 12 Page	View it Online	Download Datasheet

For bond Found Datasheets File :: 7528 Search Time::1.25ms
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