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Mitsubishi Electric Corporation
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Part No. |
MH8D64AKQC-75 MH8D64AKQC-10
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OCR Text |
388,608-word by 64-bit) double data rate synchronous dram module mit-ds-0419-0.1 17 .may.2001 preliminary spec. some contents are subject to change without notice. mitsubishi lsis mitsubishi electric 1 description application main memory... |
Description |
536,870,912-BIT (8,388,608-WORD BY 64-BIT) Double Data Rate Synchronous DRAM Module
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File Size |
375.96K /
40 Page |
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Mini-Systems, Inc.
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Part No. |
IT8875F
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OCR Text |
....a. ite (usa) inc. phone: (512) 388-7880 eastern u.s.a. sales office fax: (512) 388-3108 896 summit st., #105 round rock, tx 78664 u.s.a. if you have any marketing or sales questions, please contact: lawrence liu, at ite taiwan: e-mail: l... |
Description |
PCI Parallel Port Controller|Specification 并行端口的PCI控制器|规格
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File Size |
659.13K /
66 Page |
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Renesas
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Part No. |
M6MGE13VW66CWG
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OCR Text |
...48a_bezb 1 134,217,728 - bit (8,388,608 - word by 16 - bit) cmos flash memory & 67,108,864 - bit (4,194,304 - word by 16 - bit) cmos mobile ram stacked - csp ( chip scale package) the m6mge13vw66cwg is a stacked chip scale package (s - ... |
Description |
Memory>MCP(Multi Chip Package)>S-CSP(Stacked CSP)
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File Size |
46.38K /
3 Page |
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Renesas
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Part No. |
M6MGE13VW34DWG
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OCR Text |
...48a_bezc 1 134,217,728 - bit (8,388,608 - word by 16 - bit) cmos flash memory & 33,554,432 - bit (2,097,152 - word by 16 - bit) cmos mobile ram stacked - csp ( chip scale package) the m6mge13vw34dwg is a stacked chip scale package (s - ... |
Description |
Memory>MCP(Multi Chip Package)>S-CSP(Stacked CSP)
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File Size |
46.37K /
3 Page |
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Renesas
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Part No. |
M6MGD13VW66CWG
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OCR Text |
...48a_bezb 1 134,217,728 - bit (8,388,608 - word by 16 - bit) cmos flash memory & 67,108,864 - bit (4,194,304 - word by 16 - bit) cmos mobile ram stacked - csp ( chip scale package) the m6mgd13vw66cwg is a stacked chip scale package (s - ... |
Description |
Memory>MCP(Multi Chip Package)>S-CSP(Stacked CSP)
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File Size |
46.50K /
3 Page |
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it Online |
Download Datasheet
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Renesas
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Part No. |
M6MGD13VW34DWG
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OCR Text |
388,608 - word by 16 - bit) cmos flash memory & 33,554,432 - bit (2,097,152 - word by 16 - bit) cmos mobile ram stacked - csp ( chip scale package) preliminary notice: this is not a final specification. some parametric limits are subject... |
Description |
Memory>MCP(Multi Chip Package)>S-CSP(Stacked CSP)
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File Size |
46.11K /
3 Page |
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Renesas
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Part No. |
M6MGD13TW66CWG
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OCR Text |
...48a_bezb 1 134,217,728 - bit (8,388,608 - word by 16 - bit) cmos flash memory & 67,108,864 - bit (4,194,304 - word by 16 - bit) cmos mobile ram stacked - csp ( chip scale package) the m6mgd13tw66cwg is a stacked chip scale package (s - ... |
Description |
Memory>MCP(Multi Chip Package)>S-CSP(Stacked CSP)
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File Size |
120.19K /
3 Page |
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Renesas
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Part No. |
M6MGB64BS8BWG M6MGT64BS8BWG
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OCR Text |
388,608 - bit (524,288 - word by 16 - bit) cmos sram stacked - csp (chip scale package) rev.0.1.48a_bebz 1 preliminary notice: this is not a final specification. some parametric limits are subject to change. pin configuration (top view) t... |
Description |
Memory>MCP(Multi Chip Package)>S-CSP(Stacked CSP)
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File Size |
44.56K /
3 Page |
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Panasonic, Corp. PANASONIC CORP
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Part No. |
AQW212EHAZ AQW212EHAX AQW216EHA
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OCR Text |
...m inch 3.2 .126 6.4 .252 9.86 .388 2.9 .114 6.4 .252 9.86 .388 1 2 3 4 8 7 6 5 features 1. reinforced insulation 5,000 v type more than 0.4 mm internal insulation distance between inputs and outputs. con-forms to en41003, en60950 (reinf... |
Description |
DUAL TRANSISTOR OUTPUT SOLID STATE RELAY, 5000 V ISOLATION-MAX 0.388 X 0.252 INCH, 0.126 INCH HEIGHT, SMD, DIP-8 Solid State Relay (with MOSFET Output) 8pin DIP (Form A, Normally-Open) DUAL TRANSISTOR OUTPUT SOLID STATE RELAY, 5000 V ISOLATION-MAX DUAL TRANSISTOR OUTPUT SOLID STATE RELAY, 5000 V ISOLATION-MAX 0.388 X 0.252 INCH, 0.126 INCH HEIGHT, DIP-8
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File Size |
162.92K /
4 Page |
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