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    5082-0012

Broadcom Corporation.
Part No. 5082-0012
OCR Text ...3. die attach a. eutectic ausn preform with stage temperature of 310c for one minute max. auge preform with stage tempera- ture of 390c for one minute max. b. epoxy for epoxy die-attach, conductive silver-fi lled or goldfi lled epoxi...
Description    PIN Diode Chip for Hybrid MIC Switches/Attenuators
File Size 61.36K  /  2 Page

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