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  71308-6418 Datasheet PDF File

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    015-91-2360 71308-0036

Molex Electronics Ltd.
Part No. 015-91-2360 71308-0036
Description 2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 36 Circuits, Tin (Sn) Plating, without PCB Locator Pegs
File Size 1,475.87K  /  8 Page

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Amphenol Communications Solutions
Part No. 131-6418-11H
Description Paladin® 112Gb/s Backplane Connector, 6-Pair, 8 Column, Right End Wall, Backplane Module, 1.5mm Wipe, APP.
Tech specs 　 　

Official Product Page

HUA FENG CIRCUIT





    015-91-1182 71308-4118N

Molex Electronics Ltd.
Part No. 015-91-1182 71308-4118N
Description 2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 18 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, with 3.30mm (.130) PCB Locator Pegs
File Size 1,475.70K  /  8 Page

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Amphenol Communications Solutions
Part No. 68016-418HLF
Description BergStik®, Board to Board connector, Unshrouded Right Angle Header, Through Hole, Single Row, 18 Positions, 2.54 mm (0.100) Pitch.
Tech specs 　 　

Official Product Page

    015-91-1802 71308-4180N

Molex Electronics Ltd.
Part No. 015-91-1802 71308-4180N
Description 2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 80 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, with 3.30mm (.130) PCB Locator Pegs
File Size 1,475.70K  /  8 Page

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Amphenol Communications Solutions
Part No. 87606-418LF
Description Dubox®, Board To Board Connector, Receptacle, Vertical, Through Hole, Double Row, Top Entry, 36 Positions, 2.54mm (0.100in) Pitch
Tech specs 　 　

Official Product Page

    71308-4230N 015-91-1303

Molex Electronics Ltd.
Part No. 71308-4230N 015-91-1303
Description 2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 30 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, with 3.30mm (.130) PCB Locator Pegs
File Size 1,475.63K  /  8 Page

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Amphenol Communications Solutions
Part No. 68466-418HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 18 Positions, 2.54 mm Pitch, Vertical, 17.7 mm (0.697 in.) Mating, 3.25 mm (0.128 in.) Tail
Tech specs 　 　

Official Product Page

    015-91-1402 A-71308-4140N

Molex Electronics Ltd.
Part No. 015-91-1402 A-71308-4140N
Description 2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 40 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
File Size 1,475.70K  /  8 Page

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Amphenol Communications Solutions
Part No. 131-6418-11D
Description Paladin® 112Gb/s Backplane Connector, 6-Pair, 8 Column, Right End Wall, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
Tech specs 　 　

Official Product Page

    015-91-1462 71308-4146N

Molex Electronics Ltd.
Part No. 015-91-1462 71308-4146N
Description 2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 46 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, with 3.30mm (.130) PCB Locator Pegs
File Size 1,475.71K  /  8 Page

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Amphenol Communications Solutions
Part No. 91276-418HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Header, Through Hole, Single Row, 18 Positions, 2.54mm Pitch, Vertical, 22.86mm (0.9in) Mating, 5.72mm (0.225in) Tail.
Tech specs 　 　

Official Product Page

    015-91-3080 71308-0208N

Molex Electronics Ltd.
Part No. 015-91-3080 71308-0208N
Description 2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 8 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, without PCB Locator Pegs
File Size 1,475.97K  /  8 Page

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Amphenol Communications Solutions
Part No. 67996-418HLF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 18 Positions, 2.54 mm (0.100in) Pitch
Tech specs 　 　

Official Product Page

    015-91-1262 A-71308-4126N

Molex Electronics Ltd.
Part No. 015-91-1262 A-71308-4126N
Description 2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 26 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, with 3.30mm (.130) PCB Locator Pegs
File Size 1,475.71K  /  8 Page

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Amphenol Communications Solutions
Part No. 52601-S26-418RLF
Description Quickie® IDC Cable-to-Board Connector System, Shrouded Vertical Header, Through Hole, Low Profile, Double Row, 25 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    015-91-3300 A-71308-0230N

Molex Electronics Ltd.
Part No. 015-91-3300 A-71308-0230N
Description 2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 30 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, without PCB Locator Pegs
File Size 1,475.96K  /  8 Page

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Amphenol Communications Solutions
Part No. 146-4182-12D
Description Paladin HD, RAF, 4 Pair, 8 Column, NiS
Tech specs 　 　

Official Product Page

    015-91-1141 71308-4014N

Molex Electronics Ltd.
Part No. 015-91-1141 71308-4014N
Description 2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 14 Circuits, Tin (Sn) Plating, with 3.30mm (.130) PCB Locator Pegs
File Size 1,475.68K  /  8 Page

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Amphenol Communications Solutions
Part No. 87916-418HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Header, Through Hole, Single Row, 18 Positions, 2.54mm Pitch, Vertical, 21.08mm (0.83in) Mating, 3.25mm (0.128in) Tail.
Tech specs 　 　

Official Product Page

For 71308-6418 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | <5> | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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