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For bond Found Datasheets File :: 8863 Search Time::3.922ms
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				Mini-Circuits
Part No.	PHA-101-D PHA-101-DF PHA-101-DG PHA-101-DP
OCR Text	...width, m 1060 die length, m 800 bond pad size, m 75 x 150 fig 3. bonding pad positions bonding pad position (dimensions in m, typical) fig 2. die layout fig 1 . block diagram of test circuit used for characterization. die packaged in sot-8...
Description	Monolithic Amplifier Die
File Size	208.07K / 6 Page	View it Online	Download Datasheet

				Mini-Circuits
Part No.	PHA-1-D PHA-1-DF PHA-1-DG PHA-1-DP
OCR Text	... width, m 560 die length, m 720 bond pad size, m 80 x 80 large ground bond pad size, m 80 x 240 fig 3. bonding pad positions bonding pad position (dimensions in m, typical) rf-in rf-out vcc (supply v oltage) blk-18+ bias-t ee zx85-12g-s+ +...
Description	Monolithic Amplifier Die
File Size	242.15K / 6 Page	View it Online	Download Datasheet

				Mini-Circuits
Part No.	GALI-39-D
OCR Text	...nsions in m, typical note: 1. bond pad material - gold 2. bottom of die - gold plated monolithic amplifer die +rohs compliant the +suffix identifies rohs compliance. see our web site for rohs compliance methodologies and qualificat...
Description	Monolithic Amplifier Die
File Size	236.62K / 5 Page	View it Online	Download Datasheet

				Micross Components
Part No.	HMC424
OCR Text	...nches (millimeters). 2. typical bond pad is .004 square. 3. typical bond pad spacing is .006 center to center except as noted. 4. backside metalization: gold 5. backside metal is ground 6. bond pad metalization: gold pad number function...
Description	Space Applications
File Size	891.10K / 9 Page	View it Online	Download Datasheet

				FILTRONIC[Filtronic Compound Semiconductors]
Part No.	LMA110B LMA110
OCR Text	... Notes: 1.) Recommended lead bond technique is thermocompression wedge bonding with 0.001" (25m) diameter wire. The bond tool force shall be 35-38 gram. bonding stage temperature shall be 230-240C, heated tool (150-160C) is recommended. ...
Description	.5-8GHz MESFET Amplifier
File Size	105.87K / 4 Page	View it Online	Download Datasheet

				FILTRONIC[Filtronic Compound Semiconductors]
Part No.	LMA110 LMA110A
OCR Text	... Notes: 1.) Recommended lead bond technique is thermocompression wedge bonding with 0.001" (25m) diameter wire. The bond tool force shall be 35-38 gram. bonding stage temperature shall be 230-240C, heated tool (150-160C) is recommended. ...
Description	.5-6 GHz MESFET Amplifier
File Size	80.46K / 3 Page	View it Online	Download Datasheet

				Mini-Circuits
Part No.	EP2K-D EP2K-DF EP2K-DG EP2K-DP
OCR Text	...idth, m 2650 die length, m 1880 bond pad size, m 150 x 150 bonding pad position (dimensions in m, typical) fig 2. die layout fig 3. bonding pad positions assembly diagram assembly and handling procedure 1. storage dice should be stored...
Description	Power Splitter/Combiner Die
File Size	165.15K / 4 Page	View it Online	Download Datasheet

				Transcom, Inc.
Part No.	TC1706
OCR Text	...o assure consistent quality. bond pads are gold plated for either thermo-compression or thermo-sonic wire bonding. backside gold plating is compatible with standard ausn die-attach. typical applications include commercial and military ...
Description	3 W High Linearity and High Efficiency GaAs Power FETs
File Size	130.81K / 4 Page	View it Online	Download Datasheet

				Tyco Electronics
Part No.	MAAP-000064-SMB004
OCR Text	...ze (mils) 4 x 8 8 x 6 6 x 6 bond pad dimensions figure 3. die layout amplifier, power, 2.0 w 6.5?9.5 ghz m/a-com inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein wit...
Description	Variable Drain Voltage (4-10V) Operation
File Size	216.03K / 5 Page	View it Online	Download Datasheet

				Micross Components
Part No.	HMC341
OCR Text	...e thickness is .004 3. typical bond is .004 square 4. backside metallization: gold 5. bond pad metallization: gold 6. backside metal is ground. 7. connection not required for unlabeled bond pads. drain bias voltage (vdd) +5.5 vdc rf ...
Description	Millimeterwave Point-to-Point Radios
File Size	879.90K / 9 Page	View it Online	Download Datasheet

For bond Found Datasheets File :: 8863 Search Time::3.922ms
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