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  71308-6418 Datasheet PDF File

For 71308-6418 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | <4> | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    71308-0180N

Molex Electronics Ltd.
Part No. 71308-0180N
Description 2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 80 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

File Size 1,475.61K  /  8 Page

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Amphenol Communications Solutions

Part No. 131-6418-11H
Description Paladin® 112Gb/s Backplane Connector, 6-Pair, 8 Column, Right End Wall, Backplane Module, 1.5mm Wipe, APP.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    71308-0018N

Molex Electronics Ltd.
Part No. 71308-0018N
Description 2.54mm Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 18 Circuits, Tin (Sn) Plating, without PCB Locator Pegs

File Size 27.04K  /  2 Page

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Amphenol Communications Solutions

Part No. 68016-418HLF
Description BergStik®, Board to Board connector, Unshrouded Right Angle Header, Through Hole, Single Row, 18 Positions, 2.54 mm (0.100) Pitch.
Tech specs    

Official Product Page

    71308-0024N

Molex Electronics Ltd.
Part No. 71308-0024N
Description 2.54mm Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 24 Circuits, Tin (Sn) Plating, without PCB Locator Pegs

File Size 27.04K  /  2 Page

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Amphenol Communications Solutions

Part No. 87606-418LF
Description Dubox®, Board To Board Connector, Receptacle, Vertical, Through Hole, Double Row, Top Entry, 36 Positions, 2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

    71308-0028N

Molex Electronics Ltd.
Part No. 71308-0028N
Description 2.54mm Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 28 Circuits, Tin (Sn) Plating, without PCB Locator Pegs

File Size 27.04K  /  2 Page

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Amphenol Communications Solutions

Part No. 68466-418HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 18 Positions, 2.54 mm Pitch, Vertical, 17.7 mm (0.697 in.) Mating, 3.25 mm (0.128 in.) Tail
Tech specs    

Official Product Page

    71308-0030N

Molex Electronics Ltd.
Part No. 71308-0030N
Description 2.54mm Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 30 Circuits, Tin (Sn) Plating, without PCB Locator Pegs

File Size 27.03K  /  2 Page

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Amphenol Communications Solutions

Part No. 131-6418-11D
Description Paladin® 112Gb/s Backplane Connector, 6-Pair, 8 Column, Right End Wall, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

    71308-0026N

Molex Electronics Ltd.
Part No. 71308-0026N
Description 2.54mm Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 26 Circuits, Tin (Sn) Plating, without PCB Locator Pegs

File Size 27.04K  /  2 Page

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Amphenol Communications Solutions

Part No. 91276-418HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Header, Through Hole, Single Row, 18 Positions, 2.54mm Pitch, Vertical, 22.86mm (0.9in) Mating, 5.72mm (0.225in) Tail.
Tech specs    

Official Product Page

    71308-0034N

Molex Electronics Ltd.
Part No. 71308-0034N
Description 2.54mm Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 34 Circuits, Tin (Sn) Plating, without PCB Locator Pegs

File Size 27.04K  /  2 Page

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Amphenol Communications Solutions

Part No. 67996-418HLF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 18 Positions, 2.54 mm (0.100in) Pitch
Tech specs    

Official Product Page

    LM64183P LM64183

Sharp Electrionic Component...
Sharp Electrionic Components
Part No. LM64183P LM64183
Description Large Size Graphic Type LCD Module

File Size 58.99K  /  1 Page

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Amphenol Communications Solutions

Part No. 52601-S26-418RLF
Description Quickie® IDC Cable-to-Board Connector System, Shrouded Vertical Header, Through Hole, Low Profile, Double Row, 25 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    Hitachi
Part No. HD64180S
Description Network Processing Unit

File Size 638.38K  /  12 Page

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Amphenol Communications Solutions

Part No. 146-4182-12D
Description Paladin HD, RAF, 4 Pair, 8 Column, NiS
Tech specs    

Official Product Page

    71308-4252 015-91-1523

Molex Electronics Ltd.
Part No. 71308-4252 015-91-1523
Description 2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 52 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, with 3.30mm (.130) PCB Locator Pegs

File Size 1,475.64K  /  8 Page

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Amphenol Communications Solutions

Part No. 87916-418HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Header, Through Hole, Single Row, 18 Positions, 2.54mm Pitch, Vertical, 21.08mm (0.83in) Mating, 3.25mm (0.128in) Tail.
Tech specs    

Official Product Page

For 71308-6418 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | <4> | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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