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  stacked-chip Datasheet PDF File

For stacked-chip Found Datasheets File :: 1321    Search Time::1.125ms    
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    AMIC Technology Corporation
AMIC Technology, Corp.
Part No. A82DL16X4T A82DL1634 A82DL1644 A82DL1624 A82DL1624TG-70IF A82DL1624TG-70U A82DL1624TG-70F A82DL1624UG-70U A82DL1624UG-70UF A82DL1624TG-70UF A82DL1634UG-70U A82DL1634UG-70UF A82DL1634TG-70U A82DL1634TG-70UF A82DL1644UG-70F A82DL1644TG-70U A82DL1644TG-70UF A82DL1644UG-70IF A82DL1644UG-70UF A82DL1624UG-70IF A82DL1634UG-70IF A82DL1624UG-70F A82DL1634TG-70I A82DL1634TG-70F A82DL1634TG-70IF A82DL1644TG-70IF
OCR Text stacked multi-chip package (mcp ) flash memory and sram, a82dl16x4t(u) 16 mega bit (2mx8 bit/1mx16 bit) cmos 3.3 volt-only, simultaneous operation flash memory and 4m (256kx16 bit) static ram preliminary pr...
Description Toggle Switch; Circuitry:DPDT; Switch Operation:On-Off-On; Contact Current Max:6A; Actuator Style:Locking Lever; Switch Terminals:Solder Lug; Current Rating:6A; Mounting Type:PCB; Switch Features:Locking Lever Actuator RoHS Compliant: Yes
Toggle Switch; Circuitry:SPDT; Switch Operation:On-Off-(On); Contact Current Max:6A; Actuator Style:Bat; Switch Terminals:Solder Lug; Current Rating:6A; Mounting Type:PCB; Switch Features:Bat Actuator; No. of Switch Positions:3 RoHS Compliant: Yes
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL16x4T(U) 16 Megabit (2Mx8 Bit/1Simultaneous Operation Flash Memory and 4M (256Kx16 Bit) S 堆叠式多芯片封装(MCP)闪存和SRAM,A82DL16x4T(ü)16兆位Mx8 Bit/1Simultaneous行动闪存M56Kx16位)新币
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL16x4T(U) 16 Megabit (2Mx8 Bit/1Simultaneous Operation Flash Memory and 4M (256Kx16 Bit) S 堆叠式多芯片封装(MCP)闪存和SRAMA82DL16x4T(ü)16兆位Mx8 Bit/1Simultaneous行动闪存M56Kx16位)新币

File Size 905.22K  /  57 Page

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    AMIC Technology Corporation
AMIC Technology, Corp.
Part No. A82DL1642 A82DL16X2T A82DL1622 A82DL1632 A82DL1632UG-70 A82DL1632UG-70F A82DL1632UG-70I A82DL1632UG-70U A82DL1622UG-70F A82DL1622UG-70I A82DL1622UG-70IF A82DL1622UG-70U A82DL1622UG-70UF A82DL1632UG-70IF A82DL1622TG-70IF A82DL1622TG-70U A82DL1622TG-70UF A82DL1622TG-70F A82DL1642TG-70IF A82DL1642TG-70U A82DL1642TG-70UF A82DL1632UG-70UF A82DL1632TG-70U A82DL1632TG-70UF A82DL1642UG-70UF A82DL1642UG-70I A82DL1642UG-70IF A82DL1642UG-70F
OCR Text stacked multi-chip package (mcp ) flash memory and sram, a82dl16x2t(u) 16 mega bit (2mx8 bit/1mx16 bit) cmos 3.3 volt-only, simultaneous operation flash memory and 2m (128kx16 bit) static ram preliminary pr...
Description Reed Switch; Pull-In Amp Turns Max:25; Pull-In Amp Turns Min:16; Circuitry:SPST-NO; Switching Current Max:1A; Switching Voltage Max:200VDC; Mounting Type:PCB; Body Length:13.5mm; Breakdown Voltage Min:250VDC
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL16x2T(U) 16 Megabit (2Mx8 Bit/1Mx16 Bit) CMOS 3.3 Volt-only, Simultaneous Operation Flash 堆叠式多芯片封装(MCP)闪存和SRAM,A82DL16x2T(ü)16兆位Mx8 Bit/1Mx16位)的CMOS 3.3伏只,同时闪电行

File Size 891.89K  /  57 Page

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    S70WS512N00BAWA20 S70WS512N00BAWAA3 S70WS512N00BFWA22 S70WS512N00BFWA23 S70WS512N00BFWAA3 S70WS512N00BFWAB2 S70WS512N00B

SPANSION[SPANSION]
Part No. S70WS512N00BAWA20 S70WS512N00BAWAA3 S70WS512N00BFWA22 S70WS512N00BFWA23 S70WS512N00BFWAA3 S70WS512N00BFWAB2 S70WS512N00BFWA30 S70WS512N00BFWA32 S70WS512N00BFWA33 S70WS512N00BAWAB0 S70WS512N00BAWAB2 S70WS512N00BAWAB3 S70WS512N00BAWA30 S70WS512N00BAWA32 S70WS512N00BAWA33 S70WS512N00BFWAB3 S70WS512N00 S70WS512N00BAWA22 S70WS512N00BAWA23 S70WS512N00BAWAA0 S70WS512N00BAWAA2 S70WS512N00BFWA20 S70WS512N00BFWAA0 S70WS512N00BFWAA2 S70WS512N00BFWAB0
OCR Text ...t-mode Flash Memory Same-Die Stacked Multi-Chip Product (MCP) ADVANCE INFORMATION Data Sheet Notice to Readers: This document states the current technical specifications regarding the Spansion product(s) described herein. Each p...
Description Same-Die Stacked Multi-Chip Product (MCP) 512 Megabit (32M x 16 bit) CMOS 1.8 Volt-only Simultaneous Read/Write, Burst-mode Flash Memory

File Size 877.02K  /  93 Page

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    M6MGD13TW66CWG-P

Renesas Electronics, Corp.
Renesas Electronics Corporation
Part No. M6MGD13TW66CWG-P
OCR Text ...WORD BY 16-BIT) CMOS MOBILE RAM Stacked-CSP ( Chip Scale Package) Description The M6MGD13TW66CWG-P is a Stacked Chip Scale Package (S-CSP) that contents 128M-bit Flash memory and 64M-bit Mobile RAM in a 72-pin Stacked CSP with leaded so...
Description 134,217,728-BIT (8,388,608-WORD BY 16-BIT) CMOS FLASH MEMORY & 67,108,864-BIT (4,194,304-WORD BY 16-BIT) CMOS MOBILE RAM 134217728位(8388608字由16位)的CMOS闪存
134,217,728-BIT (8,388,608-WORD BY 16-BIT) CMOS FLASH MEMORY & 67,108,864-BIT (4,194,304-WORD BY 16-BIT) CMOS MOBILE RAM
Memory>MCP(Multi Chip Package)>S-CSP(Stacked CSP)

File Size 119.78K  /  3 Page

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    M36W416TG 9175 M36W416TGZA M36W416BG70ZA1T M36W416BG70ZA6T M36W416BG85ZA1T M36W416BG85ZA6T M36W416BGZA M36W416TG70ZA1T M

STMICROELECTRONICS[STMicroelectronics]
Part No. M36W416TG 9175 M36W416TGZA M36W416BG70ZA1T M36W416BG70ZA6T M36W416BG85ZA1T M36W416BG85ZA6T M36W416BGZA M36W416TG70ZA1T M36W416TG70ZA6T M36W416TG85ZA1T M36W416TG85ZA6T M36W416TG-ZAT
OCR Text ...m location) - Main Blocks s Stacked LFBGA66 (ZA) 12 x 8mm PROGRAMMING TIME - 10s typical - Double Word Programming Option s BLO...Chip Enable (EF). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...
Description From old datasheet system
16 Mbit 1Mb x16, Boot Block Flash Memory and 4Mbit 256Kb x16 SRAM, Multiple Memory Product

File Size 432.32K  /  62 Page

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    ST Microelectronics
Part No. M36W216BI70ZA1T M36W216TI70ZA1T M36W216TI85ZA1T M36W216TI-ZAT M36W216TIZA M36W216BIZA M36W216BI85ZA1T
OCR Text ...m location) - Main Blocks s Stacked LFBGA66 (ZA) 12 x 8mm PROGRAMMING TIME - 10s typical - Double Word Programming Option s BLO...Chip Enable (EF). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...
Description 16 Mbit 1Mb x16, Boot Block Flash Memory and 2 Mbit 128Kb x16 SRAM, Multiple Memory Product
16 MBIT (1MB X16, BOOT BLOCK) FLASH MEMORY AND 2 MBIT (128K X16) SRAM, MULTIPLE MEMORY PRODUCT
16 Mbit 1Mb x16 / Boot Block Flash Memory and 2 Mbit 128Kb x16 SRAM / Multiple Memory Product

File Size 436.68K  /  62 Page

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    STN8815

意法半导
ST Microelectronics, Inc.
STMicroelectronics
Part No. STN8815
OCR Text ...ary scan 14 x 14 mm package for stacked and package-on-package versions Pin-to-pin compatible with STn8810 a. 1-Wire is...chip implementation schemes. It will enable smart phones, wireless PDAs, internet appliances and car...
Description Nomadik mobile multimedia application processor
From old datasheet system

File Size 173.24K  /  8 Page

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    Atmel Corp
Part No. AT52BR3224
OCR Text ...M (organized as 256K x 16) in a stacked 66-ball CBGA package. The AT52BR3228(T) combines a 32-megabit Flash (2M x 16) and an 8-megabit SRAM ...Chip Erase command or individual sectors can be erased by using the Sector Erase command. CHIP ERASE...
Description 32M bit single plane Flash combined with a 4M bit or 8M bit SRAM
From old datasheet system

File Size 326.60K  /  46 Page

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    M36W0R6050B1 M36W0R6050B1ZAQE M36W0R6050B1ZAQF M36W0R6050T1 M36W0R6050T1ZAQE M36W0R6050T1ZAQF

Numonyx B.V
Part No. M36W0R6050B1 M36W0R6050B1ZAQE M36W0R6050B1ZAQF M36W0R6050T1 M36W0R6050T1ZAQE M36W0R6050T1ZAQF
OCR Text ...e - ECOPACK(R) FBGA Stacked TFBGA88 (ZA) Block locking - All blocks locked at Power-up - Any combination of blocks ca...Chip Enable (EF) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Fla...
Description 64 Mbit (4 Mb ×16, Multiple Bank, Burst) Flash memory and 32 Mbit (2 Mb ×16) PSRAM, multi-chip package

File Size 396.12K  /  22 Page

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    Intel
Part No. RD38F1010C0ZBL0 RD38F1020C0ZBL0
OCR Text stacked-chip scale package family datasheet product features the 3 volt intel ? advanced+ boot block flash memory (c3) stacked-chip scale package (stacked-csp) device delivers a feature-rich solution for low-power...
Description 32-Mbit, 3 Volt advanced boot block fflash memory (C3) stacked-chip scale package family, 70ns

File Size 734.44K  /  70 Page

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For stacked-chip Found Datasheets File :: 1321    Search Time::1.125ms    
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