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Renesas
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Part No. |
M6MGB321S4TP M6MGT321S4TP
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OCR Text |
...24,288-WORD BY 8-BIT) CMOS SRAM Stacked - MCP (micro Multi Chip Package)
Description
M6MGB/T321S4TP provides for Software Lock Release function. Usually, all memory blocks are locked and can not be programmed or erased, when F-WP# is l... |
Description |
CMOS SRAM
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File Size |
90.10K /
3 Page |
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RENESA
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Part No. |
M6MGD967W3
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OCR Text |
...RD BY 16-BIT) CMOS Mobile RAM & Stacked- MCP (micro Multi Chip Package)
DESCRIPTION
The M6MGD967W33ATP is a Stacked micro Multi Chip Package (S- MCP) that contents 96M-bit Flash memory and 32M-bit Mobile RAM in a 52-pin TSOP. 96M-bit Fl... |
Description |
100,663,296-BIT (6,291,456-WORD BY 16-BIT) CMOS FLASH MEMORY &33,554,432-BIT (2,097,152-WORD BY 16-BIT) CMOS Mobile RAM
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File Size |
52.26K /
3 Page |
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Renesas
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Part No. |
M6MGD137W34DKT
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OCR Text |
...rd by 16 - bit) cmos mobileram stacked - m mcp (micro multi chip package) rev.1.0.48a_bezc 1 preliminary notice: this is not a final specification. some parametric limits are subject to change. pin configuration (top view) the m6mgd137w3... |
Description |
Memory>MCP(Multi Chip Package)>S-µMCP(Stacked micro MCP)
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File Size |
115.69K /
3 Page |
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Samsung
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Part No. |
K9HAG08U1M
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OCR Text |
...8U1M-YCB0/YIB0 : Two K9L8G08U0M stacked 48 - Pin TSOP I (12 x 20 / 0.5 mm pitch) - K9HAG08U1M-PCB0/PIB0 : Pb-FREE PACKAGE 48 - Pin TSOP I (1...chip write controller automates all program and erase functions including pulse repetition, where re... |
Description |
Flash Memory
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File Size |
836.10K /
44 Page |
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Samsung Electronics
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Part No. |
K9HBG08U1M K9MCG08U5M K9LAG08U0M
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OCR Text |
...0/PIB0 : Two K9HBG08U0M package stacked 48 - Pin TSOP I (12 x 20 / 0.5 mm pitch) : Pb-FREE PACKAGE
GENERAL DESCRIPTION
Offered in 2Gx8bi...chip write controller automates all program and erase functions including pulse repetition, where re... |
Description |
Flash Memory
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File Size |
995.63K /
45 Page |
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it Online |
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ST Microelectronics
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Part No. |
M36W432-ZAT M36W432BZA M36W432T85ZA1T M36W432T85ZA6T
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OCR Text |
... inputs figure 1. packages fbga stacked lfbga66 (za) 8 x 8 ball array
m36w432t, m36w432b 2/57 table of contents summarydescription...........chip enable controlled ...........................28 table 17. flash write ac characteristics, chip ... |
Description |
32 Mbit 2Mb x16, Boot Block Flash Memory and 4 Mbit 256K x16 SRAM, Multiple Memory Product 32 MBIT (2MB X16, BOOT BLOCK) FLASH MEMORY AND 4 MBIT (256K X16) SRAM, MULTIPLE MEMORY PRODUCT
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File Size |
420.62K /
57 Page |
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http:// STMicroelectronics N.V. 意法半导
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Part No. |
M36W216TI-ZAT M36W216BIZA M36W216TIZA M36W216TI70ZA1T M36W216BI70ZA1T -M36W216BI85ZA1T
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OCR Text |
... inputs figure 1. packages fbga stacked lfbga66 (za) 12 x 8mm
m36w216ti, m36w216bi 2/62 table of contents summary description . . . . . . ...chip enable (ef). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .... |
Description |
16 Mbit 1Mb x16, Boot Block Flash Memory and 2 Mbit 128Kb x16 SRAM, Multiple Memory Product 16兆x16插槽,开机区块快闪记忆体兆位128KB的x16的SRAM,多个存储产 16 Mbit 1Mb x16, Boot Block Flash Memory and 2 Mbit 128Kb x16 SRAM, Multiple Memory Product 16兆x16插槽,开机区块快闪记忆体2兆位128KB的x16的SRAM,多个存储产 PV76L14-18P
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File Size |
443.55K /
62 Page |
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it Online |
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Price and Availability
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