1. 2. 3. material content data sheet sales product name bfr 92w h6327 issued 29. august 2013 ma# MA000787812 package pg-sot323-3-1 weight* 5.96 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip noble metal gold 7440-57-5 0.002 0.03 348 non noble metal tin 7440-31-5 0.001 0.01 90 inorganic material silicon 7440-21-3 0.015 0.26 0.30 2577 3015 leadframe inorganic material silicon 7440-21-3 0.001 0.01 88 non noble metal titanium 7440-32-6 0.003 0.04 441 non noble metal chromium 7440-47-3 0.008 0.13 1324 non noble metal copper 7440-50-8 2.617 43.95 44.13 439426 441279 wire noble metal gold 7440-57-5 0.008 0.13 0.13 1319 1319 encapsulation organic material carbon black 1333-86-4 0.032 0.53 5304 plastics epoxy resin - 0.679 11.40 114041 inorganic material silicondioxide 60676-86-0 2.448 41.11 53.04 411079 530424 leadfinish non noble metal tin 7440-31-5 0.133 2.23 2.23 22282 22282 plating noble metal silver 7440-22-4 0.010 0.17 0.17 1681 1681 *deviation < 10% sum in total: 100,00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. company infineon technologies ag address 81726 mnchen internet www.infineon.com
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