1. 2. 3. material content data sheet sales product name bf 2040r e6814 issued 29. august 2013 ma# MA000783604 package pg-sot143-4-6 weight* 11.17 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip inorganic material silicon 7440-21-3 0.025 0.22 0.22 2198 2198 leadframe non noble metal nickel 7440-02-0 1.673 14.98 149817 non noble metal iron 7439-89-6 2.310 20.69 35.67 206891 356708 wire noble metal gold 7440-57-5 0.017 0.15 0.15 1488 1488 encapsulation organic material carbon black 1333-86-4 0.104 0.93 9323 inorganic material antimonytrioxide 1309-64-4 0.156 1.40 13984 plastics brominated resin - 0.195 1.75 17481 plastics epoxy resin - 1.626 14.57 145671 inorganic material silicondioxide 60676-86-0 4.424 39.62 58.27 396227 582686 leadfinish non noble metal tin 7440-31-5 0.217 1.94 1.94 19401 19401 plating noble metal silver 7440-22-4 0.303 2.72 2.72 27167 27167 solder non noble metal tin 7440-31-5 0.024 0.21 2122 noble metal gold 7440-57-5 0.092 0.82 1.03 8230 10352 *deviation < 10% sum in total: 100,00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. company infineon technologies ag address 81726 mnchen internet www.infineon.com
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